Imagen |
Nº de pieza |
Fabricantes |
Descripción |
Paquete |
En existencias |
Cantidad |
Memory Size | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC SRL CONFIG EEPROM 1M 8-DIP
|
Paquete: 8-DIP (0.300", 7.62mm) |
En existencias4.624 |
|
1Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SRL CONFIG EEPROM 1M 8DIP
|
Paquete: 8-DIP (0.300", 7.62mm) |
En existencias3.344 |
|
1Mb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SRL CONFIG EEPROM 2M 8LAP
|
Paquete: 8-TDFN |
En existencias6.704 |
|
2Mb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-TDFN | 8-LAP (6x6) |
||
Xilinx Inc. |
IC PROM SER I-TEMP 3.3V 44-VQFP
|
Paquete: 44-TQFP |
En existencias20.532 |
|
1Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 44-TQFP | 44-VQFP (10x10) |
||
Xilinx Inc. |
IC PROM SER 1M 8-SOIC
|
Paquete: 8-SOIC (0.154", 3.90mm Width) |
En existencias75.072 |
|
1Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC PROM PROG I-TEMP 3.3V 20-SOIC
|
Paquete: 20-SOIC (0.295", 7.50mm Width) |
En existencias15.408 |
|
400kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Xilinx Inc. |
IC PROM PROG I-TEMP 3.3V 8-SOIC
|
Paquete: 8-SOIC (0.154", 3.90mm Width) |
En existencias2.128 |
|
200kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC PROM SER 150000 I-TEMP 20SOIC
|
Paquete: 20-SOIC (0.295", 7.50mm Width) |
En existencias4.208 |
|
1.5Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Xilinx Inc. |
IC PROM SER 150000 C-TEMP 8-DIP
|
Paquete: 8-DIP (0.300", 7.62mm) |
En existencias6.840 |
|
1.5Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SER I-TEMP 128K 20-PLCC
|
Paquete: 20-LCC (J-Lead) |
En existencias3.840 |
|
128kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC PROM SER C-TEMP 1K 20-PLCC
|
Paquete: 20-LCC (J-Lead) |
En existencias22.200 |
|
1Mb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 128K 20SOIC
|
Paquete: 20-SOIC (0.295", 7.50mm Width) |
En existencias5.056 |
|
128kb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC SER CFG PROM 128K 3.3V 20PLCC
|
Paquete: 20-LCC (J-Lead) |
En existencias36.792 |
|
128kb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC SERIAL CFG PROM 128K 20-PLCC
|
Paquete: 20-LCC (J-Lead) |
En existencias71.628 |
|
128kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Altera |
IC QUAD-SERIAL CONFIG DEVICE 512
|
Paquete: 16-SOIC (0.295", 7.50mm Width) |
En existencias6.512 |
|
512Mb | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Altera |
IC CONFIG DEVICE 4MBIT 100QFP
|
Paquete: 100-BQFP |
En existencias11.424 |
|
4MB | 3 V ~ 3.6 V | -40°C ~ 85°C | 100-BQFP | 100-PQFP (14x20) |
||
Altera |
IC CONFIG DEVICE 1MBIT 20PLCC
|
Paquete: 20-LCC (J-Lead) |
En existencias20.964 |
|
1Mb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Altera |
IC CONFIG DEVICE 65KBIT 8DIP
|
Paquete: 8-DIP (0.300", 7.62mm) |
En existencias47.136 |
|
65kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SER C-TEMP 3.3V 44-PLCC
|
Paquete: 44-LCC (J-Lead) |
En existencias41.712 |
|
4Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Xilinx Inc. |
IC PROM SERIAL CONFIG 2M 44-PLCC
|
Paquete: 44-LCC (J-Lead) |
En existencias112.068 |
|
2Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Microchip Technology |
IC CONFIG SEEPROM 512K 20SOIC
|
Paquete: 20-SOIC (0.295", 7.50mm Width) |
En existencias3.616 |
|
512kb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Xilinx Inc. |
IC PROM SRL CONFIG 512K 20-SOIC
|
Paquete: 20-SOIC (0.295", 7.50mm Width) |
En existencias22.188 |
|
512kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Xilinx Inc. |
IC PROM SRL/PAR 1.8V 32M 48CSBGA
|
Paquete: 48-TFBGA, CSPBGA |
En existencias25.332 |
|
32Mb | 1.65 V ~ 2 V | -40°C ~ 85°C | 48-TFBGA, CSPBGA | 48-CSP (8x9) |
||
Intel |
IC CONFIG DEVICE 100QFP
|
Paquete: 100-BQFP |
En existencias2.272 |
|
8MB | 3 V ~ 3.6 V | 0°C ~ 70°C | 100-BQFP | 100-PQFP (20x14) |
||
Intel |
IC CONFIG DEVICE 16MBIT 100QFP
|
Paquete: 100-BQFP |
En existencias13.800 |
|
16Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 100-BQFP | 100-PQFP (20x14) |
||
Intel |
IC CONFIG DEVICE 256MBIT 16SOIC
|
Paquete: 16-SOIC (0.295", 7.50mm Width) |
En existencias12.624 |
|
256Mb | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Altera |
CONFIG MEMORY, 64KX1, SERIAL
|
Paquete: - |
Request a Quote |
|
65kb | 3V ~ 3.6V | 0°C ~ 70°C (TA) | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
AMD |
CONFIG MEMORY, 2MX1, SERIAL
|
Paquete: - |
Request a Quote |
|
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