The new features enable electronic circuit and system designers in the automotive and industrial markets to jointly validate power devices and drive IC thermal issues on a variety of solution circuits. Is a new thermal analysis feature that ROHM recently added to its ROHM Solution Simulator.
The simulator runs on the company's web site and is free for all kinds of simulations -- from component selection to device-specific and even system-level validation. This helps to easily and accurately validate its products under near-real-world application conditions, such as SiC devices in power semiconductors, drive/power ics, and passive components in solution circuits.
The newly added thermal analysis capability can be used to solve circuits in devices and applications where heat can become a problem in electronic circuit design. For example, PTC heaters, shunt resistors, DC-DC converter ics and LED drivers are equipped with IGBT to meet the growing need to operate analog temperatures through circuits. This is the only simulator in the industry that allows web-based electrical and thermal coupling analysis of not only semiconductor chip (junction) temperature during operation but also pin temperature and hot plate component solutions for circuit interference, including semiconductors and integrated circuits with power passive components.
So, thermal analysis that used to take a day can now be done in about 10 minutes (100 times faster than traditional methods). This enables users to quickly and easily check the temperature of various parts of the device before prototyping, reducing the need for rework. At the same time, heat is a problem for applications that require a reduced number of development resources.
The solution is free to use by registering on the company's website. Along with the simulator, dedicated web pages provide the videos and files needed for use.
