Fecha de Publicación: 2015-08-25
TE's Mezalok, MULTIGIG RT 2-R, CeeLok FAS-T and Fortis Zd series of high-performance interconnects provide high-speed, reliable, lightweight, and rugged solutions in harsh environments such as defense and aerospace.
Mezalok surface mount connectors are specifically designed for stacking or mezzanine applications, ensuring high-speed 5GHz + data rate under the most adverse environmental conditions. The connector has 60 or 114 contact positions, has a four-point Mini-Box contact system based on the VITA 61 standard, and has ultra-high reliability. The 114-position interconnect is designed to support the VITA 61 XMC architecture as a sturdy replacement for the VITA 42 XMC, while the 60-position model is specifically designed for custom architecture stacking applications. Physical characteristics include LCP plastic housing, with excellent thermal stability and low exhaust. The Mezalok connector can withstand 500 fits and can work in a temperature range of -65C to + 125C.
MULTIGIG RT 2-R is a rugged, lightweight, high-speed board-to-board modular interconnect system. VITA 46 conforms to the Open VPX application, which supports Ethernet, Fibre Channel and InfiniBand, as well as PCIe and serial fast I / O high-speed protocols for differential, single-ended, and power signals. The MULTIGIG RT 2-R interconnect is designed for embedded computing applications and is highly shock and vibration resistant due to its four redundant contact system and rugged needle-free interface.
CeeLok FAS-T is one of the smallest and most rugged 10GB Ethernet, field-determinable I / O connectors suitable for the aerospace, defense, and marine markets. Due to the size of its No. 8 housing, space and weight can be saved. CeeLok FAS-T interconnect has crimping, 39029 type contacts, easy termination and on-site maintenance, has a spoon-proof design and a sturdy coupling ring mechanism. The back shell is integrated into the plug body to achieve a low profile, low cost, and reduced weight strain and EMI protection. Electroless nickel and black zinc nickel plating options support soldier system, in-flight entertainment, avionics and communication system applications.
TE's Fortis Zd is a modular backplane connector system that combines high-performance mil / aero specifications with commercial technology in a user-configurable platform. Fortis Zd connectors provide enhanced electrical performance and extremely high mechanical strength for 10+ GB data rate applications. Physical features include a M55302 mini-box detachable interface that provides four contact points on all sides of the pin and interleaved daughter card pin fields on the backplane to provide ESD protection, ensuring reliability and durability Sex. The Fortis ZD interconnect system has multiple functions and can provide standard, shielded and rugged machined metal housing types, as well as 3 and 2 pair versions that can accommodate multiple slot spacing. Applications include fighter jets and other harsh mechanical environment applications, such as spacecraft,
