The primary Bond EP4S-80 is a one-component silver filled epoxy that meets NASA's low vent requirements. It offers unlimited operating life at room temperature and requires moderate heat curing at 80 ° C. Viscosity of 10,000-15,000 CPS, smooth flow and brushability, giving it good EMI/RFI shielding and static loss.
This formulation can also be used for a variety of applications requiring electrical conductivity, such as bonding, coating, sealing, gap filling and encapsulation.
Epoxy resins have excellent mechanical properties, with tensile modulus of 500,000-600,000 psi and compressive strength of 22,000-24,000psi at 25 ° C. This conductive system has a volume resistivity of 0.02-0.06 ohm -cm and a thermal conductivity of 1.30-1.44W/(m•K). After curing, its shrinkage rate is low, dimensional stability is good, glass transition temperature is 130-135C.
This compound is available in the temperature range of -60C to +150C [-75F to +300F] and adheres well to a variety of substrates such as metals, glass, ceramics, composites, semiconductor materials and many plastics. It comes in ounce and pound cans.
