The new flagship Immortalis GPU will significantly optimize the Android gaming experience and debut hardware-based ray tracing capabilities. The latest Armv9 CPU brings peak and efficiency performance to a whole new level. The new Arm Total Compute Solutions Level of performance, efficiency, and scalability requirements for the specialized processing needs of various consumer device markets
Vishay's new 24 V XClampR transient voltage suppressor delivers state-of-the-art performance, bidirectional device high power dissipation and high pulse current combined with high temperature stability for automotive, communications and industrial applications
Microchip Technology Inc now offers the LX34070 IC that has been purpose-built for EV motor control applications. It incorporates differential outputs, fast sample rates and features that make it functional-safety-ready for ISO 26262 compliance in the Automotive Safety Integrity Level–C (ASIL–C) classification.
Codasip, a leader in silicon intellectual property (IP) for customizable RISC-V processors, has announced that its Codasip Studio platform now supports Apple's macOS Monterey, the current major version of macOS. Codasip Studio is a processor design automation platform for customizing Codasip's leading RISC-V processor IP, enabling designers to quickly and easily customize their processor designs to achieve maximum performance for dome-specific applications.
Allegro has introduced the A33110 and A33115 magnetic position sensors, two of the latest sensors designed for advanced Driver Assistance Systems (ADAS) applications requiring high accuracy and heterogeneous signal redundancy. Integrates Allegro's Vertical Hall technology (VHT) with leading tunnel reluctance (TMR) technology in one sensor package. The new sensors feature new technologies such as TMR and vertical Hall elements that combine industry-leading precision with the built-in redundancy required for safety-critical systems
Onsemi is one of the few suppliers of end-to-end SiC solutions from substrate to module. Onsemi is a leading supplier of intelligent power solutions with a strong history in the SiC field. Its innovative VE TracTM Direct SiC and VE-TRACTM B2 SiC solutions use stable and reliable planar SiC technology, combined with sintering technology and die casting packaging, to help designers address these challenges,
Analog Devices, Inc. (ADI) announced the launch of its first high-resolution, industrial quality, indirect time of flight (iToF) module for 3D depth of field measurement and vision systems. The new ADTF3175 module enables cameras and sensors to sense 3D space at one megapixel resolution, providing iToF technology with accuracy up to +/-3mm for machine vision applications such as industrial automation, logistics, healthcare and augmented reality.
JAI announced the expansion of the GO-X series of small machine vision cameras to include 24 new global shutter models equipped with SONY's latest Pregius S CMOS sensor. The new models provide two types of interfaces. Twelve models are configured with CoaXPress 2.0 interfaces and the other twelve models are configured with GigE Vision (1000Base-T) interfaces.
Socionext announced that samples of its IEEE1901-2020 HD-PLC communications chip "SC1320A" will begin shipping in June, with mass production scheduled to begin in the third quarter of 2022. The chip is the world's first IP core chip with semiconductor design that complies with IEEE1901-2020 standard authorized by Panasonic.
Intel Research has announced significant progress in its integrated optoelectronics research, the next frontier in improving bandwidth for computing chip connectivity within and across data centers. This latest research represents an industry-leading advance in the field of multiwavelength integrated optics, demonstrating a fully integrated eight-wavelength distributed feedback (DFB) laser array on a silicon wafer with output power uniformity of +/ -0.25 dB (dB) and wavelength spacing uniformity of ±6.5%, both superior to industry specifications.
Backed by Microsoft, IAR Systems now provides its embedded expertise and software solutions to millions of developers around the world using Visual Studio Code to respond quickly to market demands and further accelerate the development process
New STMicroelectronics Inertial Sensor Module Enables In-Sensor AI Training, On-Chip Signal Processing Core, Programmable with STMicroelectronics' NanoEdge AI Studio, Ideal for Developing Machine Learning Applications
Transphorm Introduces Reference Design Portfolio to Accelerate Development of USB-C PD Gallium Nitride Power Adapters. Seven in-house and co-developed design tools bring the benefits of high-performance 650V GaN FETs to 45W to 140W adapters
Bourns Introduces a New Line of Photovoltaic Grade (gPV) Power Fuses. Bourns® Introduces Two POWrFuse™ Power Fuses Series with High Power Ratings and Designed to Meet UL 248 and IEC 60269 Standards
Hosted by Intel, OpenVINO™ DevCon China 2022 was successfully held in the form of an online summit, bringing together many leading companies from various industries. Event in the global OpenVINO ™ developers, OpenVINO ™ core technical experts to share the latest product information and technical demonstration, also conducted a number of large cafe industry insights, core technology, such as case show multidimensional sharing and communication, to help developers in promoting technical level at the same time, broaden the professional field of vision, understanding of industry trends.
Engineers in Sydney have demonstrated a quantum integrated circuit made of just a few atoms. By precisely controlling the quantum states of atoms, the new processors can mimic the structure and properties of molecules to free up new materials and catalysts. The new Quantum circuit was developed by researchers at the University of New South Wales (UNSW) and a startup called Silicon Quantum Computing(SQC).
Allegro announced the launch of two new full-bridge gate drivers for automotive and industrial applications. These devices feature direct control (A89505) and pulse-width modulation (A89506) options to streamline system design by up-integrating critical functions. Replace mechanical relays with solid state drives to improve performance and reliability.
Diodes corporation (Diodes) today announced the release of the PCIe® 3.0 packet switcher IC. The PI7C9X3G1632GP provides flexible multi-port and channel width combinations for improved performance and availability. Packet switcher comes in a 676 pin FCBGA package with dimensions of 27mm x 27mm.
