Littelfuse - New TVS diode arrays combine high ESD protection with smaller footprints (SP1013)

Littelfuse has introduced four new solutions for the general ESD protection TVS diode array (SPA Diode). These solutions take up less board space than similar industry products. The SP1013 and SP1014 TVS diode arrays fit the standard 0201 footprint, but compared to other 0201 profile solutions, the required board space is reduced by 30%, resulting in a larger gap between components. The company said that the SP1020 and SP1021 series are packaged with the industry ’s smallest ESD protection footprint (01005 flip chip), while the capacitance is nearly 78% lower than similar market solutions. All four products have back-to-back Zener diodes to protect electronic devices that may be subjected to destructive electrostatic discharge (ESD). When AC signals are present, the back-to-back configuration can provide symmetrical ESD protection for data or signal lines. These rugged diodes can safely absorb repeated ESD shocks that exceed the maximum level (level 4, ± 8kV contact discharge) specified by the IEC61000-4-2 international standard without degrading performance. The company said that applications include mobile phones, smartphones, digital cameras, wearable technology, tablets and portable devices. Tim Micun, TVS Diode Array Product Line Manager, said: "These TVS diode arrays are developed for customers in the wireless and wearable device market, who want to achieve high ESD protection performance in the smallest practical footprint." ESD attacks and surge attacks are extremely resistant, helping to extend the life of the end products built into them. "