Laird Performance Materials’ Tflex RB300 gap fillers provide the ultimate in an ultra-soft heat management solution. This product is targeted for applications where low thermal resistance is required for low-pressure applications. With the absence of an adhesive, the thermal performance of the part is optimized. This gap filler is naturally tacky for easy application.
Laird Connectivity BL5340 multi-core and multi protocol Bluetooth module. These modules adopt Nordic Semiconductor nRF5340 system on chip (SoC) and are equipped with dual core Arm Cortex-M33 microcontroller, which can support both wireless connection and terminal application.
Laird Connectivity's Summit SOM 8M Plus, a highly integrated hardware and software solution powered by a high performance NXP Semiconductors I.MMX 8M Plus processor. The toolkit supports the development of advanced wireless iot applications, including iot devices for harsh environments, iot vision solutions, and healthcare devices.
Laird Connectivity Sentrius™ MG100/BT510/BT610 Cumulocity is on sale today from ™ Mouser Electronics, a leading new product introduction (NPI) distributor focused on driving industry innovation IoT suite. The suite includes a number of mature wireless sensors and the ability to send data from these sensors to the cloud over a global low-power cellular network connection (LTE-M or NB-iot).
Mouser now supplies the new Sterling-LWB+ module from Laird Connectivity. Wi-fi-4 (802.11b/ G/N) and Bluetooth 5.2 low Power devices were created specifically for the next generation of iot products. These modules are powered by infineon AIROC CYW43439 chipset solutions to provide reliable and secure performance in IIoT Settings, Supporting a full industrial temperature range (-40 ° C to +85 ° C), the module is mechanically and pin compatible with the Sterling-LWB module, providing a simplified upgrade path to existing designs.
Mouser offers the new Laird Connectivity Mini NanoBlade Flex 6E Series internal antenna. Suitable for space-constrained iot applications.
