Página 14 - TE Connectivity AMP Connectors Productos - Sockets for ICs, Transistors

848-AG11D

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 48POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 48 (2 x 24)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 25µin (0.63µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: -
Contact Material - Post: Copper Alloy
Housing Material: Polyester
Operating Temperature: -55°C ~ 105°C

Paquete: -

En existencias2.052

48 (2 x 24)

0.100" (2.54mm)

Gold

25µin (0.63µm)

Copper Alloy

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin-Lead

-

Copper Alloy

Polyester

-55°C ~ 105°C

8058-1G29

TE Connectivity AMP Connectors

CONN TRANSIST TO-5 3POS GOLD

Type: Transistor, TO-5
Number of Positions or Pins (Grid): 3 (Round)
Pitch - Mating: -
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Panel Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Gold
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polytetrafluoroethylene (PTFE)
Operating Temperature: -55°C ~ 125°C

Paquete: -

En existencias7.758

3 (Round)

-

Gold

-

Beryllium Copper

Panel Mount

Closed Frame

Solder

-

Gold

-

Brass

Polytetrafluoroethylene (PTFE)

-55°C ~ 125°C

8058-1G59

TE Connectivity AMP Connectors

CONN TRANSIST TO-5 3POS GOLD

Type: Transistor, TO-5
Number of Positions or Pins (Grid): 3 (Round)
Pitch - Mating: -
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Gold
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polytetrafluoroethylene (PTFE)
Operating Temperature: -55°C ~ 125°C

Paquete: -

En existencias7.416

3 (Round)

-

Gold

-

Beryllium Copper

Through Hole

Closed Frame

Solder

-

Gold

-

Brass

Polytetrafluoroethylene (PTFE)

-55°C ~ 125°C

824-AG12D

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 24POS TINLEAD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 80µin (2.03µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: Polyester
Operating Temperature: -55°C ~ 105°C

Paquete: -

En existencias4.572

24 (2 x 12)

0.100" (2.54mm)

Tin-Lead

80µin (2.03µm)

Copper Alloy

Through Hole

Open Frame

Solder

0.100" (2.54mm)

-

Polyester

-55°C ~ 105°C

5-6437508-0

TE Connectivity AMP Connectors

CONN TRANSIST

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

Paquete: -

En existencias7.776

-

8080-1G17

TE Connectivity AMP Connectors

CONN TRANSIST TO-3 3POS TIN

Type: Transistor, TO-3
Number of Positions or Pins (Grid): 3 (Oval)
Pitch - Mating: -
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Chassis Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Beryllium Copper
Housing Material: Polytetrafluoroethylene (PTFE)
Operating Temperature: -55°C ~ 125°C

Paquete: -

En existencias6.030

3 (Oval)

-

Tin

-

Beryllium Copper

Chassis Mount

Closed Frame

Solder

-

Tin

-

Beryllium Copper

Polytetrafluoroethylene (PTFE)

-55°C ~ 125°C

9-1437508-2

TE Connectivity AMP Connectors

CONN TRANSIST

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

Paquete: -

En existencias7.758

-

516-AG12D-ES

TE Connectivity AMP Connectors

SOCKET ASSY

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

Paquete: -

En existencias5.364

-

520-AG12D-ES

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 20POS TINLEAD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 20 (2 x 10)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: -
Operating Temperature: -55°C ~ 105°C

Paquete: -

En existencias4.158

20 (2 x 10)

0.100" (2.54mm)

Tin-Lead

-

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

-

Brass

-

-55°C ~ 105°C

840-AG10D

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 40POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 25µin (0.63µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: Polyester
Operating Temperature: -55°C ~ 105°C

Paquete: -

En existencias5.022

40 (2 x 20)

0.100" (2.54mm)

Gold

25µin (0.63µm)

Copper Alloy

Through Hole

Open Frame

Solder

0.100" (2.54mm)

-

Polyester

-55°C ~ 105°C

8080-1G14

TE Connectivity AMP Connectors

CONN TRANSIST

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

Paquete: -

En existencias2.178

-

1-1437508-7

TE Connectivity AMP Connectors

SOCKET

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

Paquete: -

En existencias6.444

-

822064-5

TE Connectivity AMP Connectors

CONN SOCKET PQFP 132POS TIN-LEAD

Type: QFP
Number of Positions or Pins (Grid): 132 (4 x 33)
Pitch - Mating: 0.025" (0.64mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.025" (0.64mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Liquid Crystal Polymer (LCP)
Operating Temperature: -

Paquete: -

En existencias3.762

132 (4 x 33)

0.025" (0.64mm)

Tin-Lead

200µin (5.08µm)

Phosphor Bronze

Through Hole

Closed Frame

Solder

0.025" (0.64mm)

Tin-Lead

200µin (5.08µm)

Phosphor Bronze

Liquid Crystal Polymer (LCP)

-

3-1571586-4

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 48POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 48 (2 x 24)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 25µin (0.63µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 25µin (0.63µm)
Contact Material - Post: Copper
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature: -55°C ~ 105°C

Paquete: -

En existencias8.964

48 (2 x 24)

0.100" (2.54mm)

Gold

25µin (0.63µm)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

25µin (0.63µm)

Copper

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

-55°C ~ 105°C

8059-2G1

TE Connectivity AMP Connectors

CONN TRANSIST TO-5 3POS GOLD

Type: Transistor, TO-5
Number of Positions or Pins (Grid): 3 (Round)
Pitch - Mating: -
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: -
Contact Material - Mating: Copper Alloy
Mounting Type: Through Hole
Features: -
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Gold
Contact Finish Thickness - Post: -
Contact Material - Post: Copper Alloy
Housing Material: Polyamide (PA), Nylon
Operating Temperature: -55°C ~ 125°C

Paquete: -

En existencias4.176

3 (Round)

-

Gold

-

Copper Alloy

Through Hole

-

Solder

-

Gold

-

Copper Alloy

Polyamide (PA), Nylon

-55°C ~ 125°C

8060-1G34

TE Connectivity AMP Connectors

CONN TRANSIST TO-5 3POS GOLD

Type: Transistor, TO-5
Number of Positions or Pins (Grid): 3 (Round)
Pitch - Mating: -
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: Solder
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

Paquete: -

En existencias8.154

3 (Round)

-

Gold

-

Solder

-

1747890-1

TE Connectivity AMP Connectors

DSL ASSY LGA771 LEADED

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

Paquete: -

En existencias2.214

-

4-1437532-7

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 28POS

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: Through Hole
Features: Closed Frame
Termination: -
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

Paquete: -

En existencias7.362

28 (2 x 14)

0.100" (2.54mm)

-

Through Hole

Closed Frame

-

0.100" (2.54mm)

-

8080-1G24

TE Connectivity AMP Connectors

CONN TRANSIST

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

Paquete: -

En existencias3.276

-

2-1437504-4

TE Connectivity AMP Connectors

CONN TRANSIST

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

Paquete: -

En existencias2.106

-

818-AG11D

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 18POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 18 (2 x 9)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 25µin (0.63µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: -
Contact Material - Post: Copper Alloy
Housing Material: Polyester
Operating Temperature: -55°C ~ 105°C

Paquete: -

En existencias6.144

18 (2 x 9)

0.100" (2.54mm)

Gold

25µin (0.63µm)

Copper Alloy

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin-Lead

-

Copper Alloy

Polyester

-55°C ~ 105°C

2-1571551-5

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 18POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 18 (2 x 9)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: Flash
Contact Material - Post: Nickel
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature: -55°C ~ 125°C

Paquete: -

En existencias2.664

18 (2 x 9)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

Flash

Nickel

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

-55°C ~ 125°C

8060-1G7

TE Connectivity AMP Connectors

CONN TRANSIST TO-5 3POS GOLD

Type: Transistor, TO-5
Number of Positions or Pins (Grid): 3 (Round)
Pitch - Mating: -
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Gold
Contact Finish Thickness - Post: -
Contact Material - Post: Beryllium Copper
Housing Material: Polytetrafluoroethylene (PTFE)
Operating Temperature: -55°C ~ 125°C

Paquete: -

En existencias8.550

3 (Round)

-

Gold

-

Beryllium Copper

Through Hole

Closed Frame

Solder

-

Gold

-

Beryllium Copper

Polytetrafluoroethylene (PTFE)

-55°C ~ 125°C

9-1437537-0

TE Connectivity AMP Connectors

824-AG31F=SOCKET ASSY

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

Paquete: -

En existencias4.824

-

7-1437532-6

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 40POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 25µin (0.63µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 25µin (0.63µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyester
Operating Temperature: -55°C ~ 125°C

Paquete: -

En existencias3.546

40 (2 x 20)

0.100" (2.54mm)

Gold

25µin (0.63µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

25µin (0.63µm)

Beryllium Copper

Polyester

-55°C ~ 125°C

8-1437531-4

TE Connectivity AMP Connectors

520-AG11F=SOCKET ASSY

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

Paquete: -

En existencias2.610

-

2-6437538-5

TE Connectivity AMP Connectors

SOCKET ASSY

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

Paquete: -

En existencias3.618

-

840-AG11D

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 40POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 25µin (0.63µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: -
Contact Material - Post: Copper Alloy
Housing Material: Polyester
Operating Temperature: -55°C ~ 105°C

Paquete: -

En existencias3.454

40 (2 x 20)

0.100" (2.54mm)

Gold

25µin (0.63µm)

Copper Alloy

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin-Lead

-

Copper Alloy

Polyester

-55°C ~ 105°C

Nº de pieza	Fabricantes	Descripción	Paquete	En existencias	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
848-AG11D	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 48POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 48 (2 x 24) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 25µin (0.63µm) Contact Material - Mating: Copper Alloy Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: - Contact Material - Post: Copper Alloy Housing Material: Polyester Operating Temperature: -55°C ~ 105°C	Paquete: -	En existencias2.052	48 (2 x 24)	0.100" (2.54mm)	Gold	25µin (0.63µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	-	Copper Alloy	Polyester	-55°C ~ 105°C
8058-1G29	TE Connectivity AMP Connectors	CONN TRANSIST TO-5 3POS GOLD Type: Transistor, TO-5 Number of Positions or Pins (Grid): 3 (Round) Pitch - Mating: - Contact Finish - Mating: Gold Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Panel Mount Features: Closed Frame Termination: Solder Pitch - Post: - Contact Finish - Post: Gold Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Polytetrafluoroethylene (PTFE) Operating Temperature: -55°C ~ 125°C	Paquete: -	En existencias7.758	3 (Round)	-	Gold	-	Beryllium Copper	Panel Mount	Closed Frame	Solder	-	Gold	-	Brass	Polytetrafluoroethylene (PTFE)	-55°C ~ 125°C
8058-1G59	TE Connectivity AMP Connectors	CONN TRANSIST TO-5 3POS GOLD Type: Transistor, TO-5 Number of Positions or Pins (Grid): 3 (Round) Pitch - Mating: - Contact Finish - Mating: Gold Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: - Contact Finish - Post: Gold Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Polytetrafluoroethylene (PTFE) Operating Temperature: -55°C ~ 125°C	Paquete: -	En existencias7.416	3 (Round)	-	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	-	Brass	Polytetrafluoroethylene (PTFE)	-55°C ~ 125°C
824-AG12D	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 24POS TINLEAD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 24 (2 x 12) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: 80µin (2.03µm) Contact Material - Mating: Copper Alloy Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: Polyester Operating Temperature: -55°C ~ 105°C	Paquete: -	En existencias4.572	24 (2 x 12)	0.100" (2.54mm)	Tin-Lead	80µin (2.03µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	-	-	-	Polyester	-55°C ~ 105°C
5-6437508-0	TE Connectivity AMP Connectors	CONN TRANSIST Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Paquete: -	En existencias7.776	-	-	-	-	-	-	-	-	-	-	-	-	-	-
8080-1G17	TE Connectivity AMP Connectors	CONN TRANSIST TO-3 3POS TIN Type: Transistor, TO-3 Number of Positions or Pins (Grid): 3 (Oval) Pitch - Mating: - Contact Finish - Mating: Tin Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Chassis Mount Features: Closed Frame Termination: Solder Pitch - Post: - Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Beryllium Copper Housing Material: Polytetrafluoroethylene (PTFE) Operating Temperature: -55°C ~ 125°C	Paquete: -	En existencias6.030	3 (Oval)	-	Tin	-	Beryllium Copper	Chassis Mount	Closed Frame	Solder	-	Tin	-	Beryllium Copper	Polytetrafluoroethylene (PTFE)	-55°C ~ 125°C
9-1437508-2	TE Connectivity AMP Connectors	CONN TRANSIST Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Paquete: -	En existencias7.758	-	-	-	-	-	-	-	-	-	-	-	-	-	-
516-AG12D-ES	TE Connectivity AMP Connectors	SOCKET ASSY Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Paquete: -	En existencias5.364	-	-	-	-	-	-	-	-	-	-	-	-	-	-
520-AG12D-ES	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 20POS TINLEAD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 20 (2 x 10) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: - Operating Temperature: -55°C ~ 105°C	Paquete: -	En existencias4.158	20 (2 x 10)	0.100" (2.54mm)	Tin-Lead	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	-	-	Brass	-	-55°C ~ 105°C
840-AG10D	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 40POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 40 (2 x 20) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 25µin (0.63µm) Contact Material - Mating: Copper Alloy Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: Polyester Operating Temperature: -55°C ~ 105°C	Paquete: -	En existencias5.022	40 (2 x 20)	0.100" (2.54mm)	Gold	25µin (0.63µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	-	-	-	Polyester	-55°C ~ 105°C
8080-1G14	TE Connectivity AMP Connectors	CONN TRANSIST Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Paquete: -	En existencias2.178	-	-	-	-	-	-	-	-	-	-	-	-	-	-
1-1437508-7	TE Connectivity AMP Connectors	SOCKET Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Paquete: -	En existencias6.444	-	-	-	-	-	-	-	-	-	-	-	-	-	-
822064-5	TE Connectivity AMP Connectors	CONN SOCKET PQFP 132POS TIN-LEAD Type: QFP Number of Positions or Pins (Grid): 132 (4 x 33) Pitch - Mating: 0.025" (0.64mm) Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: 200µin (5.08µm) Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.025" (0.64mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Phosphor Bronze Housing Material: Liquid Crystal Polymer (LCP) Operating Temperature: -	Paquete: -	En existencias3.762	132 (4 x 33)	0.025" (0.64mm)	Tin-Lead	200µin (5.08µm)	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.025" (0.64mm)	Tin-Lead	200µin (5.08µm)	Phosphor Bronze	Liquid Crystal Polymer (LCP)	-
3-1571586-4	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 48POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 48 (2 x 24) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 25µin (0.63µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 25µin (0.63µm) Contact Material - Post: Copper Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Operating Temperature: -55°C ~ 105°C	Paquete: -	En existencias8.964	48 (2 x 24)	0.100" (2.54mm)	Gold	25µin (0.63µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	25µin (0.63µm)	Copper	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 105°C
8059-2G1	TE Connectivity AMP Connectors	CONN TRANSIST TO-5 3POS GOLD Type: Transistor, TO-5 Number of Positions or Pins (Grid): 3 (Round) Pitch - Mating: - Contact Finish - Mating: Gold Contact Finish Thickness - Mating: - Contact Material - Mating: Copper Alloy Mounting Type: Through Hole Features: - Termination: Solder Pitch - Post: - Contact Finish - Post: Gold Contact Finish Thickness - Post: - Contact Material - Post: Copper Alloy Housing Material: Polyamide (PA), Nylon Operating Temperature: -55°C ~ 125°C	Paquete: -	En existencias4.176	3 (Round)	-	Gold	-	Copper Alloy	Through Hole	-	Solder	-	Gold	-	Copper Alloy	Polyamide (PA), Nylon	-55°C ~ 125°C
8060-1G34	TE Connectivity AMP Connectors	CONN TRANSIST TO-5 3POS GOLD Type: Transistor, TO-5 Number of Positions or Pins (Grid): 3 (Round) Pitch - Mating: - Contact Finish - Mating: Gold Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: Solder Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Paquete: -	En existencias8.154	3 (Round)	-	Gold	-	-	-	-	Solder	-	-	-	-	-	-
1747890-1	TE Connectivity AMP Connectors	DSL ASSY LGA771 LEADED Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Paquete: -	En existencias2.214	-	-	-	-	-	-	-	-	-	-	-	-	-	-
4-1437532-7	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 28POS Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: Through Hole Features: Closed Frame Termination: - Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Paquete: -	En existencias7.362	28 (2 x 14)	0.100" (2.54mm)	-	-	-	Through Hole	Closed Frame	-	0.100" (2.54mm)	-	-	-	-	-
8080-1G24	TE Connectivity AMP Connectors	CONN TRANSIST Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Paquete: -	En existencias3.276	-	-	-	-	-	-	-	-	-	-	-	-	-	-
2-1437504-4	TE Connectivity AMP Connectors	CONN TRANSIST Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Paquete: -	En existencias2.106	-	-	-	-	-	-	-	-	-	-	-	-	-	-
818-AG11D	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 18POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 18 (2 x 9) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 25µin (0.63µm) Contact Material - Mating: Copper Alloy Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: - Contact Material - Post: Copper Alloy Housing Material: Polyester Operating Temperature: -55°C ~ 105°C	Paquete: -	En existencias6.144	18 (2 x 9)	0.100" (2.54mm)	Gold	25µin (0.63µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	-	Copper Alloy	Polyester	-55°C ~ 105°C
2-1571551-5	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 18POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 18 (2 x 9) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: Flash Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: Flash Contact Material - Post: Nickel Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Operating Temperature: -55°C ~ 125°C	Paquete: -	En existencias2.664	18 (2 x 9)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	Flash	Nickel	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
8060-1G7	TE Connectivity AMP Connectors	CONN TRANSIST TO-5 3POS GOLD Type: Transistor, TO-5 Number of Positions or Pins (Grid): 3 (Round) Pitch - Mating: - Contact Finish - Mating: Gold Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: - Contact Finish - Post: Gold Contact Finish Thickness - Post: - Contact Material - Post: Beryllium Copper Housing Material: Polytetrafluoroethylene (PTFE) Operating Temperature: -55°C ~ 125°C	Paquete: -	En existencias8.550	3 (Round)	-	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	-	Beryllium Copper	Polytetrafluoroethylene (PTFE)	-55°C ~ 125°C
9-1437537-0	TE Connectivity AMP Connectors	824-AG31F=SOCKET ASSY Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Paquete: -	En existencias4.824	-	-	-	-	-	-	-	-	-	-	-	-	-	-
7-1437532-6	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 40POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 40 (2 x 20) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 25µin (0.63µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 25µin (0.63µm) Contact Material - Post: Beryllium Copper Housing Material: Polyester Operating Temperature: -55°C ~ 125°C	Paquete: -	En existencias3.546	40 (2 x 20)	0.100" (2.54mm)	Gold	25µin (0.63µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	25µin (0.63µm)	Beryllium Copper	Polyester	-55°C ~ 125°C
8-1437531-4	TE Connectivity AMP Connectors	520-AG11F=SOCKET ASSY Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Paquete: -	En existencias2.610	-	-	-	-	-	-	-	-	-	-	-	-	-	-
2-6437538-5	TE Connectivity AMP Connectors	SOCKET ASSY Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Paquete: -	En existencias3.618	-	-	-	-	-	-	-	-	-	-	-	-	-	-
840-AG11D	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 40POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 40 (2 x 20) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 25µin (0.63µm) Contact Material - Mating: Copper Alloy Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: - Contact Material - Post: Copper Alloy Housing Material: Polyester Operating Temperature: -55°C ~ 105°C	Paquete: -	En existencias3.454	40 (2 x 20)	0.100" (2.54mm)	Gold	25µin (0.63µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	-	Copper Alloy	Polyester	-55°C ~ 105°C