Nexperia has released a new portfolio of dedicated MOSFEts (ASFETs) for automotive airbag applications, the latest in a series of other ASFEts the company offers for battery isolation, motor control, hot swap and PoE applications. One of the most important is the BUk9M20-60EL single N channel 60V 13mOhm logic level MOSFET with LFPAK33 package. Asfet is an MOSFET that has been developed and optimized for use in an application.
Using the company's new enhanced SOA technology, the devices are tailored to provide excellent transient linear mode performance, a key performance indicator in airbag applications. They achieved this performance in the new LFPAK33 package, which utilizes 84% of the board space compared to the older DPAK package, while still maintaining robustness.
Norman Stapelberg, Senior Product Marketing Manager at Nexperia, said: "This asfet combination uses the latest silicon trench technology and a combination of LFPAK packaging, enabling it to meet the latest reliability standards. Using the latest manufacturing and packaging technologies makes the supply chain more Sustainability and enables Nexperia to increase production capacity to meet growing market demand for these products." "Other similar products use older DPAK packaging, often based on DMOS and first-generation trench technology, which are Gradually being phased out by many silicon manufacturers.”
