Ranovus offers a protocol independent Odin 100G optical I/O core based on GF Fotonix, GlobalFoundries' recently announced next-generation, widely disruptive monolithic platform. The announcement was made at OFC 2022. GF Fotonix is the industry's first to combine its differentiated 300mm optoelectronics and RF-CMOS options on a single silicon chip, delivering best-in-class performance on a scale.
Odin 100Gbps Optical I/O scales from 8 to 32 cores in the same occupying area by combining its 100Gbps per wavelength monolithic EPIC core with its proprietary laser and advanced packaging technology. And IP cores can be integrated with switches, processors, and memory devices to provide new data center architectures for machine learning, artificial intelligence, virtual worlds, cloud, 5G communications, and defense and aerospace. Data centers increasingly need efficient and cost-effective high-volume interconnection solutions to meet the exponential growth of data-driven applications such as ML/AI and Metaverse.
Hojjat Salemi, Chief Business Development Officer, Ranovus said:"We are excited to share our multidisciplinary silicon photonic IP cores and chips, as well as advanced packaging solutions, with our customers who are driving the adoption of new data center architectures based on integrated best-in-class chips and co-packaged optics," "Our close collaboration with GlobalFoundries underscores our shared commitment to providing a fully functional set of compliant IP cores and chips with osAT-prepared high-volume manufacturing processes and support ecosystems to realize the tremendous potential of monolithic silicon photonic technology."
Anthony Yu, vice president, Strategic Business Unit, GF Computing and Wired Infrastructure said:"As the world's data needs grow dramatically, data centers, computing and sensing applications require incredible processing, transmission and power efficiency." Ranovus' IP core, chip and advanced packaging solutions, combined with GF Fotonix, provide customers with a complete solution to develop the chips they need to solve some of the biggest challenges facing data centers today, "
