Alliance Memory has released two new industrial-grade eMMC solutions for solid state storage in consumer, industrial and network applications. Single 11.5mm x 13mm 153-Ball FBGA package includes 4GB ASFC4G31M-51bin and 8GB ASFC8G31m-51bin to combine NAND flash with eMMC controller and FTL management software.
Asfc4g31m-51bin and ASFC8G31m-51bin are also backward compatible with eMMC V4.5 and V5.0. These devices comply with JEDEC eMMC V5.1 industry standards and support startup operations, replay protected memory blocks (RPMB), device health reports, power outage notifications, on-site firmware updates, enhanced stroboscope, and more. For faster and more reliable operation, write equalization, safe trim/erase, high-priority interrupts, and high-speed HS200 and HS400 modes.
EMMC will be used in smartwatches, digital TVS, set-top boxes, tablets, VR and AR headsets, infotainment, CCTV, surveillance, digital cameras, automation, point-of-sale systems and emerging embedded applications. For designers, these devices simplify design, allowing for quick and easy system integration in these products -- accelerating product development and time-to-market -- while saving space by eliminating the need for external controllers. In addition, the device's FTL software provides high reliability and stable performance through wear balancing and bad block management.
The NAND memory of the built-in LDO can be powered by a single 3V power supply, while the controller can be powered by 1.8V or 3V dual power supply. The device operates in the industrial temperature range of -40 ° C to +85 ° C and offers programmable bus widths of X1, X4 and X8.
