The company has signed a distribution agreement with Teledyne FLIR to stock FLIR Lepton Micro thermal imaging modules. Through this agreement, it provides engineers with Lepton's revolutionary Long-wave infrared (LWIR) imaging module, which is small enough to fit into a smartphone, making it the ideal thermal imaging module for compact and mobile devices at one-tenth the cost of a traditional infrared thermal camera.
These LWIR camera solutions use focal plane arrays (FPA) of 160 x 120 or 80 x 60 active pixels with thermal sensitivity below 50mK and can be easily integrated into native mobile devices and other electronic devices as IR sensors or thermal imagers. These modules are ideal for a variety of imaging applications, including automotive, presence detection, robotics, smart cities and the Internet of Things.
"The Teledyne FLIR Lepton module addresses the design engineer's need for a micro imaging solution," said Mike Scott, Vice President of supplier management for Mouser Electronics. "This partnership combines Lipton's technical expertise with Mouser's unmatched customer service and best-in-class logistics to accelerate customers' time-to-market."
Dan Jarvis, Senior Director of Sales for Teledyne FLIR OEM, said: "Mouser will enable customers to access and purchase our imaging modules 24/7, while enhancing the customer NPI experience." "Mouser's reputation for new product launches and support for the design community makes them an excellent partner and resource for our customers."
3.0 and 3.5 are high-resolution LWIR microthermal imaging modules that offer 160 × 120px, 12µm pixel size, uncooled FPA in a small package of 10.5mm × 12.7mm × 7.14mm. Module 3.5 provides a radiant thermal imaging system that covers the entire pixel array and captures accurate, calibrated and non-contact temperature data in each pixel of each image. The 3.0 module is non-radiative.
2.5 LWIR Micro Thermal Imager module provides FPA of 80 x 60 active pixels with a pixel size of 17µm and a package size of 11.5mm x 12.7mm x 6.8mm. The module provides temperature-stable output for radiation processing, plus a fast imaging time of less than 0.5 seconds
Hot Camera Breakthrough Board V2.0 quickly connects all versions of Lepton camera modules to public platforms such as raspberry PI or custom hardware. This easy-to-use evaluation board, created for rapid prototyping and development and not for production use, provides onboard power generation from 3V to 5.5V and a master clock.
