Nexperia, a high performance manufacturing specialist in basic semiconductor devices, today announced the launch of the latest product in its rapidly expanding line of copper-clamped FlatPower (CFP) package diodes for industrial and automotive applications. This latest product contains 32 planar Schottky diodes and 8 ultra-fast recovery rectifying diodes, all packaged in the CFP15B. Includes common models and devices with Q in accordance with AEC-Q101 vehicle specifications. By bringing multiple versions of its devices to market, Nexperia underscores its commitment to expand capacity and accelerate the transition to smaller, heat-optimized packages. Gives engineers access to the widest portfolio of CFP package diodes on the market from a single supplier.
These new planar Schottky diodes operate in the range of 30-100 V and 3-15 A. The version (VF) optimized for low forward voltage (including PMEG100V080ELPE/- Q) can provide low conduction loss and high efficiency in anti reverse applications to achieve cost-effective DC-DC converters. These diode devices are also available in low leakage current versions, equipped with ultra-low reverse current and excellent high-temperature performance, which can provide excellent robustness and prevent thermal runaway. Eight 200V single channel fast recovery rectifier diodes (PNE200xxEPE/- Q series) carry 4-10A average forward current (IF), and supplement Nexperia's existing dual channel fast recovery rectifier diodes.
Using this smaller CFP15B package with higher power density to replace DPAK or SMB/C packages can not only maintain the same level of electrical performance, but also save up to 60% of the circuit board space. This durable package design can extend the working time of diode components and improve board level reliability. The optimized pin spacing ensures uniform distribution of solder joints and improves the performance of automatic optical inspection (AOI). This solution is particularly suitable for modern ADAS, EV, LED lighting or ECU applications that rely on advanced high-density design.
