Infineon Technologies has introduced a simple backpack with automotive performance 2B EDT2, a flexible, retractable half-bridge power module. Another unique feature of this module is the plug-and-play approach, which simplifies module integration.
Infineon Technologies AG has launched its SECORA Pay payment solution based on the latest 40nm technology platform. The plug and play solution draws on extensive expertise in contactless payment technology and uses its SOLID FLASH chip platform. Offers components including new applets and custom value-added products standard payment cards (SECORA Payment S), as well as multi-application cards (SECORA Payment X) and off-the-shelf solutions
To meet the growing demand for high reliability memory, Infineon Technologies has announced the industry's first high-density RadTol NOR flash product that conforms to the MIL-PRF-38535 QML-V process (QML-V equivalent). The 256Mb and 512Mb RadTol NOR Flash non-volatile memory provides superior, low-pin number, single-chip solutions for applications including FPGA configuration, image storage, microcontroller data, and startup code storage. The device can be programmed in the system via FPGA or standalone programmer and is offered in the same 36-lead ceramic flat package
Infineon Technologies has launched the industry's first high-voltage MCU supporting USBPD 3.1. Ez-pd PMG1 (Power Delivery Microcontroller Gen1) is the company's first GENERATION USB PD MCU and supports higher Power capabilities as defined in the USB PD 3.1 specification. The series also integrates a market-proven USB PD stack to promote reliable performance and interoperability. Help consumers make their daily lives easier, safer and more environmentally friendly
Infineon Technologies and Panasonic Have signed an agreement to jointly develop and produce their second generation (Gen2) GaN technology, providing higher efficiency and power density levels. The equipment will provide ease of use and improved cost performance targeting high and low power SMPS applications, renewable energy, motor drive applications and more.
Infineon technologies has received Arm Platform Security Architecture (PSA) Level 2 certification for PSoC 64 MCU standard security devices. It is the first PSA level 1 processor of the Arm Cortex-M processor. Ideal for cloud-connected applications
Infineon has strengthened its commitment to developing quantum computing technology in Germany and Europe. In addition to previously established programs and partnerships, the chipmaker is involved in six further research projects that are part of the German federal government's economic stimulus plan for future quantum technology, which aims to overcome obstacles in the application of quantum technology
Infineon Technologies now offer an innovative CO2 sensor that may be employed to monitor indoor air quality and decrease energy costs. Suitable applications include ventilation, air conditioning systems, portable room air monitoring devices and smart speakers.
Infineon Technologies recently launched an intelligent door driver EiceDRIVER 2ED4820-EM with SPI interface
Infineon Technologies AG recently launched a plug and play security solution for v2x - sls37 v2x hardware security module (HSM). And obtained the common criteria EAL4 + certification, which is expected to become the mandatory certification of the European v2x system.
Space-grade FPGAs need reliable, high-density non-volatile memories that include their boot configurations. To address the increasing demand for high-reliability memories, Infineon Technologies has announced the industry’s first high-density RadTol NOR Flash memory products qualified to MIL-PRF-38535’s QML-V flow (QML-V Equivalent).
Infineon Technologies AG has extended its easy-to-design EiceDRIVER X3 Compact (1ED31xx) and the highly flexible EiceDRIVER X3 Enhanced Analog (1ED34xx) and Digital (1ED38xx) gate driver families.
Infineon Technologies has launched its next-generation 144Mb Quad Data Rate II+ (QDR-II+) SRAM that is certified to the DLA Qualified Manufacturers List Class V (QML-V).
Infineon Technologies AG has added the new CoolGaN IPS family of integrated power stage (IPS) products to its wide portfolio of WBG power devices. The initial IPS portfolio comprises half-bridge and single-channel products aimed at low-to-medium power applications, including chargers and adapters and SMPS.
Infineon Technologies widens its level-shift EiceDRIVER portfolio with a 1200V three-phase gate driver. It is founded on the company’s unique silicon-on-insulator (SOI) technology.
Infineon 1ED44175N01B 25V Low-Side Gate Drivers provide integrated OCP, fault reporting, and facilitate functionality.
The Infineon Technologies CIPOS is the newest generation of Intelligent Power Modules, providing very high power density for variable-speed motor drives in products such as range hoods, room air conditioning, washing machines, and industrial and commercial fans.
Infineon is manufacturing the latest integrated point of load (IPOL), a fully integrated voltage regulator that provides PMBUS, SVID and PVID capabilities to power Intel CPU POL rails, chipsets and ASICs / FPGAs.
