Tata Elxsi and Renesas Electronics are collaborating to set up a state-of-the-art design centre in Bangalore to develop targeted electric vehicle solutions. The two companies bring their deep domain expertise, intellectual property and assets to NEVIC, combined to provide reference designs and solution accelerators for key EV subsystems such as BMS and MCU. The goal is to provide a key driver for this market, starting in India and expanding globally to optimize development time and effort.
Amritsu has announced that the Network Master Pro 1040A now supports testing of the 400GBase-ZR standard optical module, facilitating low-cost data center interconnect (DCI). These upgrades support testing of the transition to 400GBASE-ZR circuits and the introduction of breakthrough interfaces that will help reduce data center construction and expansion costs. Due to the popularization of 5G services, remote working, online teaching and advances in digital transformation (DX), data centers are proliferating to meet social needs.
Vishay Intertechnology has expanded its IHLE family of low-form, high-current inductors to offer integrated electric field shielding to reduce EMI with new commercial and automotive grade equipment with housing sizes of 5mm x 5mm x 3.4mm for 2020, The device contains electric and B-fields associated with EMI, and the inductor can operate at high temperatures up to +155C. The device is ROHS compliant, halogen-free, Vishay Green.
Sailig now offers Siglent's SDG7000A series dual independent channel arbitrary waveform generators with up to 1GHz bandwidth, 5Gsa/s sampling, 14-bit vertical resolution, and 512Mpts storage depth. The pulse waveform can have low jitter pulses with a minimum width of 1ns and a minimum edge of 500ps. The rise/fall edge is independent and finely tuned. The series supports up to 1024 arbitrary bands, each band can be set up to 65535 repeats.
TDK has introduced its 20U high, 19 "rack-mounted cabinet high power solution for the TDK-Lambda GENESYS+ family of programmable DC power supplies. The series has been developed to meet the needs of test and measurement, automotive component testing, high-power magnets, medical imaging, aerospace, semiconductor processing, industrial automation and process control applications. Available in two input voltage ranges -- three-phase low voltage 170 to 265VAC or three-phase high voltage 342 to 528VAC,
NXP Semiconductors Layerscape and Layerscape Access series processors have been selected by Compal Electronics for its new 5G integrated Small Unit (ISC) solution. 5G signals decay quickly, mostly through walls or over long distances. The solution uses a Layerscape combination that includes a Layerscape multi-core processor and a Layerscape Access LA1200 programmable baseband processor.
Cliff Electronically-manufactured PCB mounts 4 mm housing sockets that can be matched with safety housing and unhousing plugs. The socket is suitable for a variety of applications. This 4mm test socket series is designed to work with industry standard 4mm plugs. Contacts are gold plated receptacle rated 1000V, 24A, CAT III.
Moxa has introduced the new MGate 5119 series IEC 61850 gateway, which simplifies system integration in substations and improves communication security. The substation gateway provides DNP3/IEC 101/IEC 104/ Modbus to IEC 61850 protocol conversion, easy-to-use features, simplified configuration and troubleshooting, security hardening based on IEC 62443 and NERC CIP standards, and protocol encryption to improve communication security. The gateway design is based on the IEC 62443 and NERC CIP standards to provide secure embedded capabilities for securely connecting devices.
Infineon Technologies has launched the EDT2 IGBT in TO247PLUS package. The device optimizes discrete traction inverters for automobiles and expands the portfolio of discrete high voltage devices for automotive applications. Rated current 120A and 200A, the discrete EDT2 IGBT has very low forward voltage at 100C and can reduce on-loss by up to 13% compared to the previous generation. In addition, EDT2 IGBT provides a very narrow parameter distribution.
Molex is expanding its production of commercial 400G ZR QSFP-DD pluggable coherent optical transceivers to support the growing demand for advanced DCI solutions. Designed according to the OIF 400G ZR standard, the device is one of the first standards-based pluggable coherent optical modules. The company has also completed experimental validation of 400Gb/s data transmission over DCI ZR distances over DWDM links with 75GHz spacing and amplification in OLS
Micron Technology, Inc. is sampling the world's first vertically integrated 176-tier NAND SOLID-state drives for data centers. This new data center SSD includes the company's industry-leading NAND, which incorporates 176 layers of storage cells and proven CMOS technology under arrays to deliver an ultra-efficient design. The wide range of capacity and widest range available to meet the needs of the most demanding data center workloads.
The new Olympus 72DL PLUS Ultrasonic Thickness Gauge provides a portable, easy-to-use device for high-speed precision thickness measurements. Whether used as a paint thickness gauge, coating thickness gauge or material thickness gauge, the instrument provides reliable, built-in data logging and onboard file management providing streamlined thickness data collection and processing, while the PC interface application includes intuitive tools to review and manage data for multiple devices and components. These thickness gauges are available in standard and high frequency models
Powered by the Dimension 8100 chip, the RealMe GT Neo 3 features up to 150W OF UDCA capability and is touted as the industry's fastest and most powerful commercial charging solution. Advanced thermal management and battery protection provide cool, long-life operation. The 150W charger is available around the GaNFast power integrated circuit. Only 58mm × 58mm × 30mm (101cc), the charger achieves an excellent 1.5W/cc power density.
RadioWaves has released a new range of low wind load, bipolar, reticulated dish antennas with frequency coverage of 1710-4200mhz and 2,300-2700 MHZ. The new series of low wind load, bipolar, mesh dish antennas are ideal for point-to-point use in large open areas such as base station installations or backhaul applications. Offering 1' and 2' grid sizes, the new mesh dish is ideal for ISM, 5G, LTE, PCS, UMTS, Wi-Fi and CBRS applications.
ROHM has developed the D/A conversion IC (DAC chip)BD34352EKV and the corresponding evaluation board BD34352EKV-EVK-001. The audio DAC chip is designed to maximize the extraction of high-resolution digital audio data and convert it into analog audio signals, which is one of the most important components in defining the quality of audio equipment. The new DAC chip, BD34352EKV, has been specifically tuned to express the energy of the sound source, while maintaining the naturally flat sound characteristics of its DAC chip design concept.
Users of IDS NXT Ocean, an integrated embedded vision system, now have a range of new features available. It now supports IDS NXT Lighthouse, another AI training software in addition to AWS, through Microsoft Azure cloud services. The company allows all customers to activate a free trial month and extensively test the IDS NXT lighthouse. Current software releases also herald regular cycles of feature updates.
NXP Semiconductors has released one of the safest products in the MIFARE ultralight family. The solution is recommended by the national institute of standards and technology with enough length of key encryption technology, used for security authentication and the protected data access, and may choose to limit the negative authentication attempt, the new IC inside the family use the same memory structure, the developer can easily in the limited use of ticket application senior security fast delivery.
Microchip Technology Inc. has now introduced the latest member of the Flashtec controller family, the NVMe 4016 SSD controller. With 16 high-speed programmable NAND flash channels up to 2400MT/s, this fourth-generation Flashtec controller can use PCIe Gen 5 x 4 speed bandwidth. As an NVMe 2.0 compliant controller, it not only supports all the latest storage and performance computing applications, including ZNS and cloud OCP, but its flexible architecture also allows customers to prove themselves with future evolving NVMe specifications.
