The company developed these packages (part of the MicroPak package family) to provide the smallest footprint for logic functions while ensuring that the pad pitch remains 0.4mm or greater. The company's low-power AUP, AXP, LV and LVC technology families cover more than 100 logic solutions in X2SON's eight, six, five and four-pin packages.
Compared with the five-pin X2SON5, the new four-pin X2SON4 package option reduces the footprint of the same function by 44% and 64% compared to the XSON package.
Nexperia senior product manager Michael Lyons commented, "X2SON4 makes it possible to release smaller buffers and inverters that were previously only available in five-pin or six-pin lead-free packages. All of us X2SON solutions can be miniaturized without using expensive and fragile buck masks. "
