ON Semiconductor has a new Automotive Intelligent Power Module (IPM) that provides leading power density and improves the overall performance of automotive charging and other high-voltage DC-DC conversion applications for EVs and plug-in PHEVs. The FAM65xxx APM16 packaged device provides a fully integrated solution that simplifies automotive customers' design efforts with a device that includes an H-bridge, PFC, and bridge rectifier configuration to address each OBC and DC-DC stage application.
With the increase in the number of EV and PHEV vehicle designs and the increase in production, these modules meet the rapidly growing market. Compared with discrete component-based solutions, they save about 50% of board space and greatly simplify manufacturability. Their small size, light weight, and high efficiency can significantly increase power density and system efficiency, thereby helping to reduce vehicle fuel consumption and carbon dioxide emissions.
Compared to discrete solutions and other power modules, the company's new IPM also offers enhanced reliability due to optimization of content and internal layout, which provides excellent thermal performance. In addition, since high-voltage capacitors are integrated, EMI can be reduced. The device has an internal direct-bonded copper structure that is completely isolated to 5kV AC / second, eliminating the use of insulation sheets associated with discrete solutions, making it easier to use. Compliance with the latest and most stringent automotive certifications (AECQ 101 and AQG324) also emphasizes safety and reliability.
