The Tflex RB300 gap packing from Laird Performance Materials provides the ultimate in ultra soft thermal management solutions. This product is suitable for low voltage applications requiring low thermal resistance. Without adhesive, the thermal performance of the component is optimized. This gap filler is inherently viscous and easy to apply.
Tflex RB300 Series
Thermal Gap Filler
Tflex RB300 is a very soft void filler with a thermal conductivity of 1.2 W/can. Tflex RB300 is a special formulation to reduce the amount of silica gel used Oil spillage in sensitive applications. Tflex RB300 will not sacrifice heat while meeting its star standard，Performance. The thermal conductivity is 1.2 W/mK, and low thermal resistance can be achieved under low voltage. The Tflex RB300 is naturally sticky and does not require an additional adhesive coating to inhibit thermal performance.
SPECIFICATIONS
