High durability SSD solutions provide thermal efficiency for HPEC applications | Heisener Electronics
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High durability SSD solutions provide thermal efficiency for HPEC applications

Technology Cover
Fecha de Publicación: 2022-09-06, Advantech Corp

   Advantech has released two new SQFlash PCIe Gen 4 SSD solutions: SQF 930 and SQF ER-1. The Internet of Things is driving the growing demand for high-performance storage. The series is designed in PCIe Gen. 4 form factor and offers dual-stream performance compared to Gen. 3 solutions. Additionally, these solutions are available in M.2 2280 and U.2 (SFF-8639) sizes to suit different requirements. To meet a variety of industrial applications, SQFlash offers different general-purpose, read-intensive, and mixed-use options, allowing edge storage devices to keep up with many different real-time streaming data sources.

   In addition, the SQF 930 and ER-1 series support 3 x DWPD and 1 x DWPD levels to meet different industrial needs. These also support mission-critical applications with a broad temperature capability (-40°C to 85°C). Finally, the ER-1 series is built with low power consumption certification, meeting modern ESG high power and low carbon expectations.

   The development of artificial intelligence technology has expanded the edge of energy consumption and heat. To this end, this series of products adopts thermal glue with excellent mechanical flexibility, which avoids the risk of physical damage to SSD components caused by sudden changes in temperature. Thermal throttling design combined with real-time I/O scaling effectively balances temperature and performance. Furthermore, the adoption of IoT brings unparalleled interconnectivity and raises security concerns.

   Therefore, this series meets these challenges by shielding the data stored on the SQFlash SSD. This is achieved by providing real-time monitoring support at the SSD firmware level and using a complete security solution. And the solution provides industrial cooling capabilities, ensures stable operation and reliability, and meets the unique challenges posed by edge computing. These solutions are designed to maximize system efficiency while accommodating a wide range of harsh conditions and a wide range of temperatures in outdoor/industrial use scenarios.

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