Amphenol - Compact power-to-board solutions deliver higher current at lower temperatures (C360G01041E1Z) | Heisener Electronics
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Amphenol - Compact power-to-board solutions deliver higher current at lower temperatures (C360G01041E1Z)

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Fecha de Publicación: 2015-10-17
Amphenol's RADSOK onboard power supply product line, this portfolio offers many options for providing high current and single point connections to PCBs, all of which combine Amphenol's proven and proprietary RADSOK technology, which Designed to meet today's demands for higher current, more efficient power supplies for greater system integration. This product provides current carrying capacity up to 200A, and due to its hyperbolic thin-sheet socket contact structure, it can provide higher current at lower temperatures than traditional contact systems. RADSERT is a universal thin single-point high-current contact that can be applied to PCBs or busbars. They feature enhanced lead-in and misalignment tolerances, current carrying capabilities up to 120A, are suitable for blind hole applications, and are available in a press-fit or soldered version termination style. PowerBlok connectors have a rugged mechanical design with multiple electrical contact redundancy points to ensure reliability. With a current rating of up to 200A, RADSOK contacts and a small footprint, they are ideal for applications where space and weight are critical. Large misalignment tolerances or "floating" can handle blind match situations. For high-speed backplane and midplane applications, PowerBlok has pin terminations that conform to press fit. PGY is a series of orthogonal card edge connectors that are available in multiple sizes up to 200A. The PGY card edge connector uses a very robust mechanical design that is optimized to dissipate heat and provide high power to the PCB evenly. They are perfect for blind drawer applications. PowerBlok WTB (Wire-to-Board) is a low profile wire-to-board connector with a rated current up to 70A. They are available as single point contact terminals in vertical or horizontal mating planes and feature Amphenol's patented RADSOK technology. The removable lock case ensures that the fit with the motherboard remains intact even under harsh vibration conditions. Designed for placement through pinholes, they are available in tape and reel packaging.