Página 13 - Nuevas tecnologías | Heisener Electronics
Contáctenos
SalesDept@heisener.com 86-755-83210559-843
Language Translation

* Please refer to the English Version as our Official Version.

Nuevas tecnologías

Registros 4.652
Página  13/259
Technology Cover

2023-05-18, Infineon acquires Imagimob, a leader in micro-machine learning

Infineon Technologies has announced that it has acquired Stockholm-based start-up Imagimob LTD., a leading platform provider that enables the development of machine learning (ML) solutions on edge devices. With this acquisition, Infineon further strengthens its position as a provider of world-class machine learning solutions and significantly expands its AI product lineup.

Technology Cover

2023-05-18, Texas Instruments ultra low power mcu provides high performance analog peripheral integration

The Texas Instruments MSPM0L134x and MSPM0L130x MCUs are part of MSP’s highly integrated, ultra-low-power 32-bit MSPM0 MCU family based on the enhanced Arm Cortex-M0+ core platform functioning at up to 32MHz frequency. These cost-optimised MCUs provide high-performance analog peripheral integration, support extended temperature ranges from -40C to 125C, and operate with supply voltages ranging from 1.62V to 3.6V.

Technology Cover

2023-05-17, Achieve the highest power density voltage stabilized DC/DC converter

A new reference design from EPC and ADI uses a new, fully optimized Analog controller to drive EPC's gallium nitride FET, achieving an efficiency of more than 96.5%.

Technology Cover

2023-05-17, Bel Power Solutions introduces TEC2200/2401/2600 AC-DC front-end power supply

Bel Power Solutions TEC2200/2401/2600 AC-DC front-end power supply is a hot-swappable public redundant power supply (CRPS) that supports N+1 redundancy architecture. These power supplies convert standard AC mains/high voltage direct current (HVDC) busbar voltage to 12VDC main power output to power systems using a distributed power architecture.

Technology Cover

2023-05-17, Rotary and linear magnetic position sensors for automotive and industrial applications

A definite trend in the automotive industry is autonomous driving. Although there is still some way to go before the practical application of fully autonomous driving, related research and development and application are in full swing, which is fully reflected in the increasingly rich and perfect advanced driver assistance systems (ADAS). The A31315 is a rotating and linear magnetic position sensor from Allegro's 3DMAG™ family for automotive and industrial applications that combines Allegro's long-proven planar and vertical Hall effect technology

Technology Cover

2023-05-17, A new generation of dual-channel isolated grid driver IC that improves the performance of SMPS designed systems

To meet the latest technologies such as gallium nitride (GaN) power switches for high-voltage DC-DC power conversion, Infineon Technologies has introduced a new family of dual-channel electrically isolated EiceDRIVER™ gate driver IC products.

Technology Cover

2023-05-17, Toshiba launches Overtemperature Detection IC ThermoflaggerTM series IC

Toshiba Electronics Components and Memory Devices Inc. announced the launch of the first two products in the overtemperature Detection IC ThermoflaggerTM series: "TCTH021BE" FLAG signal with no latch function when an abnormal state is detected, and "TCTH022BE" FLAG signal detection with latch function. They use positive temperature coefficient (PTC) thermistors to detect temperature rise inside electronic devices in simple circuit configurations.

Technology Cover

2023-05-17, The smaller, thinner and lighter FO-USON8 is packaged with 128Mb SPI NOR Flash

Industry leading semiconductor device supplier GigaDevice has announced the launch of SPI NOR Flash GD25LE128EXH in a 3mm×3mm×0.4mm FO-USON8 package with a maximum thickness of only 0.4mm and a capacity of up to 128Mb. It is the smallest plastic packaging product that can be realized in this capacity in the industry at present.

Technology Cover

2023-05-17, STMicroelectronics releases flexible isolated step-down converter chips

The L6983i 10W isolated step-down (iso-buck) converter is a compact, energy efficient, and flexible package that protects power conversion and gate drives for IGBT, SiC, and GaN transistors. Low static current, 3.5V-38V wide input voltage and other advantages.

Technology Cover

2023-05-17, Intel's AI edge computing technology is helping grassroots medical innovation and upgrading

Intel held a forum with the theme of "AI edge Computing enables medical imaging to help grassroots medical innovation and upgrading". At the forum, professionals from Intel, industry associations and leading enterprises in the medical field had an in-depth discussion on how to help grassroots medical informatization construction through the integration of medical AI and cloud edge, and improve the efficiency of medical services and medical staff work experience and other important issues.

Technology Cover

2023-05-16, Infineon's high-power modules help to drive energy saving electrified trains to decarburize

To meet global climate targets, transport must switch to greener vehicles, such as fuel-efficient electrified trains. However, trains operate under harsh operating conditions, requiring frequent acceleration and braking and reliable operation over a long service life. Therefore, they require energy efficient traction applications with high power density, high reliability and high quality. Infineon Technologies has responded to these needs by adding two new products to its CoolSiC™ power module portfolio: FF2000UXTR33T2M1 and FF2600UXTR33T2M1

Technology Cover

2023-05-16, Digital twin signaling is used to realize advanced prototype design of semiconductor wafers

Keysight Technologies has released a new Universal Signal Processing Architecture (USPA) modeling platform that enables semiconductor companies to fully prototype, validate, and pre-stream chips using fully compatible, standards-based digital twin signals in a real-time development environment. M8135A - Pre-configured USPA system suitable for single-channel transceiver related applications.

Technology Cover

2023-05-16, To help achieve innovative design of OEM system, Grayhill series precision switches were sold

Eromun, Anfulinet's global distributor of electronic components and solutions, announced that it has signed a global distribution agreement with Grayhill, a leading global manufacturer of precision switches, to become Grayhill's new authorized distributor. Through this agreement, e ROM will provide customers in Europe, the Middle East and Africa and Asia Pacific with a range of high-quality human-machine interface products to enable innovative design of OEM systems

Technology Cover

2023-05-16, Infineon launches new IC for automotive applications

Infineon Technologies Inc. introduces the OptiMOS™ 7 40V MOSFET family. As Infineon's newest generation of power mosFeTs for automotive applications, OptiMOS™ 7 40V MosFeTs offer a variety of pin-free, rugged power packages. The product line uses 300mm thin wafer technology and innovative packaging, which offers significant performance advantages over other devices that are microencapsulated.

Technology Cover

2023-05-16, Littelfuse introduces Series 150520 in-line fuse holder

Littelfuse's latest 150520 Series in-line fuse holder is rated for 600VAC/VDC, current 20A and size 5x20mm. These convenient in-line fuses are ideal for applications that require supplemental circuit protection, including data centers, industrial HVAC, and power supplies. The 150520 offers eight-inch pre-stripped leads and pre-installed fuse clips for quick installation.

Technology Cover

2023-05-16, Bourns expands office and electrification laboratory in Cork, Ireland

A leading manufacturer of electronic components for power, protection and sensing solutions, Bourns has added a large office and a new electrification laboratory in Cork, Ireland, to meet the growing demand for advanced power electronics and sensing solutions

Technology Cover

2023-05-16, Intel and BCG announced a partnership to deliver enterprise-level secure generative AI

Boston Consulting Group (BCG) and Intel (Intel) announced a strategic partnership to leverage Intel's end-to-end AI hardware and software to enable Generative artificial Intelligence (GenAI) to bring fully customized and proprietary solutions to enterprise customers, It also isolates private data in its trusted environment.

Technology Cover

2023-05-16, Elektrobit joins BlackBerry to build advanced autonomous driving system

Elektrobit has announced a partnership with BlackBerry to provide basic software support for the new Neighborhood Electric Vehicle, a leading Chinese luxury NEV manufacturer. Elektrobit's state-of-the-art AUTOSAR Adaptive software platform and BlackBerry QNX are ISO 26262 ASIL D certified operating systems. Together, they have laid a complete pre-integration foundation for the development of ADAS electronic control units (ECUs) with enhanced vehicle safety levels.