Página 29 - Integrado - microcontrolador, microprocesador, módulos FPGA | Circuitos integrados | Heisener Electronics
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Integrado - microcontrolador, microprocesador, módulos FPGA

Registros 1.650
Página  29/59
Imagen
Nº de pieza
Fabricantes
Descripción
Paquete
En existencias
Cantidad
Core Processor
Co-Processor
Speed
Flash Size
RAM Size
Connector Type
Size / Dimension
Operating Temperature
CC-WMX-KD47-VM
Digi International

CONNECTCORE

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
Paquete: -
En existencias5.360
-
-
-
-
-
-
-
-
20-101-0085
Digi International

CORE MODULE CM7220

  • Module/Board Type: MPU Core
  • Core Processor: Z180
  • Co-Processor: -
  • Speed: 9.216MHz
  • Flash Size: 128KB
  • RAM Size: 32KB
  • Connector Type: 40 Pin Header
  • Size / Dimension: 1.8" x 2.05" (46mm x 52mm)
  • Operating Temperature: -40°C ~ 70°C
Paquete: -
En existencias5.280
Z180
-
9.216MHz
128KB
32KB
40 Pin Header
1.8" x 2.05" (46mm x 52mm)
-40°C ~ 70°C
FS-385
Digi International

MODULE 128MB SDRAM 128MB FLASH

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
Paquete: -
En existencias7.808
-
-
-
-
-
-
-
-
DC-EM-02T-JT
Digi International

MODULE EM CUSTOMIZABLE JTAG

  • Module/Board Type: MPU Core
  • Core Processor: ARM7TDMI, NS7520
  • Co-Processor: -
  • Speed: 55MHz
  • Flash Size: 4MB
  • RAM Size: 8MB
  • Connector Type: Pin Header
  • Size / Dimension: 1.94" x 1.58" (49.2mm x 40.0mm)
  • Operating Temperature: -40°C ~ 85°C
Paquete: -
En existencias5.040
ARM7TDMI, NS7520
-
55MHz
4MB
8MB
Pin Header
1.94" x 1.58" (49.2mm x 40.0mm)
-40°C ~ 85°C
101-0520
Digi International

MODULE RABBITCORE RCM3200

  • Module/Board Type: MPU Core
  • Core Processor: Rabbit 3000
  • Co-Processor: -
  • Speed: 44.2MHz
  • Flash Size: 512KB
  • RAM Size: 768KB
  • Connector Type: 2 IDC Headers 2x17
  • Size / Dimension: 1.85" x 2.73" (47mm x 69mm)
  • Operating Temperature: -40°C ~ 70°C
Paquete: -
En existencias7.760
Rabbit 3000
-
44.2MHz
512KB
768KB
2 IDC Headers 2x17
1.85" x 2.73" (47mm x 69mm)
-40°C ~ 70°C
TE0782-02-045-2I
Trenz Electronic GmbH

SOM SOC Z7045 2XUSB 2XGB ETH 1GB

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Zynq-7000 (Z-7045)
  • Speed: -
  • Flash Size: 32MB
  • RAM Size: 1GB
  • Connector Type: Samtec QTH
  • Size / Dimension: 3.35" x 3.35" (85mm x 85mm)
  • Operating Temperature: -40°C ~ 85°C
Paquete: -
En existencias2.096
ARM Cortex-A9
Zynq-7000 (Z-7045)
-
32MB
1GB
Samtec QTH
3.35" x 3.35" (85mm x 85mm)
-40°C ~ 85°C
DC-ME4-01T-JT
Digi International

MODULE ME CUSTOMIZABLE JTAG

  • Module/Board Type: MPU Core
  • Core Processor: ARM7TDMI, NS7520
  • Co-Processor: -
  • Speed: 55MHz
  • Flash Size: 4MB
  • RAM Size: 8MB
  • Connector Type: RJ45
  • Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
  • Operating Temperature: -40°C ~ 85°C
Paquete: -
En existencias5.472
ARM7TDMI, NS7520
-
55MHz
4MB
8MB
RJ45
1.45" x 0.75" (36.7mm x 19.1mm)
-40°C ~ 85°C
SOMDM3730-32-2780AKCR
Logic

SOM TORPEDO WIRELESS 1GHZ COM

  • Module/Board Type: MPU, DSP Core
  • Core Processor: ARM? Cortex?-A8, DM3730
  • Co-Processor: TMS320C64x (DSP)
  • Speed: 1GHz
  • Flash Size: 512MB
  • RAM Size: 256MB
  • Connector Type: Board-to-Board (BTB) Socket - 200
  • Size / Dimension: 0.59" x 1.3" (15mm x 33mm)
  • Operating Temperature: 0°C ~ 70°C
Paquete: -
En existencias8.844
ARM? Cortex?-A8, DM3730
TMS320C64x (DSP)
1GHz
512MB
256MB
Board-to-Board (BTB) Socket - 200
0.59" x 1.3" (15mm x 33mm)
0°C ~ 70°C
TE0726-03M
Trenz Electronic GmbH

SBC ZYNQBERRY Z7010 HDMI USB ETH

  • Module/Board Type: FPGA
  • Core Processor: -
  • Co-Processor: Zynq-7000 (Z-7010)
  • Speed: 667MHz
  • Flash Size: 16MB
  • RAM Size: 512MB
  • Connector Type: CSI, DSI
  • Size / Dimension: 1.57" x 1.18" (40mm x 30mm)
  • Operating Temperature: 0°C ~ 70°C
Paquete: -
En existencias6.420
-
Zynq-7000 (Z-7010)
667MHz
16MB
512MB
CSI, DSI
1.57" x 1.18" (40mm x 30mm)
0°C ~ 70°C
TE0745-02-71I11-A
Trenz Electronic GmbH

SOM DDR3 1GB ZYNQ

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM® Cortex®-A9
  • Co-Processor: Zynq-7000 (Z-7030)
  • Speed: -
  • Flash Size: 64MB
  • RAM Size: 1GB
  • Connector Type: Samtec ST5
  • Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
  • Operating Temperature: -40°C ~ 85°C
Paquete: -
En existencias7.504
ARM® Cortex®-A9
Zynq-7000 (Z-7030)
-
64MB
1GB
Samtec ST5
2.05" x 2.99" (52mm x 76mm)
-40°C ~ 85°C
G120B-SM-373
GHI Electronics, LLC

IC MOD CORTEX-M3 120MHZ 96KB

  • Module/Board Type: MCU Core
  • Core Processor: ARM® Cortex®-M3
  • Co-Processor: -
  • Speed: 120MHz
  • Flash Size: 512KB (Internal), 4MB (External)
  • RAM Size: 96KB (Internal), 16MB (External)
  • Connector Type: -
  • Size / Dimension: 1.50" x 1.05" (38.1mm x 26.7mm)
  • Operating Temperature: -40°C ~ 85°C (TA)
Paquete: -
En existencias5.040
ARM® Cortex®-M3
-
120MHz
512KB (Internal), 4MB (External)
96KB (Internal), 16MB (External)
-
1.50" x 1.05" (38.1mm x 26.7mm)
-40°C ~ 85°C (TA)
TE0726-03-41C74-R
Trenz Electronic GmbH

IC MODULE ZYNQBERRY

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Zynq-7000 (Z-7010)
  • Speed: -
  • Flash Size: 16MB
  • RAM Size: 128MB
  • Connector Type: CSI, DSI
  • Size / Dimension: 1.180" L x 1.570" W (30.00mm x 40.00mm)
  • Operating Temperature: 0°C ~ 70°C
Paquete: -
Request a Quote
ARM Cortex-A9
Zynq-7000 (Z-7010)
-
16MB
128MB
CSI, DSI
1.180" L x 1.570" W (30.00mm x 40.00mm)
0°C ~ 70°C
A20-SOM-E16GS16M
Olimex LTD

IC

  • Module/Board Type: MPU Core
  • Core Processor: ARM® Cortex®-A7
  • Co-Processor: -
  • Speed: 1GHz
  • Flash Size: 8GB
  • RAM Size: 1GB
  • Connector Type: 40 Pin
  • Size / Dimension: 3.200" L x 2.200" W (81.28mm x 55.88mm)
  • Operating Temperature: 0°C ~ 70°C
Paquete: -
Request a Quote
ARM® Cortex®-A7
-
1GHz
8GB
1GB
40 Pin
3.200" L x 2.200" W (81.28mm x 55.88mm)
0°C ~ 70°C
TE0741-03-B3E-1-AF
Trenz Electronic GmbH

MODULE FPGA KINTEX

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
Paquete: -
Request a Quote
-
-
-
-
-
-
-
-
FORLINX-FET3588-C-248GSE64GCD11
Forlinx Embedded

Rockchip RK3588 SOM,8GBLPDDR4x,6

  • Module/Board Type: MPU
  • Core Processor: ARM® Cortex®-A55, ARM® Cortex®-A76
  • Co-Processor: -
  • Speed: 2.4GHz
  • Flash Size: 64GB eMMC
  • RAM Size: 8GB
  • Connector Type: 4 x 100 Pin
  • Size / Dimension: 1.970" L x 2.677" W (50.00mm x 68.00mm)
  • Operating Temperature: 0°C ~ 70°C
Paquete: -
Request a Quote
ARM® Cortex®-A55, ARM® Cortex®-A76
-
2.4GHz
64GB eMMC
8GB
4 x 100 Pin
1.970" L x 2.677" W (50.00mm x 68.00mm)
0°C ~ 70°C
TE0808-04-BBE21-AK
Trenz Electronic GmbH

IC MOD SOM MPSOC 4GB ZU15G

  • Module/Board Type: MPU Core
  • Core Processor: Zynq UltraScale+ XCZU15EG-1FFVC900E
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 4GB
  • Connector Type: B2B
  • Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Operating Temperature: 0°C ~ 85°C
Paquete: -
Request a Quote
Zynq UltraScale+ XCZU15EG-1FFVC900E
-
-
128MB
4GB
B2B
2.050" L x 2.990" W (52.00mm x 76.00mm)
0°C ~ 85°C
5749-PX-4AA-RI
Critical Link LLC

TEXAS INSTRUMENTS AM5749 SOM (32

  • Module/Board Type: MPU, FPGA Core
  • Core Processor: ARM® Cortex®-A15
  • Co-Processor: -
  • Speed: 1.5GHz
  • Flash Size: 32MB
  • RAM Size: 1GB
  • Connector Type: Board-to-Board (BTB) - 100, Edge Connector - 310
  • Size / Dimension: 3.460" L x 2.730" W (87.88mm x 69.34mm)
  • Operating Temperature: -40°C ~ 85°C
Paquete: -
Request a Quote
ARM® Cortex®-A15
-
1.5GHz
32MB
1GB
Board-to-Board (BTB) - 100, Edge Connector - 310
3.460" L x 2.730" W (87.88mm x 69.34mm)
-40°C ~ 85°C
ME-AA1-270-2I2-D11E-R2
Enclustra FPGA Solutions

SOM

  • Module/Board Type: FPGA
  • Core Processor: ARM Cortex-A9
  • Co-Processor: 10AS027E2F29I2SG
  • Speed: 1.5GHz
  • Flash Size: 16GB
  • RAM Size: 2GB
  • Connector Type: USB
  • Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
  • Operating Temperature: -40°C ~ 85°C
Paquete: -
Request a Quote
ARM Cortex-A9
10AS027E2F29I2SG
1.5GHz
16GB
2GB
USB
2.910" L x 2.130" W (74.00mm x 54.00mm)
-40°C ~ 85°C
TEC0117-01
Trenz Electronic GmbH

FPGA MODULE WITH GOWIN LITTLEBEE

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
Paquete: -
Request a Quote
-
-
-
-
-
-
-
-
TE0722-04-41I-4-A
Trenz Electronic GmbH

DIPFORTY1 "SOFT PROPELLER" WITH

  • Module/Board Type: FPGA
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Xilinx Zynq 7: XC7Z010-1CLG225I
  • Speed: -
  • Flash Size: 16MB
  • RAM Size: -
  • Connector Type: 2 x 20 Pin
  • Size / Dimension: 2.008" L x 0.709" W (51.00mm x 18.00mm)
  • Operating Temperature: -40°C ~ 85°C
Paquete: -
Request a Quote
ARM Cortex-A9
Xilinx Zynq 7: XC7Z010-1CLG225I
-
16MB
-
2 x 20 Pin
2.008" L x 0.709" W (51.00mm x 18.00mm)
-40°C ~ 85°C
TE0741-04-B2I-1-A
Trenz Electronic GmbH

MODULE FPGA KINTEX

  • Module/Board Type: FPGA Core
  • Core Processor: Xilinx Kintex-7 FPGA XC7K160T-2FBG676I
  • Co-Processor: -
  • Speed: -
  • Flash Size: 32MB
  • RAM Size: -
  • Connector Type: Board-to-Board (BTB) Socket
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: -40°C ~ 85°C
Paquete: -
Request a Quote
Xilinx Kintex-7 FPGA XC7K160T-2FBG676I
-
-
32MB
-
Board-to-Board (BTB) Socket
1.970" L x 1.570" W (50.00mm x 40.00mm)
-40°C ~ 85°C
ME-ZX1-45-2I-D10-P-R3
Enclustra FPGA Solutions

SOM ZYNQ 7Z045 1GB

  • Module/Board Type: FPGA Core
  • Core Processor: ARM® Dual-Core Cortex-A9
  • Co-Processor: Kintex-7
  • Speed: 800MHz
  • Flash Size: 512MB
  • RAM Size: 256MB, 1GB
  • Connector Type: 168 Pin
  • Size / Dimension: 2.520" L x 2.130" W (64.00mm x 54.00mm)
  • Operating Temperature: -40°C ~ 85°C
Paquete: -
En existencias33
ARM® Dual-Core Cortex-A9
Kintex-7
800MHz
512MB
256MB, 1GB
168 Pin
2.520" L x 2.130" W (64.00mm x 54.00mm)
-40°C ~ 85°C
TE0813-02-5DE81-A
Trenz Electronic GmbH

MPSOC MODULE WITH AMD ZYNQ ULTRA

  • Module/Board Type: MPU Core
  • Core Processor: Xilinx Zynq UltraScale+ XCZU5EV-1SFVC784E
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 4GB
  • Connector Type: Board-to-Board (BTB) Socket - 4 x 240
  • Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
  • Operating Temperature: 0°C ~ 85°C
Paquete: -
Request a Quote
Xilinx Zynq UltraScale+ XCZU5EV-1SFVC784E
-
-
128MB
4GB
Board-to-Board (BTB) Socket - 4 x 240
2.990" L x 2.050" W (76.00mm x 52.00mm)
0°C ~ 85°C
A10S-P9-A5E-RI-SB
Critical Link LLC

ARRIA 10 SOC MODULE, 480KLE, 6GB

  • Module/Board Type: MPU, FPGA Core
  • Core Processor: ARM® Cortex®-A9
  • Co-Processor: NEON™ SIMD
  • Speed: 1.2GHz
  • Flash Size: -
  • RAM Size: 4GB
  • Connector Type: Board-to-Board (BTB)
  • Size / Dimension: 4.000" L x 4.000" W (101.50mm x 101.50mm)
  • Operating Temperature: -40°C ~ 85°C
Paquete: -
En existencias27
ARM® Cortex®-A9
NEON™ SIMD
1.2GHz
-
4GB
Board-to-Board (BTB)
4.000" L x 4.000" W (101.50mm x 101.50mm)
-40°C ~ 85°C
TE0745-02-71I31-AK
Trenz Electronic GmbH

MOD SOM DDR3L 1GB HEAT SPREADER

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Zynq-7000 (Z-7030)
  • Speed: -
  • Flash Size: 64MB
  • RAM Size: 1GB
  • Connector Type: Board-to-Board (BTB) Socket - 480
  • Size / Dimension: 2.990" L x 2.130" W (76.00mm x 54.00mm)
  • Operating Temperature: -40°C ~ 85°C
Paquete: -
Request a Quote
ARM Cortex-A9
Zynq-7000 (Z-7030)
-
64MB
1GB
Board-to-Board (BTB) Socket - 480
2.990" L x 2.130" W (76.00mm x 54.00mm)
-40°C ~ 85°C
FORLINX-FET3588-C-244GSE32GCC11
Forlinx Embedded

Rockchip RK3588 SOM,4GBLPDDR4x,3

  • Module/Board Type: MPU
  • Core Processor: ARM® Cortex®-A55, ARM® Cortex®-A76
  • Co-Processor: -
  • Speed: 2.4GHz
  • Flash Size: 32GB eMMC
  • RAM Size: 4GB
  • Connector Type: 4 x 100 Pin
  • Size / Dimension: 1.970" L x 2.677" W (50.00mm x 68.00mm)
  • Operating Temperature: 0°C ~ 70°C
Paquete: -
Request a Quote
ARM® Cortex®-A55, ARM® Cortex®-A76
-
2.4GHz
32GB eMMC
4GB
4 x 100 Pin
1.970" L x 2.677" W (50.00mm x 68.00mm)
0°C ~ 70°C
TE0803-03-4BI21-A
Trenz Electronic GmbH

MODULE SOM TE0803-03

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
Paquete: -
Request a Quote
-
-
-
-
-
-
-
-
OSD32MP153A-512M-BAA
Octavo Systems LLC

SIP: 153A, 512MB, BAA

  • Module/Board Type: MPU Core
  • Core Processor: Arm® Dual Cortex®-A7, Arm® Cortex®-M4
  • Co-Processor: NEON™ SIMD
  • Speed: 650MHz
  • Flash Size: -
  • RAM Size: 512MB
  • Connector Type: 302-BGA
  • Size / Dimension: 0.710" L x 0.710" W (18.00mm x 18.00mm)
  • Operating Temperature: 0°C ~ 85°C
Paquete: -
Request a Quote
Arm® Dual Cortex®-A7, Arm® Cortex®-M4
NEON™ SIMD
650MHz
-
512MB
302-BGA
0.710" L x 0.710" W (18.00mm x 18.00mm)
0°C ~ 85°C