Imagen |
Nº de pieza |
Fabricantes |
Descripción |
Paquete |
En existencias |
Cantidad |
Memory Size | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|
Altera |
IC CONFIG DEVICE
|
Paquete: 100-BQFP |
En existencias3.776 |
|
8MB | 3 V ~ 3.6 V | 0°C ~ 70°C | 100-BQFP | 100-PQFP (14x20) |
||
Xilinx Inc. |
IC PROM SERIAL 3.3V 200K 8-SOIC
|
Paquete: 8-SOIC (0.154", 3.90mm Width) |
En existencias5.648 |
|
200kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Microchip Technology |
IC FPGA 2M CONFIG MEM 44TQFP
|
Paquete: 44-TQFP |
En existencias7.680 |
|
2Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 44-TQFP | 44-TQFP (10x10) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 2M 20-PLCC
|
Paquete: 20-LCC (J-Lead) |
En existencias7.184 |
|
2Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC PROM SER I-TEMP 3.3V 44-VQFP
|
Paquete: 44-TQFP |
En existencias5.856 |
|
8Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 44-TQFP | 44-VQFP (10x10) |
||
Xilinx Inc. |
IC PROM PROG C-TEMP 3.3V 20-SOIC
|
Paquete: 20-SOIC (0.295", 7.50mm Width) |
En existencias13.872 |
|
400kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Xilinx Inc. |
IC PROM SER 300K 8-SOIC
|
Paquete: 8-SOIC (0.154", 3.90mm Width) |
En existencias2.192 |
|
300kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC PROM PROG I-TEMP 3.3V 8-DIP
|
Paquete: 8-DIP (0.300", 7.62mm) |
En existencias37.620 |
|
100kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SER 100000 C-TEMP 8-DIP
|
Paquete: 8-DIP (0.300", 7.62mm) |
En existencias4.560 |
|
1Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM FPGA 128KB 20-SOIC
|
Paquete: 20-SOIC (0.295", 7.50mm Width) |
En existencias5.184 |
|
128kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC SERIAL CONFIG PROM 256K 8DIP
|
Paquete: 8-DIP (0.300", 7.62mm) |
En existencias32.124 |
|
256Kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SER CONFIG PROM 128K 20PLCC
|
Paquete: 20-LCC (J-Lead) |
En existencias4.448 |
|
128kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC SERIAL CFG PROM 128K 8-SOIC
|
Paquete: 8-SOIC (0.154", 3.90mm Width) |
En existencias7.600 |
|
128kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Altera |
IC CONFIG DEVICE 88UBGA
|
Paquete: 88-LFBGA |
En existencias7.260 |
|
16Mb | ± 2.25 V ~ 6 V | -40°C ~ 85°C | 88-LFBGA | 88-UBGA (11x8) |
||
Altera |
IC CONFIG DEVICE 16MBIT 88UBGA
|
Paquete: 88-LFBGA |
En existencias25.452 |
|
16Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 88-LFBGA | 88-UBGA (11x8) |
||
Altera |
IC CONFIG DEVICE 1MBIT 20PLCC
|
Paquete: 20-LCC (J-Lead) |
En existencias7.440 |
|
1Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Altera |
IC CONFIG DEVICE 1MBIT 8DIP
|
Paquete: 8-DIP (0.300", 7.62mm) |
En existencias15.684 |
|
212kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Altera |
IC CONFIG DEVICE 16MBIT 8SOIC
|
Paquete: 8-SOIC (0.154", 3.90mm Width) |
En existencias2.800 |
|
16Mb | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Xilinx Inc. |
IC PROM SERIAL CONFIG 1M 20-SOIC
|
Paquete: 20-SOIC (0.295", 7.50mm Width) |
En existencias59.208 |
|
1Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Altera |
IC CONFIG DEVICE 16MBIT 100QFP
|
Paquete: 100-BQFP |
En existencias4.352 |
|
16Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 100-BQFP | 100-PQFP (14x20) |
||
Altera |
IC CONFIG DEVICE 4MBIT 8SOIC
|
Paquete: 8-SOIC (0.154", 3.90mm Width) |
En existencias1.979.580 |
|
4MB | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC SRL CONFIG EEPROM 64K 8-LAP
|
Paquete: 8-TDFN |
En existencias7.716 |
|
64kb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-TDFN | 8-LAP (6x6) |
||
Microchip Technology |
IC SRL CONFG EEPROM 256K 20SOIC
|
Paquete: 20-SOIC (0.295", 7.50mm Width) |
En existencias5.472 |
|
256Kb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Altera |
IC CONFIG DEVICE 1.6MBIT 32TQFP
|
Paquete: 32-TQFP |
En existencias15.444 |
|
1.6Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 32-TQFP | 32-TQFP (7x7) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 2M 20-PLCC
|
Paquete: 20-LCC (J-Lead) |
En existencias3.904 |
|
2Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Intel |
IC CONFIG DEVICE
|
Paquete: 100-BQFP |
En existencias3.568 |
|
16Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 100-BQFP | 100-PQFP (20x14) |
||
Intel |
IC CONFIG DEVICE 8MBIT 100QFP
|
Paquete: 100-BQFP |
En existencias5.952 |
|
8MB | 3 V ~ 3.6 V | -40°C ~ 85°C | 100-BQFP | 100-PQFP (20x14) |
||
Intel |
IC QUAD-SERIAL LOW VOLTAGE CONFI
|
Paquete: 24-TBGA |
En existencias4.816 |
|
256MB | 1.7 V ~ 2 V | -40°C ~ 85°C | 24-TBGA | 24-FBGA (6x8) |