ON announced the introduction of a new series of MOSFET devices with innovative top cooling to help designers solve challenging automotive applications, especially motor control and DC-DC conversion. The new Top Cool device is packaged with TCPAK57, and its size is only 5mm x 7mm. There is a 16.5mm2 thermal bonding pad on the top, which can dissipate heat directly to the radiator, rather than through the traditional printed circuit board (hereinafter referred to as "PCB"). TCPAK57 packaging can fully use both sides of PCB, reduce PCB heating, and improve power density. The new design has higher reliability, thus increasing the service life of the whole system.
Fabio Necco, Vice President of ON and General Manager of Automotive Power Solutions, said: "Cooling is one of the biggest challenges in high power design. Successful solution of this problem is crucial to reduce size and weight, which is also a key consideration in modern automotive design. Our new Top Cool MOSFET not only shows excellent electrical efficiency, but also eliminates the thermal path in PCB, thereby significantly simplifying the design, reducing size and reducing cost."
These devices provide the electrical efficiency required for high power applications, and the RDS (ON) value is as low as 1m Ω. Moreover, the gate charge (Qg) is low (65 nC), thus reducing the loss in high-speed switching applications. ON uses its profound expertise in packaging to provide the highest power density solution in the industry. The first TCPAK57 product portfolio includes 40V, 60V and 80V. All these devices can work at junction temperature (Tj) of 175 ° C and comply with AEC-Q101 vehicle specification certification and production part approval procedure (PPAP). In addition, its gull wing package supports solder joint inspection and achieves excellent board level reliability, which is very suitable for demanding automotive applications. The target application is high/medium power motor control, such as electric power steering and oil pump.
ON now provides samples of these new devices and plans to start full mass production in January 2023
