Micron Technology, Inc. announced that it has mass-produced the world's first 232-layer NAND. It incorporates industry-leading innovations to bring unprecedented performance to storage solutions. Compared with previous generations of NAND, this product has the industry's highest areal density and higher capacity and energy efficiency, which can provide excellent support for data-intensive applications such as client and cloud.
"Micron's 232-layer NAND is the first to scale 3D NAND stacks to more than 200 layers in production, which is a watershed in storage innovation," said Scott DeBoer, executive vice president of technology and products at Micron. "This breakthrough technology benefits from a wide range of innovations, These include advanced process capabilities to create high aspect ratio structures, advances in novel materials, and further design innovations based on Micron's market-leading 176-layer NAND technology."
