A versatile USB-based platform designed to test the functional operation of various sensor types, the Rohm sensor evaluation kit includes one Base board and several Breakout boards, making them easy to implement on the most popular boards and on standard PCs.
Today’s smart and intelligent solutions need to be created with the maximum possible power savings. Whether the energy source is energy harvesting, battery-/capacitor-powered, or from power grid, power conversion must become as efficient as possible to conserve available energy within the circuit.
The Texas Instruments (TI) MSP430 family of ultra low-power microcontrollers consists of several devices featuring different sets of peripherals for various applications. The architecture, combined with five low-power modes, is optimized to achieve extended battery life in portable measurement applications.
The Analog Devices AD8229 ultra low-noise instrumentation amplifier is designed for measuring small signals in the presence of large common-mode voltages and high temperatures. The AD8229 is designed for high-temperature operation. The process is dielectrically isolated to avoid leakage currents at high temperatures.
Versatile Molex SPOX wire-to-board connectors offer an extremely wide-variety of mating configurations for pitch sizes from 2.5mm to 5.08mm. The name SPOX comes from the shape of the terminal, which is like a ‘spring box’. This design style provides multiple points of contact, protects the mating interface area, and prevents fish-hooking from wires during handling.
Latest from Vishay is news of the expansion of its popular VY1 Compact series of AC-line-rated ceramic disc safety capacitors with new devices offering reduced sizes and higher pulse strength up to 10kV.
Lighting class solutions designed for high-performance general lighting applications, Luminus XNOVA Cube mid-power LEDs allow engineers and designers to develop lighting solutions with maximum efficacy, brightness and overall quality, says the company.
Molex Ditto wire-to-wire interconnects and pre-assembled harnesses can halve the tooling and operational costs of plug-and-receptacle power systems. They increase cost-savings and operational efficiency of low-current consumer and lighting applications.
TE Connectivity’s highly-versatile Alcoswitch DIP switch products are in through-hole, gull-wing surface-mount, and J-Lead surface-mount terminations with both tube and tape-and-reel packaging available.
Maxim’s MAXREFDES37 IO-Link servo driver reference design which provides 5V power, four PWM outputs and four digital inputs allowing control of up to four 5V servo motors. IO-Link offers the ability to replace pneumatic actuators, and their compressed air lines. With added level translation, the digital inputs allow for interfacing to binary position or status sensors.
Latest from Texas Instruments, the HD3SS460 is a high-speed bi-directional passive switch in mux or demux configurations. Based on control pin POL the device provides switching to accommodate connector flipping.
Molex’s Mini50 single- and dual-row receptacles are offering 50% space savings over traditional USCAR 0.64mm connectors. They are available sealed or unsealed, with smaller terminals to fit more low-current electrical circuits in interior transportation-vehicle environments.
Designed for point-of-load (PoL) supplies, Exar 10A (XR79110), 15A (XR79115) and 20A (XR79120) XR791xx synchronous step-down power modules. They target applications such as networking and communications, fast-transient PoL designs, industrial and medical equipment, and embedded high-power FPGA circuitry.
Toshiba Electronics Europe has announced a new, high-capacity addition to its MC04 Series HDDs. The new 6TB version of the MC04 Series of enterprise high-capacity HDDs is designed for bulk storage systems and servers supporting cloud-based applications and scale-out workloads.
Latest from Microchip comes news of the expansion of its human interface solutions portfolio with the MTCH6303, an innovative, turnkey projected-capacitive touch controller for touch pads and screens. Touch sensors with up to 1000 nodes and diagonals of up to 10-inch are supported.
Laird’s CoolZorb 400 Hybrid Thermal / EMI Absorber – a hybrid absorber/thermal management material used for EMI mitigation. The material is used like a traditional thermal interface material between heat sources like an IC and heat sink or other heat transfer device or metal chassis.
InfoVue high / low-temperature LCDs which provide a number of key benefits including reliable performance in a wider range of extreme temperatures, enhanced visual display quality, and significant technology cost and energy savings.
Avago’s 5MBd digital optocouplers. The range is primarily designed around lower power consumption and lower supply voltage applications such as motor control or computer peripheral interface. The ACPL-x2xL devices draw less than 10mW without compromising signal isolation capability or integrity.
