Altek unveils 3D-depth sensing chip at CES 2018 | Heisener Electronics
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Altek unveils 3D-depth sensing chip at CES 2018

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Fecha de Publicación: 2018-01-12
It targets smart surveillance cameras and VR / AR cameras.   The company said that the real-time depth information provided by the AL6100 can more accurately show the application's environment. For example, poses and attitudes of people nearby.   Jason Lin, Altek senior vice president, said: "Our first-generation real-time deep chip AL3200, launched in 2016, has achieved tremendous success in millions of smartphones and portable devices worldwide.   "We are now pleased to announce that the combination of the next-generation AL6100 deep chip and active infrared lights will further improve our real-time depth quality and computing capabilities to support a wide range of application assistants such as smartphones, surveillance, autonomous vehicles and smart home . "Man-machine, sweeping robot, etc. "   The chip is expected to ship by the end of March.   A demo of the AL6100 surveillance camera at CES can be found on the MP 25960 on the second floor of CES 2.