Burns has announced a new line of high-power fuse models. The POWrFuse model PF-K series is designed specifically to meet the ISO 8820-8 standard for protecting high-voltage accessory circuits in electric and hybrid vehicles.
Vishay Intertechnology, Inc introduced the first AEC-Q200 qualified IHSR high-temperature inductor with current ratings to 155A in the 19mm x 17.1mm x 7mm 6767 case size. Intended for multi-phase, high current power supplies and input/output filters in automotive under the hood and ADAS applications, the Vishay Dale IHSR-6767GZ-5A provides a 50% reduction in DCR over typical power inductors and a smaller size than comparable ferrite-based solutions.
ams Osram has launched the AS705x series of analog front ends with functional units that improve the performance of PPG measurements. With the AS7056 and AS7057, ams Osram has the smallest analog front end (AFE) on the market today and offers a one-stop product portfolio including AFE, custom optical front end and all necessary building blocks, ideal for space-constrained applications. application on a listening device or accessory.
Advanced Energy Industries, Inc has expanded the TEGAM 700 series of bond meters with two handheld measurement tools. The TEGAM 720A and TEGAM 730A bond meters are ideal for use in the manufacture and maintenance of aerospace, automotive, renewable energy equipment and other applications where testing of the integrity of mechanical and electrical bonds is a crucial necessity.
Toshiba Electronic Components & Storage Corporation announced the launch of a new power device, the third-generation silicon carbide (SiC) MOSFET "TWxxNxxxC series". This series features low on-resistance, which significantly reduces switching losses. The 10 products in this series include 5 1200V products and 5 650V products
ROHM has developed a step-down DC-DC converter IC*1 "BD9S402MUF-C" for increasingly complex in-vehicle applications such as ADAS (advanced driver assistance systems) and infotainment systems including in-vehicle sensors and cameras. The new products meet the requirements of the increasingly high-performance SoC (System on a Chip) and secondary side*2 power supply applications of microcontrollers with small size, 4A output current, switching operating frequency above 2MHz, and 0.6V low-voltage output
Renesas Electronics announced the launch of a new generation of Si-IGBT (Silicon-Based Insulated Gate Bipolar Transistor) devices that deliver lower power losses in a smaller size. For next-generation electric vehicle (EVs) inverter applications, mass production of AE5-generation IGBT products will begin in the first half of 2023 at Renesas' 200mm and 300mm wafer lines in Naka, Japan
Diodes Incorporated announces a family of bidirectional current displays featuring a high stability zero-drift architecture. These devices are capable of accurately measuring very low sense voltages over a wide common-mode voltage range. Key product applications include notebook computers, battery chargers, industrial servos, servers, power racks in server farms, and robotic systems.
Diodes has introduced the AL5873Q three-channel linear LED driver, expanding the size of the device portfolio that supports automotive exterior lighting to simplify the design of automotive rear lighting groups. This automotive AEC-Q100 Grade 1 qualified unit, rated to operate at an ambient temperature of 125°C, meets the requirements of next-generation automotive designs while saving energy and space and reducing overall system cost
With WE-BMS, Würth Elektronik supplies signal transformers for battery management systems, which are excellent for use in energy storage systems, e-bikes or e-scooters due to the galvanically isolated 4300VDC/1min and high operating voltages up to 1000VDC. Different sizes from 9.5mm x 5.5mm to 15.1mm x 15.4mm x 3.45mm.
Infineon Technologies AG has introduced new HYPERRAM 3.0 devices to further complement its high-bandwidth, low-pin-count memory solutions. The device has a new 16-bit extended HyperBus interface, which can double the throughput to 800MBps. The data throughput per pin of the new HYPERRAM3.0 memory solution is much higher than that of PSRAM, SDR DRAM and other existing technologies on the market. .
RECOM's RMD500 series 500 W DC/DC converters are designed to meet the specific requirements of transportation, especially rail cars. They have a 4:1 input voltage range, covering 43 VDC to 137.5 VDC (nominal values are 72 V and 110 V, respectively) input voltages, with isolated and stabilized 24 V outputs. The RMD500 series achieves this specification with an enhanced isolation system
NXP Introduces First Automotive-Grade Security Chip with NFC and Wired Interface for Keyless Entry Smart Key Fobs and Multiple Security Applications Helps Improve the Security of Smart Connected Cars
Pepperl+Fuchs' new M18 series cylindrical photoelectric sensors are designed for a wide range of standard applications. The series has three housing designs, all provide five detection modes, and are equipped with a unified electrical interface. Each has its own functional characteristics and can be used flexibly.
TE Connectivity Positive Lock Multi-Position Connectors with Extra Low Insertion Force (X-LIF) Terminals are ergonomically designed connector terminals with extra low insertion force. These positive lock connectors are designed to meet industry demands for improved manufacturing efficiency and easier part mating with multiple Printed Circuit Board (PCB) position tabs.
Infineon Technologies AG has combined the hybrid flyback (HFB) controller, XDP digital power controller XDPS2201 and the CoolGaN integrated power stage (IPS) 600V (IGI60F1414A1L) for high-efficiency and high-power density charger and adapter designs.
Technology Inc. announced the launch of the ARM926EJ-S™-based SAM9X60D1G-SOM embedded microprocessor running up to 600 MHz, further expanding its microprocessor system-on-module (SOM) portfolio.
Swagelok, a leading supplier of fluid system products, components, and related services, today announced the availability of the Swagelok ALD7 ultra-high-purity (UHP) diaphragm valve—providing semiconductor manufacturers with the consistency and long life necessary to increase chip yield . Compared to Swagelok's current top-of-the-line ALD6 valve, the ALD7 offers better flow consistency, flow capacity, and actuator speed.
