Página 152 - Aries Electronics Productos - Sockets for ICs, Transistors

Nº de pieza	Fabricantes	Descripción	Paquete	En existencias	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
257-PGM20012-10	Aries Electronics	CONN SOCKET PGA GOLD Type: PGA Number of Positions or Pins (Grid): - Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: - Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 105°C	Paquete: -	En existencias7.038	-	0.100" (2.54mm)	Gold	10µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin	200µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
14-823-90CV0	Aries Electronics	CONN IC DIP SOCKET 14POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 14 (2 x 7) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole, Right Angle, Horizontal Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 105°C	Paquete: -	En existencias3.528	14 (2 x 7)	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
6-513-10	Aries Electronics	CONN SOCKET SIP 6POS GOLD Type: SIP Number of Positions or Pins (Grid): 6 (1 x 6) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: - Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -	Paquete: -	En existencias8.982	6 (1 x 6)	0.100" (2.54mm)	Gold	10µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin	200µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
60-1518-10	Aries Electronics	CONN IC DIP SOCKET 60POS GOLD Type: DIP, 0.2" (5.08mm) Row Spacing Number of Positions or Pins (Grid): 60 (2 x 30) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -	Paquete: -	En existencias6.318	60 (2 x 30)	0.100" (2.54mm)	Gold	10µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
20-3540-10	Aries Electronics	COLLET PIN CARRIER 20-PIN .300 Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Paquete: -	En existencias3.472	-	-	-	-	-	-	-	-	-	-	-	-	-	-
32-536-11	Aries Electronics	CONN SOCKET PLCC ZIF 32POS GOLD Type: PLCC, ZIF (ZIP) Number of Positions or Pins (Grid): 32 (2 x 7, 2 x 9) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 12µin (0.30µm) Contact Material - Mating: - Mounting Type: Through Hole Features: Open Frame Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Paquete: -	En existencias5.706	32 (2 x 7, 2 x 9)	0.050" (1.27mm)	Gold	12µin (0.30µm)	-	Through Hole	Open Frame	-	-	-	-	-	-	-
52-536-11	Aries Electronics	CONN SOCKET PLCC ZIF 52POS GOLD Type: PLCC, ZIF (ZIP) Number of Positions or Pins (Grid): 52 (4 x 13) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 12µin (0.30µm) Contact Material - Mating: - Mounting Type: Through Hole Features: Open Frame Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Paquete: -	En existencias7.632	52 (4 x 13)	0.050" (1.27mm)	Gold	12µin (0.30µm)	-	Through Hole	Open Frame	-	-	-	-	-	-	-
C9314-02	Aries Electronics	CONN IC DIP SOCKET 14POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 14 (2 x 7) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Phosphor Bronze Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 125°C	Paquete: -	En existencias3.888	14 (2 x 7)	0.100" (2.54mm)	Gold	10µin (0.25µm)	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
84-536-11	Aries Electronics	CONN SOCKET PLCC ZIF 84POS GOLD Type: PLCC, ZIF (ZIP) Number of Positions or Pins (Grid): 84 (4 x 21) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 12µin (0.30µm) Contact Material - Mating: - Mounting Type: Through Hole Features: Open Frame Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Paquete: -	En existencias7.848	84 (4 x 21)	0.050" (1.27mm)	Gold	12µin (0.30µm)	-	Through Hole	Open Frame	-	-	-	-	-	-	-
68-536-11	Aries Electronics	CONN SOCKET PLCC ZIF 68POS GOLD Type: PLCC, ZIF (ZIP) Number of Positions or Pins (Grid): 68 (4 x 17) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 12µin (0.30µm) Contact Material - Mating: - Mounting Type: Through Hole Features: Open Frame Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Paquete: -	En existencias7.740	68 (4 x 17)	0.050" (1.27mm)	Gold	12µin (0.30µm)	-	Through Hole	Open Frame	-	-	-	-	-	-	-
44-536-11	Aries Electronics	CONN SOCKET PLCC ZIF 44POS GOLD Type: PLCC, ZIF (ZIP) Number of Positions or Pins (Grid): 44 (4 x 11) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 12µin (0.30µm) Contact Material - Mating: - Mounting Type: Through Hole Features: Open Frame Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Paquete: -	En existencias3.618	44 (4 x 11)	0.050" (1.27mm)	Gold	12µin (0.30µm)	-	Through Hole	Open Frame	-	-	-	-	-	-	-
28-536-11	Aries Electronics	CONN SOCKET PLCC ZIF 28POS GOLD Type: PLCC, ZIF (ZIP) Number of Positions or Pins (Grid): 28 (4 x 7) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 12µin (0.30µm) Contact Material - Mating: - Mounting Type: Through Hole Features: Open Frame Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Paquete: -	En existencias6.876	28 (4 x 7)	0.050" (1.27mm)	Gold	12µin (0.30µm)	-	Through Hole	Open Frame	-	-	-	-	-	-	-
28-516-10	Aries Electronics	CONN IC DIP SOCKET ZIF 28POS TIN Type: DIP, ZIF (ZIP) Number of Positions or Pins (Grid): 28 (2 x 14) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Beryllium Copper Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -	Paquete: -	En existencias8.982	28 (2 x 14)	0.100" (2.54mm)	Tin	10µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	10µin (0.25µm)	Beryllium Copper	Polyamide (PA46), Nylon 4/6, Glass Filled	-