Página 15 - TE Connectivity AMP Connectors Productos - Sockets for ICs, Transistors

8080-1G15

TE Connectivity AMP Connectors

CONN TRANSIST TO-3 3POS TIN-LEAD

Type: Transistor, TO-3
Number of Positions or Pins (Grid): 3 (Oval)
Pitch - Mating: -
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Chassis Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Beryllium Copper
Housing Material: Fluoropolymer (FP)
Operating Temperature: -55°C ~ 125°C

Paquete: -

En existencias5.346

3 (Oval)

-

Tin-Lead

200µin (5.08µm)

Beryllium Copper

Chassis Mount

Closed Frame

Solder

-

Tin-Lead

200µin (5.08µm)

Beryllium Copper

Fluoropolymer (FP)

-55°C ~ 125°C

345444-4

TE Connectivity AMP Connectors

PGA168P17 TIN STD/.75AU24C OFN

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

Paquete: -

En existencias8.730

-

1554116-3

TE Connectivity AMP Connectors

CONN SOCKET LGA 1356POS GOLD

Type: LGA
Number of Positions or Pins (Grid): 1356 (32 x 41)
Pitch - Mating: 0.040" (1.01mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Surface Mount
Features: Open Frame
Termination: Solder
Pitch - Post: 0.040" (1.01mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Copper Alloy
Housing Material: Thermoplastic
Operating Temperature: -25°C ~ 100°C

Paquete: -

En existencias7.614

1356 (32 x 41)

0.040" (1.01mm)

Gold

30µin (0.76µm)

Copper Alloy

Surface Mount

Open Frame

Solder

0.040" (1.01mm)

Gold

30µin (0.76µm)

Copper Alloy

Thermoplastic

-25°C ~ 100°C

5-6437504-0

TE Connectivity AMP Connectors

CONN TRANSIST TO-3 3POS SILVER

Type: Transistor, TO-3
Number of Positions or Pins (Grid): 3 (Oval)
Pitch - Mating: -
Contact Finish - Mating: Silver
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Chassis Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Silver
Contact Finish Thickness - Post: -
Contact Material - Post: Beryllium Copper
Housing Material: Diallyl Phthalate (DAP)
Operating Temperature: -55°C ~ 125°C

Paquete: -

En existencias3.708

3 (Oval)

-

Silver

-

Beryllium Copper

Chassis Mount

Closed Frame

Solder

-

Silver

-

Beryllium Copper

Diallyl Phthalate (DAP)

-55°C ~ 125°C

2040540-1

TE Connectivity AMP Connectors

CONN SOCKET LGA 1156POS GOLD

Type: LGA
Number of Positions or Pins (Grid): 1156 (34 x 34)
Pitch - Mating: 0.036" (0.91mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15µin (0.38µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Surface Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.039" (1.00mm)
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: Copper Alloy
Housing Material: Thermoplastic
Operating Temperature: -

Paquete: -

En existencias8.154

1156 (34 x 34)

0.036" (0.91mm)

Gold

15µin (0.38µm)

Copper Alloy

Surface Mount

Closed Frame

Solder

0.039" (1.00mm)

-

Copper Alloy

Thermoplastic

-

345631-1

TE Connectivity AMP Connectors

SOCKET, LIF PGA, 17X17 209 P

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

Paquete: -

En existencias4.032

-

210793-4

TE Connectivity AMP Connectors

PGA132P14 TIN STD/.75AU24C OFN

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

Paquete: -

En existencias3.060

-

2069965-1

TE Connectivity AMP Connectors

SOCKETASSYLGA1155

Type: LGA
Number of Positions or Pins (Grid): 1155 (40 x 40)
Pitch - Mating: 0.036" (0.91mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15µin (0.38µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Surface Mount
Features: Open Frame
Termination: Solder
Pitch - Post: 0.036" (0.91mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 15µin (0.38µm)
Contact Material - Post: Copper Alloy
Housing Material: Thermoplastic
Operating Temperature: -

Paquete: -

En existencias6.354

1155 (40 x 40)

0.036" (0.91mm)

Gold

15µin (0.38µm)

Copper Alloy

Surface Mount

Open Frame

Solder

0.036" (0.91mm)

Gold

15µin (0.38µm)

Copper Alloy

Thermoplastic

-

5-1571552-3

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 42POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 20µin (0.51µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 20µin (0.51µm)
Contact Material - Post: Copper
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature: -55°C ~ 105°C

Paquete: -

En existencias2.934

42 (2 x 21)

0.100" (2.54mm)

Gold

20µin (0.51µm)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

20µin (0.51µm)

Copper

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

-55°C ~ 105°C

210227-4

TE Connectivity AMP Connectors

CONN SOCKET PGA 169POS GOLD

Type: PGA
Number of Positions or Pins (Grid): 169 (17 x 17)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Press-Fit
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 197µin (5.00µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Thermoplastic, Polyester, Glass Filled
Operating Temperature: -

Paquete: -

En existencias3.816

169 (17 x 17)

0.100" (2.54mm)

Gold

29.5µin (0.75µm)

Beryllium Copper

Through Hole

Open Frame

Press-Fit

0.100" (2.54mm)

Tin-Lead

197µin (5.00µm)

Phosphor Bronze

Thermoplastic, Polyester, Glass Filled

-

8060-1G6

TE Connectivity AMP Connectors

CONN TRANSIST TO-5 4POS GOLD

Type: Transistor, TO-5
Number of Positions or Pins (Grid): 4 (Round)
Pitch - Mating: -
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Panel Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Gold
Contact Finish Thickness - Post: -
Contact Material - Post: Beryllium Copper
Housing Material: Fluoropolymer (FP)
Operating Temperature: -55°C ~ 125°C

Paquete: -

En existencias6.408

4 (Round)

-

Gold

-

Beryllium Copper

Panel Mount

Closed Frame

Solder

-

Gold

-

Beryllium Copper

Fluoropolymer (FP)

-55°C ~ 125°C

2013620-4

TE Connectivity AMP Connectors

SOCKET ASSY W/EMBOSS ,RPGA989

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

Paquete: -

En existencias4.572

-

2013620-3

TE Connectivity AMP Connectors

CONN SOCKET PGA ZIF 989POS GOLD

Type: PGA, ZIF (ZIP)
Number of Positions or Pins (Grid): 989 (35 x 36)
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15µin (0.38µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Surface Mount
Features: Open Frame
Termination: Solder
Pitch - Post: 0.039" (1.00mm)
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: Copper Alloy
Housing Material: Thermoplastic
Operating Temperature: -

Paquete: -

En existencias7.182

989 (35 x 36)

0.039" (1.00mm)

Gold

15µin (0.38µm)

Copper Alloy

Surface Mount

Open Frame

Solder

0.039" (1.00mm)

-

Copper Alloy

Thermoplastic

-

821949-5

TE Connectivity AMP Connectors

CONN SOCKET PQFP 132POS TIN-LEAD

Type: QFP
Number of Positions or Pins (Grid): 132 (4 x 33)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Liquid Crystal Polymer (LCP)
Operating Temperature: -

Paquete: -

En existencias3.852

132 (4 x 33)

0.050" (1.27mm)

Tin-Lead

200µin (5.08µm)

Phosphor Bronze

Through Hole

Closed Frame

Solder

0.050" (1.27mm)

Tin-Lead

200µin (5.08µm)

Phosphor Bronze

Liquid Crystal Polymer (LCP)

-

1-1437508-3

TE Connectivity AMP Connectors

CONN TRANSIST TO-5 8POS GOLD

Type: Transistor, TO-5
Number of Positions or Pins (Grid): 8 (Round)
Pitch - Mating: -
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Gold
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polytetrafluoroethylene (PTFE)
Operating Temperature: -55°C ~ 125°C

Paquete: -

En existencias3.870

8 (Round)

-

Gold

-

Beryllium Copper

Through Hole

Closed Frame

Solder

-

Gold

-

Brass

Polytetrafluoroethylene (PTFE)

-55°C ~ 125°C

3-1571586-1

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 36POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 36 (2 x 18)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 25µin (0.63µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 25µin (0.63µm)
Contact Material - Post: Copper
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature: -55°C ~ 105°C

Paquete: -

En existencias7.506

36 (2 x 18)

0.100" (2.54mm)

Gold

25µin (0.63µm)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

25µin (0.63µm)

Copper

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

-55°C ~ 105°C

1-2013620-1

TE Connectivity AMP Connectors

SOCKET ASSY W/H-TRAY, RPGA988A

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

Paquete: -

En existencias3.204

-

2013620-1

TE Connectivity AMP Connectors

CONN SOCKET PGA ZIF 989POS GOLD

Type: PGA, ZIF (ZIP)
Number of Positions or Pins (Grid): 989 (35 x 36)
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15µin (0.38µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Surface Mount
Features: Open Frame
Termination: Solder
Pitch - Post: 0.039" (1.00mm)
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: Copper Alloy
Housing Material: Thermoplastic
Operating Temperature: -

Paquete: -

En existencias3.456

989 (35 x 36)

0.039" (1.00mm)

Gold

15µin (0.38µm)

Copper Alloy

Surface Mount

Open Frame

Solder

0.039" (1.00mm)

-

Copper Alloy

Thermoplastic

-

9-1437504-7

TE Connectivity AMP Connectors

CONN TRANSIST TO-3 3POS TIN

Type: Transistor, TO-3
Number of Positions or Pins (Grid): 3 (Oval)
Pitch - Mating: -
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Chassis Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polytetrafluoroethylene (PTFE)
Operating Temperature: -55°C ~ 125°C

Paquete: -

En existencias4.698

3 (Oval)

-

Tin

200µin (5.08µm)

Beryllium Copper

Chassis Mount

Closed Frame

Solder

-

Tin

200µin (5.08µm)

Beryllium Copper

Polytetrafluoroethylene (PTFE)

-55°C ~ 125°C

8080-1G45

TE Connectivity AMP Connectors

CONN TRANSIST TO-3 3POS TIN

Type: Transistor, TO-3
Number of Positions or Pins (Grid): 3 (Oval)
Pitch - Mating: -
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Chassis Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Beryllium Copper
Housing Material: Polytetrafluoroethylene (PTFE)
Operating Temperature: -55°C ~ 125°C

Paquete: -

En existencias8.568

3 (Oval)

-

Tin

-

Beryllium Copper

Chassis Mount

Closed Frame

Solder

-

Tin

-

Beryllium Copper

Polytetrafluoroethylene (PTFE)

-55°C ~ 125°C

1437532-7

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 22POS

Type: DIP, 0.4" (10.16mm) Row Spacing
Number of Positions or Pins (Grid): 22 (2 x 11)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: Through Hole
Features: Closed Frame
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

Paquete: -

En existencias3.384

22 (2 x 11)

0.100" (2.54mm)

-

Through Hole

Closed Frame

-

8-1437530-1

TE Connectivity AMP Connectors

510-AG91F-2-20=INLINE SOCKET A

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

Paquete: -

En existencias8.100

-

8080-1G16-LF

TE Connectivity AMP Connectors

CONN TRANSIST TO-3 3POS SILVER

Type: Transistor, TO-3
Number of Positions or Pins (Grid): 3 (Oval)
Pitch - Mating: -
Contact Finish - Mating: Silver
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Chassis Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Silver
Contact Finish Thickness - Post: -
Contact Material - Post: Beryllium Copper
Housing Material: Polytetrafluoroethylene (PTFE)
Operating Temperature: -55°C ~ 125°C

Paquete: -

En existencias7.632

3 (Oval)

-

Silver

-

Beryllium Copper

Chassis Mount

Closed Frame

Solder

-

Silver

-

Beryllium Copper

Polytetrafluoroethylene (PTFE)

-55°C ~ 125°C

8080-1G31

TE Connectivity AMP Connectors

CONN TRANSIST TO-3 3POS TIN

Type: Transistor, TO-3
Number of Positions or Pins (Grid): 3 (Oval)
Pitch - Mating: -
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Chassis Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Beryllium Copper
Housing Material: Polytetrafluoroethylene (PTFE)
Operating Temperature: -55°C ~ 125°C

Paquete: -

En existencias7.740

3 (Oval)

-

Tin

-

Beryllium Copper

Chassis Mount

Closed Frame

Solder

-

Tin

-

Beryllium Copper

Polytetrafluoroethylene (PTFE)

-55°C ~ 125°C

9-1437508-8

TE Connectivity AMP Connectors

CONN TRANSIST

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

Paquete: -

En existencias6.498

-

4-1437538-8

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 64POS GOLD

Type: DIP, 0.9" (22.86mm) Row Spacing
Number of Positions or Pins (Grid): 64 (2 x 32)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 25µin (0.63µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: Polyester
Operating Temperature: -55°C ~ 105°C

Paquete: -

En existencias3.258

64 (2 x 32)

0.100" (2.54mm)

Gold

25µin (0.63µm)

Copper Alloy

Through Hole

Open Frame

Solder

0.100" (2.54mm)

-

Polyester

-55°C ~ 105°C

3-1825046-0

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 32POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Surface Mount
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: -
Operating Temperature: -

Paquete: -

En existencias8.370

32 (2 x 16)

0.100" (2.54mm)

Gold

-

Beryllium Copper

Surface Mount

Open Frame

Solder

0.100" (2.54mm)

-

Brass

-

3-1571586-3

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 42POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 25µin (0.63µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Copper Alloy
Housing Material: Polyester
Operating Temperature: -55°C ~ 105°C

Paquete: -

En existencias8.982

42 (2 x 21)

0.100" (2.54mm)

Gold

25µin (0.63µm)

Copper Alloy

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

-

Copper Alloy

Polyester

-55°C ~ 105°C

Nº de pieza	Fabricantes	Descripción	Paquete	En existencias	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
8080-1G15	TE Connectivity AMP Connectors	CONN TRANSIST TO-3 3POS TIN-LEAD Type: Transistor, TO-3 Number of Positions or Pins (Grid): 3 (Oval) Pitch - Mating: - Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: 200µin (5.08µm) Contact Material - Mating: Beryllium Copper Mounting Type: Chassis Mount Features: Closed Frame Termination: Solder Pitch - Post: - Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Beryllium Copper Housing Material: Fluoropolymer (FP) Operating Temperature: -55°C ~ 125°C	Paquete: -	En existencias5.346	3 (Oval)	-	Tin-Lead	200µin (5.08µm)	Beryllium Copper	Chassis Mount	Closed Frame	Solder	-	Tin-Lead	200µin (5.08µm)	Beryllium Copper	Fluoropolymer (FP)	-55°C ~ 125°C
345444-4	TE Connectivity AMP Connectors	PGA168P17 TIN STD/.75AU24C OFN Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Paquete: -	En existencias8.730	-	-	-	-	-	-	-	-	-	-	-	-	-	-
1554116-3	TE Connectivity AMP Connectors	CONN SOCKET LGA 1356POS GOLD Type: LGA Number of Positions or Pins (Grid): 1356 (32 x 41) Pitch - Mating: 0.040" (1.01mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Copper Alloy Mounting Type: Surface Mount Features: Open Frame Termination: Solder Pitch - Post: 0.040" (1.01mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30µin (0.76µm) Contact Material - Post: Copper Alloy Housing Material: Thermoplastic Operating Temperature: -25°C ~ 100°C	Paquete: -	En existencias7.614	1356 (32 x 41)	0.040" (1.01mm)	Gold	30µin (0.76µm)	Copper Alloy	Surface Mount	Open Frame	Solder	0.040" (1.01mm)	Gold	30µin (0.76µm)	Copper Alloy	Thermoplastic	-25°C ~ 100°C
5-6437504-0	TE Connectivity AMP Connectors	CONN TRANSIST TO-3 3POS SILVER Type: Transistor, TO-3 Number of Positions or Pins (Grid): 3 (Oval) Pitch - Mating: - Contact Finish - Mating: Silver Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Chassis Mount Features: Closed Frame Termination: Solder Pitch - Post: - Contact Finish - Post: Silver Contact Finish Thickness - Post: - Contact Material - Post: Beryllium Copper Housing Material: Diallyl Phthalate (DAP) Operating Temperature: -55°C ~ 125°C	Paquete: -	En existencias3.708	3 (Oval)	-	Silver	-	Beryllium Copper	Chassis Mount	Closed Frame	Solder	-	Silver	-	Beryllium Copper	Diallyl Phthalate (DAP)	-55°C ~ 125°C
2040540-1	TE Connectivity AMP Connectors	CONN SOCKET LGA 1156POS GOLD Type: LGA Number of Positions or Pins (Grid): 1156 (34 x 34) Pitch - Mating: 0.036" (0.91mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 15µin (0.38µm) Contact Material - Mating: Copper Alloy Mounting Type: Surface Mount Features: Closed Frame Termination: Solder Pitch - Post: 0.039" (1.00mm) Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: Copper Alloy Housing Material: Thermoplastic Operating Temperature: -	Paquete: -	En existencias8.154	1156 (34 x 34)	0.036" (0.91mm)	Gold	15µin (0.38µm)	Copper Alloy	Surface Mount	Closed Frame	Solder	0.039" (1.00mm)	-	-	Copper Alloy	Thermoplastic	-
345631-1	TE Connectivity AMP Connectors	SOCKET, LIF PGA, 17X17 209 P Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Paquete: -	En existencias4.032	-	-	-	-	-	-	-	-	-	-	-	-	-	-
210793-4	TE Connectivity AMP Connectors	PGA132P14 TIN STD/.75AU24C OFN Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Paquete: -	En existencias3.060	-	-	-	-	-	-	-	-	-	-	-	-	-	-
2069965-1	TE Connectivity AMP Connectors	SOCKETASSYLGA1155 Type: LGA Number of Positions or Pins (Grid): 1155 (40 x 40) Pitch - Mating: 0.036" (0.91mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 15µin (0.38µm) Contact Material - Mating: Copper Alloy Mounting Type: Surface Mount Features: Open Frame Termination: Solder Pitch - Post: 0.036" (0.91mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 15µin (0.38µm) Contact Material - Post: Copper Alloy Housing Material: Thermoplastic Operating Temperature: -	Paquete: -	En existencias6.354	1155 (40 x 40)	0.036" (0.91mm)	Gold	15µin (0.38µm)	Copper Alloy	Surface Mount	Open Frame	Solder	0.036" (0.91mm)	Gold	15µin (0.38µm)	Copper Alloy	Thermoplastic	-
5-1571552-3	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 42POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 42 (2 x 21) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 20µin (0.51µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 20µin (0.51µm) Contact Material - Post: Copper Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Operating Temperature: -55°C ~ 105°C	Paquete: -	En existencias2.934	42 (2 x 21)	0.100" (2.54mm)	Gold	20µin (0.51µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	20µin (0.51µm)	Copper	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 105°C
210227-4	TE Connectivity AMP Connectors	CONN SOCKET PGA 169POS GOLD Type: PGA Number of Positions or Pins (Grid): 169 (17 x 17) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Press-Fit Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 197µin (5.00µm) Contact Material - Post: Phosphor Bronze Housing Material: Thermoplastic, Polyester, Glass Filled Operating Temperature: -	Paquete: -	En existencias3.816	169 (17 x 17)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100" (2.54mm)	Tin-Lead	197µin (5.00µm)	Phosphor Bronze	Thermoplastic, Polyester, Glass Filled	-
8060-1G6	TE Connectivity AMP Connectors	CONN TRANSIST TO-5 4POS GOLD Type: Transistor, TO-5 Number of Positions or Pins (Grid): 4 (Round) Pitch - Mating: - Contact Finish - Mating: Gold Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Panel Mount Features: Closed Frame Termination: Solder Pitch - Post: - Contact Finish - Post: Gold Contact Finish Thickness - Post: - Contact Material - Post: Beryllium Copper Housing Material: Fluoropolymer (FP) Operating Temperature: -55°C ~ 125°C	Paquete: -	En existencias6.408	4 (Round)	-	Gold	-	Beryllium Copper	Panel Mount	Closed Frame	Solder	-	Gold	-	Beryllium Copper	Fluoropolymer (FP)	-55°C ~ 125°C
2013620-4	TE Connectivity AMP Connectors	SOCKET ASSY W/EMBOSS ,RPGA989 Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Paquete: -	En existencias4.572	-	-	-	-	-	-	-	-	-	-	-	-	-	-
2013620-3	TE Connectivity AMP Connectors	CONN SOCKET PGA ZIF 989POS GOLD Type: PGA, ZIF (ZIP) Number of Positions or Pins (Grid): 989 (35 x 36) Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 15µin (0.38µm) Contact Material - Mating: Copper Alloy Mounting Type: Surface Mount Features: Open Frame Termination: Solder Pitch - Post: 0.039" (1.00mm) Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: Copper Alloy Housing Material: Thermoplastic Operating Temperature: -	Paquete: -	En existencias7.182	989 (35 x 36)	0.039" (1.00mm)	Gold	15µin (0.38µm)	Copper Alloy	Surface Mount	Open Frame	Solder	0.039" (1.00mm)	-	-	Copper Alloy	Thermoplastic	-
821949-5	TE Connectivity AMP Connectors	CONN SOCKET PQFP 132POS TIN-LEAD Type: QFP Number of Positions or Pins (Grid): 132 (4 x 33) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: 200µin (5.08µm) Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Phosphor Bronze Housing Material: Liquid Crystal Polymer (LCP) Operating Temperature: -	Paquete: -	En existencias3.852	132 (4 x 33)	0.050" (1.27mm)	Tin-Lead	200µin (5.08µm)	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Tin-Lead	200µin (5.08µm)	Phosphor Bronze	Liquid Crystal Polymer (LCP)	-
1-1437508-3	TE Connectivity AMP Connectors	CONN TRANSIST TO-5 8POS GOLD Type: Transistor, TO-5 Number of Positions or Pins (Grid): 8 (Round) Pitch - Mating: - Contact Finish - Mating: Gold Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: - Contact Finish - Post: Gold Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Polytetrafluoroethylene (PTFE) Operating Temperature: -55°C ~ 125°C	Paquete: -	En existencias3.870	8 (Round)	-	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	-	Brass	Polytetrafluoroethylene (PTFE)	-55°C ~ 125°C
3-1571586-1	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 36POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 36 (2 x 18) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 25µin (0.63µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 25µin (0.63µm) Contact Material - Post: Copper Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Operating Temperature: -55°C ~ 105°C	Paquete: -	En existencias7.506	36 (2 x 18)	0.100" (2.54mm)	Gold	25µin (0.63µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	25µin (0.63µm)	Copper	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 105°C
1-2013620-1	TE Connectivity AMP Connectors	SOCKET ASSY W/H-TRAY, RPGA988A Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Paquete: -	En existencias3.204	-	-	-	-	-	-	-	-	-	-	-	-	-	-
2013620-1	TE Connectivity AMP Connectors	CONN SOCKET PGA ZIF 989POS GOLD Type: PGA, ZIF (ZIP) Number of Positions or Pins (Grid): 989 (35 x 36) Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 15µin (0.38µm) Contact Material - Mating: Copper Alloy Mounting Type: Surface Mount Features: Open Frame Termination: Solder Pitch - Post: 0.039" (1.00mm) Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: Copper Alloy Housing Material: Thermoplastic Operating Temperature: -	Paquete: -	En existencias3.456	989 (35 x 36)	0.039" (1.00mm)	Gold	15µin (0.38µm)	Copper Alloy	Surface Mount	Open Frame	Solder	0.039" (1.00mm)	-	-	Copper Alloy	Thermoplastic	-
9-1437504-7	TE Connectivity AMP Connectors	CONN TRANSIST TO-3 3POS TIN Type: Transistor, TO-3 Number of Positions or Pins (Grid): 3 (Oval) Pitch - Mating: - Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200µin (5.08µm) Contact Material - Mating: Beryllium Copper Mounting Type: Chassis Mount Features: Closed Frame Termination: Solder Pitch - Post: - Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Beryllium Copper Housing Material: Polytetrafluoroethylene (PTFE) Operating Temperature: -55°C ~ 125°C	Paquete: -	En existencias4.698	3 (Oval)	-	Tin	200µin (5.08µm)	Beryllium Copper	Chassis Mount	Closed Frame	Solder	-	Tin	200µin (5.08µm)	Beryllium Copper	Polytetrafluoroethylene (PTFE)	-55°C ~ 125°C
8080-1G45	TE Connectivity AMP Connectors	CONN TRANSIST TO-3 3POS TIN Type: Transistor, TO-3 Number of Positions or Pins (Grid): 3 (Oval) Pitch - Mating: - Contact Finish - Mating: Tin Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Chassis Mount Features: Closed Frame Termination: Solder Pitch - Post: - Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Beryllium Copper Housing Material: Polytetrafluoroethylene (PTFE) Operating Temperature: -55°C ~ 125°C	Paquete: -	En existencias8.568	3 (Oval)	-	Tin	-	Beryllium Copper	Chassis Mount	Closed Frame	Solder	-	Tin	-	Beryllium Copper	Polytetrafluoroethylene (PTFE)	-55°C ~ 125°C
1437532-7	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 22POS Type: DIP, 0.4" (10.16mm) Row Spacing Number of Positions or Pins (Grid): 22 (2 x 11) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: Through Hole Features: Closed Frame Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Paquete: -	En existencias3.384	22 (2 x 11)	0.100" (2.54mm)	-	-	-	Through Hole	Closed Frame	-	-	-	-	-	-	-
8-1437530-1	TE Connectivity AMP Connectors	510-AG91F-2-20=INLINE SOCKET A Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Paquete: -	En existencias8.100	-	-	-	-	-	-	-	-	-	-	-	-	-	-
8080-1G16-LF	TE Connectivity AMP Connectors	CONN TRANSIST TO-3 3POS SILVER Type: Transistor, TO-3 Number of Positions or Pins (Grid): 3 (Oval) Pitch - Mating: - Contact Finish - Mating: Silver Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Chassis Mount Features: Closed Frame Termination: Solder Pitch - Post: - Contact Finish - Post: Silver Contact Finish Thickness - Post: - Contact Material - Post: Beryllium Copper Housing Material: Polytetrafluoroethylene (PTFE) Operating Temperature: -55°C ~ 125°C	Paquete: -	En existencias7.632	3 (Oval)	-	Silver	-	Beryllium Copper	Chassis Mount	Closed Frame	Solder	-	Silver	-	Beryllium Copper	Polytetrafluoroethylene (PTFE)	-55°C ~ 125°C
8080-1G31	TE Connectivity AMP Connectors	CONN TRANSIST TO-3 3POS TIN Type: Transistor, TO-3 Number of Positions or Pins (Grid): 3 (Oval) Pitch - Mating: - Contact Finish - Mating: Tin Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Chassis Mount Features: Closed Frame Termination: Solder Pitch - Post: - Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Beryllium Copper Housing Material: Polytetrafluoroethylene (PTFE) Operating Temperature: -55°C ~ 125°C	Paquete: -	En existencias7.740	3 (Oval)	-	Tin	-	Beryllium Copper	Chassis Mount	Closed Frame	Solder	-	Tin	-	Beryllium Copper	Polytetrafluoroethylene (PTFE)	-55°C ~ 125°C
9-1437508-8	TE Connectivity AMP Connectors	CONN TRANSIST Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Paquete: -	En existencias6.498	-	-	-	-	-	-	-	-	-	-	-	-	-	-
4-1437538-8	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 64POS GOLD Type: DIP, 0.9" (22.86mm) Row Spacing Number of Positions or Pins (Grid): 64 (2 x 32) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 25µin (0.63µm) Contact Material - Mating: Copper Alloy Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: Polyester Operating Temperature: -55°C ~ 105°C	Paquete: -	En existencias3.258	64 (2 x 32)	0.100" (2.54mm)	Gold	25µin (0.63µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	-	-	-	Polyester	-55°C ~ 105°C
3-1825046-0	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 32POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 32 (2 x 16) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Surface Mount Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: - Operating Temperature: -	Paquete: -	En existencias8.370	32 (2 x 16)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	-	-	Brass	-	-
3-1571586-3	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 42POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 42 (2 x 21) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 25µin (0.63µm) Contact Material - Mating: Copper Alloy Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Copper Alloy Housing Material: Polyester Operating Temperature: -55°C ~ 105°C	Paquete: -	En existencias8.982	42 (2 x 21)	0.100" (2.54mm)	Gold	25µin (0.63µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Copper Alloy	Polyester	-55°C ~ 105°C