Winbond Electronics has announced key improvements in ultra-high-speed performance for its DDR3 products.
The company's DRAM roadmap now supports 1GB-4GB DDR3, 128MB-2GB DDR2, and 512MB-2GB LP-DDR2 interfaces, as well as LP-DDR4X, LP-DDR3, LP-DDR, and SDRAM interfaces for applications requiring 4Gb or less density DRAM products. Including AI accelerator, Internet of Things, automotive, industrial, telecommunications, WIFI-6, WiFI-6E, xDSL, fiber network, smart TV, set-top box, IP camera and so on.
Its 1.35v DDR3 products support 2133Mbps data rates in both x8 and x16 configurations and are 100% compatible with 1.5v DDR3. The company will also add new wafer capacity from the fourth quarter of 2022, offering more advanced manufacturing technology.
"Today, our customers continue to demand DDR3 SDRAM products, and our goal is to continue this proven tradition to ensure we can meet our customers' longevity needs," Winbond said, while Winbond offers competitive DDR3 products for 10 years years and will continue to offer DDR3 products with outstanding customer support and product quality for the next 10 years."
