Integrado - microcontrolador, microprocesador, módulos FPGA

CC-WMX-KD47-VM-B

Digi International

CONNECTCORE

• Module/Board Type: -
• Core Processor: -
• Co-Processor: -
• Speed: -
• Flash Size: -
• RAM Size: -
• Connector Type: -
• Size / Dimension: -
• Operating Temperature: -

Paquete: -

CC-MX-LB47-ZM-B

Digi International

MODULE I.MX51 128MB FLASH 25PK

• Module/Board Type: -
• Core Processor: -
• Co-Processor: -
• Speed: -
• Flash Size: -
• RAM Size: -
• Connector Type: -
• Size / Dimension: -
• Operating Temperature: -

Paquete: -

SOMDM3730-30-1780AKIR

Logic

SYSTEM ON MODULE TORP+ DM3730

• Module/Board Type: MPU, DSP Core
• Core Processor: ARM? Cortex?-A8, DM3730
• Co-Processor: TMS320C64x (DSP)
• Speed: 800MHz
• Flash Size: 512MB
• RAM Size: 256MB
• Connector Type: Board-to-Board (BTB) Socket - 200
• Size / Dimension: 0.59" x 1.3" (15mm x 33mm)
• Operating Temperature: -40°C ~ 85°C

Paquete: -

COMMPC8360E-10-2752FCR

Logic

KIT 256MB DDR 8MB NOR 64MB NAND

• Module/Board Type: MPU Core
• Core Processor: PowerQUICC, MPC8360E
• Co-Processor: -
• Speed: 667MHz
• Flash Size: 64MB (NAND), 8MB (NOR)
• RAM Size: 256KB
• Connector Type: -
• Size / Dimension: 3.74" x 3.74" (95mm x 95mm)
• Operating Temperature: 0°C ~ 70°C

Paquete: -

101-1087

Digi International

MODULE RABBITCORE RCM 3365

• Module/Board Type: MPU Core
• Core Processor: Rabbit 3000
• Co-Processor: -
• Speed: 44.2MHz
• Flash Size: 512KB (Internal), xD-Picture Card (External)
• RAM Size: 1MB
• Connector Type: 2 IDC Headers 2x17, 1 IDC Header 2x5. 1 xD-Picture Card
• Size / Dimension: 1.85" x 2.73" (47mm x 69mm)
• Operating Temperature: 0°C ~ 70°C

Paquete: -

DBRF5110C

Dave Embedded Systems

SYSTEM ON MODULE XC7Z020 1GB

• Module/Board Type: MPU, FPGA Core
• Core Processor: ARM? Cortex?-A9, XC7Z020-3
• Co-Processor: Artix-7
• Speed: 800MHz
• Flash Size: 1GB (NAND), 32MB (NOR)
• RAM Size: 1GB
• Connector Type: 3 x 140 Pins 0.6mm Pitch
• Size / Dimension: -
• Operating Temperature: 0°C ~ 70°C

Paquete: -

DC-SP-01-C-25

Digi International

ADAPTER SP CUSTOMIZABLE MODEL

• Module/Board Type: MPU Core
• Core Processor: ARM7TDMI, NS7520
• Co-Processor: -
• Speed: 55MHz
• Flash Size: 4MB
• RAM Size: 16MB
• Connector Type: RJ45
• Size / Dimension: 3.88" x 1.68" (98.5mm x 42.7mm)
• Operating Temperature: -40°C ~ 85°C

Paquete: -

M5475JFEE

Logic

MODULE FIRE ENGINE

• Module/Board Type: MPU Core
• Core Processor: ColdFire V4e, MCF5475
• Co-Processor: -
• Speed: 266MHz
• Flash Size: 16MB
• RAM Size: 64MB
• Connector Type: -
• Size / Dimension: -
• Operating Temperature: 0°C ~ 70°C

Paquete: -

CC-MX-MB47-ZM

Digi International

MODULE I.MX51 600MHZ 128MB FLASH

• Module/Board Type: -
• Core Processor: -
• Co-Processor: -
• Speed: -
• Flash Size: -
• RAM Size: -
• Connector Type: -
• Size / Dimension: -
• Operating Temperature: -

Paquete: -

CC-9M-NA49-Z1

Digi International

MOD 9M 128MB SDRAM 512MB FLASH

• Module/Board Type: MPU Core
• Core Processor: ARM920T, SC2443
• Co-Processor: -
• Speed: 533MHz
• Flash Size: 512MB
• RAM Size: 128MB
• Connector Type: Board-to-Board (BTB) Socket - 240
• Size / Dimension: 2.36" x 1.73" (60mm x 44mm)
• Operating Temperature: -40°C ~ 85°C

Paquete: -

20-101-0522

Digi International

MODULE RABBITCORE RCM3220

• Module/Board Type: MPU Core
• Core Processor: Rabbit 3000
• Co-Processor: -
• Speed: 44.2MHz
• Flash Size: 512KB
• RAM Size: 768KB
• Connector Type: 2 IDC Headers 2x17
• Size / Dimension: 1.85" x 2.73" (47mm x 69mm)
• Operating Temperature: 0°C ~ 70°C

Paquete: -

TE0600-03I

Trenz Electronic GmbH

SOM GIGABEE 2X128MB REV. 3

• Module/Board Type: FPGA
• Core Processor: Spartan-6 LX-45
• Co-Processor: -
• Speed: 125MHz
• Flash Size: 16MB
• RAM Size: 256MB
• Connector Type: Samtec LSHM
• Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
• Operating Temperature: -40°C ~ 85°C

Paquete: -

SOMOMAPL138-10-1502QHCR

Logic

SYSTEM ON MODULE LV OMAPL138

• Module/Board Type: MPU, DSP Core
• Core Processor: ARM926EJ-S, OMAP-L138
• Co-Processor: TMS320C6748
• Speed: 375MHz
• Flash Size: 8MB
• RAM Size: 64MB
• Connector Type: Board-to-Board (BTB) Socket - 300
• Size / Dimension: 1.18" x 1.57" (30mm x 40mm)
• Operating Temperature: 0°C ~ 70°C

Paquete: -

DC-ME4-01T-IPM

Digi International

MODULE DIGI CONNECT ME

• Module/Board Type: MPU Core
• Core Processor: ARM7TDMI, NS7520
• Co-Processor: -
• Speed: 55MHz
• Flash Size: 4MB
• RAM Size: 8MB
• Connector Type: RJ45
• Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
• Operating Temperature: -40°C ~ 85°C

Paquete: -

OSD3358-512M-BCB

Octavo Systems LLC

AM3358 512MB DDR3L 4KB EEPROM TP

• Module/Board Type: MPU Core
• Core Processor: ARM® Cortex®-A8, AM3358
• Co-Processor: NEON™ SIMD
• Speed: 1GHz
• Flash Size: 4GB
• RAM Size: 512MB
• Connector Type: 400-BGA
• Size / Dimension: 1.06" x 1.06" (27.0mm x 27.0mm)
• Operating Temperature: 0°C ~ 85°C

Paquete: -

TE0803-02-04CG-1EA

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

• Module/Board Type: MPU Core
• Core Processor: Zynq UltraScale+ XCZU4CG-1SFVC784E
• Co-Processor: -
• Speed: -
• Flash Size: 128MB
• RAM Size: 2GB
• Connector Type: B2B
• Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
• Operating Temperature: 0°C ~ 85°C

Paquete: -

TE0713-02-200-2C

Trenz Electronic GmbH

IC MOD ARTIX7 XC7A200T-2F 200MHZ

• Module/Board Type: FPGA Core
• Core Processor: Artix-7 XC7A200T-2FBG484C
• Co-Processor: -
• Speed: 200MHz
• Flash Size: 32MB
• RAM Size: 1GB
• Connector Type: B2B
• Size / Dimension: 1.57" x 1.97" (40mm x 50mm)
• Operating Temperature: 0°C ~ 70°C

Paquete: -

G400D-SM-400

GHI Electronics, LLC

IC MOD ARM926EJ-S 400MHZ 32KB

• Module/Board Type: MPU Core
• Core Processor: ARM926EJ-S
• Co-Processor: -
• Speed: 400MHz
• Flash Size: 4MB (External)
• RAM Size: 32KB (Internal), 128MB (External)
• Connector Type: -
• Size / Dimension: 2.67" x 1.26" (67.7mm x 31.9mm)
• Operating Temperature: -40°C ~ 85°C

Paquete: -

TE0741-03-410-2IF

Trenz Electronic GmbH

MODULE FPGA KINTEX

• Module/Board Type: FPGA Core
• Core Processor: Xilinx Kintex-7 FPGA XC7K410T-2FBG676I
• Co-Processor: -
• Speed: -
• Flash Size: 32MB
• RAM Size: -
• Connector Type: Board-to-Board (BTB) Socket
• Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
• Operating Temperature: -40°C ~ 85°C

Paquete: -

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CYCLONE-10-GX

Intel

PROTOTYPE

• Module/Board Type: -
• Core Processor: -
• Co-Processor: -
• Speed: -
• Flash Size: -
• RAM Size: -
• Connector Type: -
• Size / Dimension: -
• Operating Temperature: -

Paquete: -

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TE0630-03-S001

Trenz Electronic GmbH

FPGA MODULE SPARTAN-6

• Module/Board Type: -
• Core Processor: -
• Co-Processor: -
• Speed: -
• Flash Size: -
• RAM Size: -
• Connector Type: -
• Size / Dimension: -
• Operating Temperature: -

Paquete: -

Request a Quote

MA-ZX3-20-2I-D10-R7-1

Enclustra FPGA Solutions

SOM ZYNQ 7Z020 1GB

• Module/Board Type: FPGA
• Core Processor: ARM® Cortex®-A9
• Co-Processor: Zynq-7000 (Z-7020)
• Speed: -
• Flash Size: 64MB, 512MB (NAND)
• RAM Size: 1GB
• Connector Type: SO-DIMM-200
• Size / Dimension: 0.220" L x 0.118" W (5.60mm x 3.00mm)
• Operating Temperature: -40°C ~ 85°C

Paquete: -

FORLINX-FET1046A-C-182GQE01IA13

Forlinx Embedded

NXP LS1046ASOM,2GB DDR4,8GB eMMC

• Module/Board Type: MPU
• Core Processor: ARM® Cortex®-A72
• Co-Processor: -
• Speed: 1.8GHz
• Flash Size: 8GB eMMC, 16Mb QSPI
• RAM Size: 2GB
• Connector Type: Board-to-Board (BTB) 2 x 110 Pin
• Size / Dimension: 3.307" L x 2.165" W (84.00mm x 55.00mm)
• Operating Temperature: -40°C ~ 75°C

Paquete: -

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TE0890-01-P1C-5-A

Trenz Electronic GmbH

MOD SPARTAN-7 64MB FLASH SO8W

• Module/Board Type: FPGA Core
• Core Processor: Xilinx Spartan-7 XC7S25
• Co-Processor: -
• Speed: 100MHz
• Flash Size: 64Mbit
• RAM Size: 64Mbit
• Connector Type: Dual-pinout DIP-40 or 50mil 80 pin connector
• Size / Dimension: 1.060" L x 2.050" W (27.00mm x 52.00mm)
• Operating Temperature: 0°C ~ 70°C

Paquete: -

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ME-XU8-4CG-1E-D11E-R2-2

Enclustra FPGA Solutions

SOM ZYNQ XU8 US+ ZU4CG

• Module/Board Type: MPU, FPGA Core
• Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
• Co-Processor: -
• Speed: 533MHz, 1.333GHz
• Flash Size: 16GB
• RAM Size: 4GB
• Connector Type: 168 Pin
• Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
• Operating Temperature: 0°C ~ 85°C

Paquete: -

TE0630-03-82I22-A

Trenz Electronic GmbH

IC MODULE LX150 100MHZ 128MB

• Module/Board Type: -
• Core Processor: -
• Co-Processor: -
• Speed: -
• Flash Size: -
• RAM Size: -
• Connector Type: -
• Size / Dimension: -
• Operating Temperature: -

Paquete: -

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TE0712-03-72C36-L

Trenz Electronic GmbH

FPGA MODULE ARTIX7

• Module/Board Type: FPGA Core
• Core Processor: Artix-7 XC7A100T-2C
• Co-Processor: -
• Speed: -
• Flash Size: 32MB
• RAM Size: 1GB
• Connector Type: Board-to-Board (BTB) Socket
• Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
• Operating Temperature: 0°C ~ 70°C

Paquete: -

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TE0807-03-7DE21-AZ

Trenz Electronic GmbH

MPSOC MODULE WITH AMD ZYNQ ULTRA

• Module/Board Type: MPU Core
• Core Processor: Xilinx Zynq UltraScale+ XCZU7EV-1FBVB900E
• Co-Processor: -
• Speed: -
• Flash Size: 128MB
• RAM Size: 4GB
• Connector Type: Board-to-Board (BTB) Socket - 4 x 160
• Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
• Operating Temperature: 0°C ~ 85°C

Paquete: -

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