Página 134 - Nuevas tecnologías | Heisener Electronics
Contáctenos
SalesDept@heisener.com +86-755-83210559 ext. 887
Language Translation

* Please refer to the English Version as our Official Version.

Nuevas tecnologías

Registros 4.648
Página  134/259
Technology Cover

2022-04-15, The new UV adhesive improves the integration of holographic film in augmented reality HUD

DELO developed DELO PHOTOBOND UV acrylates for optoelectronics products, enabling the holographic film produced by Covestro to bond quickly and realistically. This holographic film technology also provides design freedom and smaller space requirements for automotive rear lights and other automotive lighting applications. Regardless of the application, the holographic film is thin, light, and completely invisible in so-called non-Bragg conditions -- when coupled light does not meet specific requirements, such as the correct wavelength.

Technology Cover

2022-04-15, PCB connection for the new era

The new HARTING PCB module connector system provides users with more than 1 billion data, signal and power combination possibilities. Miniaturization and flexibility give equipment manufacturers the freedom to expand connectivity technologies.

Technology Cover

2022-04-15, E-books address the complexities of emc design

Mouser has launched a new e-book in collaboration with Wurth Elektronik, which provides four detailed articles and product information of more than a dozen Wurth Elektronik solutions, WCAP-CSGP Universal MLCC is a high-performance ceramic capacitor, Suitable for temperature compensation, coupling, decoupling, filtering and bypass applications. The WE-CMB common mode powerline inductor provides high asymmetric interference suppression even in the low frequency range, while also providing broadband shielding through low capacitance winding technology

Technology Cover

2022-04-15, The optoelectronics product line offers six new high-power infrared emitters

New Yorker Electronics has broadened its optoelectronics portfolio with the introduction of six new high-power infrared emitters in a 3.4mm x 3.4mm triple patch, lead-free surface mount package in accordance with ANSI, ESDA, JEDEC JS-001 standards, The series offers J-STD-020 rated floor life up to 168h and ESD up to 5kV.

Technology Cover

2022-04-14, Overjunction devices reduce conduction and switching losses

Vishay Intertechnology has announced the latest device for the fourth generation 600V E Series power MOSFET. The company offers a wide range of MOSFET technologies that support all phases of the power conversion process, from high voltage input to low voltage output required by the latest electronic systems. The device is based on its latest energy saving E-series superjunction technology, providing a typical ON resistance of 0.043 ohm at 10V and an ultra-low gate charge as low as 65nC

Technology Cover

2022-04-14, Innovative optical interconnect solution distribution protocol

Mouser now offers a variety of Megadon fiber network product lines, including MPO/MTP single-mode and multi-mode fiber patch cables available in standard and elite configurations for 12 and 24 fiber. HLC SCRATCHGUARD cables are high-performance reference grade cables with superior end face durability and optical performance for testing fibre network connections, and each cable offers its patented HLC terminal process

Technology Cover

2022-04-14, Advanced decoding technology in new compact bar code reader

Cornex has introduced the DataMan 280 series of fixed-mount bar code readers, which feature high-resolution sensors combined with a dynamic image generation system to enhance code processing and coverage. The device offers advanced industry 4.0 features, modular hardware including field interchangeable light sources and lenses and the latest software algorithms that can be used to solve any bar code reading challenge.

Technology Cover

2022-04-14, Lightning arresters used for outdoor networking

Linx Technologies has introduced a line of lightning arresters for outdoor networking applications. These arresters prevent electronic circuits from being overloaded by transferring excess current from thunderstorms directly to the ground. All arresters are tested to meet corrosion, vibration, mechanical and thermal shock resistance requirements.

Technology Cover

2022-04-14, Low RDS(ON) bidirectional GaN HEMT for smart mobile devices and chargers

Innoscience Technology has released a 40V bidirectional Gan-on-SI enhanced mode HEMT called INN40W08, which uses the company's advanced InnoGaN Technology to provide ultra-low resistance. Providing bidirectional blocking capability, the new GaN Hemt offers an ultra-low resistance of just 7.8mOhm and a typical gate charge (QG) of 12.7nC. The WLCSP size for a 5x5 grid is only 2mm x2mm.

Technology Cover

2022-04-13, High efficiency air cooled AC/DC power supply for distributed power systems

TDK introduced the TDK-Lambda TPF45000-385 three-phase input, non-isolated 45kW AC/DC power supply. The device provides a stable 385VDC output for large distributed power systems. The device can be input from Delta or Wye 360-528VAC three-phase and operate at full load at ambient temperatures from -10C to +50C (-20C startup). The equipment is certified by IEC/EN/UL/CSA 62368-1 and complies with the CE and UKCA marks of Low Voltage, EMC and RoHS directives

Technology Cover

2022-04-13, Support the development of complex and professional functional safety systems

Renesas Electronics is working with AVL to provide customer support for the development of an ECU that meets the ISO 26262 International standard for automotive Functional Safety. It has become a challenge to efficiently develop sophisticated advanced ADAS/AD systems that meet functional safety standards. Through this collaboration, Renesas customers can use sophisticated security solutions for their components and benefit from AVL's expert support for functional security, allowing less development time to comply with ISO 26262 ECU.

Technology Cover

2022-04-13, Class D audio amplifier modules feature small size and radiation-free operation

Infineon Technologies Inc. now offers the MERUS dual-channel, analog input, Class D Audio Amplifier Multi-chip Module (MCM) MA5332MS. The device comes in a compact 7mm x 7mm2 42-pin QFN package that integrates a two-channel PWM controller, a high-voltage gate driver, and four low R DS(ON) MOSFEts. As a highly integrated MCM, it also contains a protection circuit, with over current, over temperature self-reset under voltage protection

Technology Cover

2022-04-13, The company has accelerated the simulation and testing of 5G automotive applications

Anritsu Corporation and dSPACE will jointly demonstrate the integration of PC-based simulation systems with sensor-reality simulation in a 5G network simulator at THE 2022 MWC. The example application used in the demo is Advanced Cross Collision Warning (AICW). In order to provide a 5G network segmentation test environment for automotive V2X use cases, the demonstration platform uses the Amriti MT8000A radio communication test bed and dSPACE VEOS(PC-based simulation platform), and uses the dSPACE AURELION solution for sensor realistic simulation.

Technology Cover

2022-04-13, Automotive 5G and C-V2X performance and reliability testing solutions

Rohde & Schwarz offers high-performance 5G automotive measurement, including comprehensive test coverage including RF, protocol and application testing, using its new R&S CMX500 single-box tester that covers the full development cycle of the vehicle from chipset to TCUs and throughout. Providing extensive testing capabilities to support all 5G NR deployments, the company's GNSS simulator generates signals for all operational satellite navigation systems, including GPS, GLONASS, Galileo, Beidou, SBAS and QZSS in L1, L2 and L5 bands.

Technology Cover

2022-04-12, Highly secure LoRaWAN network solution for a wide selection of IoT applications

Avnet Silica provides Micromico with Microsoft Azure Sphere's LoRaWAN Gateway. It protects gateways from the risk of cyber attacks by providing multiple layers of security, and can also be deployed in an adaptive manner to secure existing devices and build protection in new iot infrastructure development.

Technology Cover

2022-04-12, General purpose medium TFT offers high performance specifications

Review Display Systems offers a new Tenma 6.5-inch TFT Display module. The module provides a single-channel 20-pin LVDS data interface that supports configurable 6 - or 8-bit RGB color data, enabling a palette of colors up to 262K or 16.7m colors. The mechanical dimensions of the 6.5-inch display module are 154.0mm (W) x 121.0mm (h) x 7.1mm (d), and the active display area is 132.5mm (W) x 99.4mm (h).

Technology Cover

2022-04-12, High-performance, space-saving relays minimize energy losses

The exceptionally low contact resistance of the 5mOhm reduces the heat generated within the OMron G7EB significantly and is now available from Rutronik. The cooling operation of the relays eliminates the need for additional radiators, thereby reducing the size of the overall system. The device measures 40.5mm x 50.5mm x 37mm

Technology Cover

2022-04-12, The optimized multi-band RF iot front-end module is mainly aimed at high efficiency

Mouser now supplies Skyworks Solutions' Sky68031-11 multi-band RF Iot front end module, which has PA load lines optimized to improve efficiency while meeting 3GPP ACLR and LTE emission cover specifications up to 6RB.