Xilinx Inc. Productos

XCZU2CG-2SFVC784I

Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 533MHz, 1.3GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 103K+ Logic Cells
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 784-BBGA, FCBGA
• Supplier Device Package: 784-FCBGA (23x23)

Paquete: 784-BBGA, FCBGA

XCV800-5HQ240C

Xilinx Inc.

IC FPGA 166 I/O 240HQFP

• Number of LABs/CLBs: 4704
• Number of Logic Elements/Cells: 21168
• Total RAM Bits: 114688
• Number of I/O: 166
• Number of Gates: 888439
• Voltage - Supply: 2.375 V ~ 2.625 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 240-BFQFP Exposed Pad
• Supplier Device Package: 240-PQFP (32x32)

Paquete: 240-BFQFP Exposed Pad

XCV405E-6FG676I

Xilinx Inc.

IC FPGA 404 I/O 676FBGA

• Number of LABs/CLBs: 2400
• Number of Logic Elements/Cells: 10800
• Total RAM Bits: 573440
• Number of I/O: 404
• Number of Gates: 129600
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

Paquete: 676-BBGA, FCBGA

XCV2000E-7BG560I

Xilinx Inc.

IC FPGA 404 I/O 560MBGA

• Number of LABs/CLBs: 9600
• Number of Logic Elements/Cells: 43200
• Total RAM Bits: 655360
• Number of I/O: 404
• Number of Gates: 2541952
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 560-LBGA, Metal
• Supplier Device Package: 560-MBGA (42.5x42.5)

Paquete: 560-LBGA, Metal

XC4044XL-3BG432C

Xilinx Inc.

IC FPGA 320 I/O 432MBGA

• Number of LABs/CLBs: 1600
• Number of Logic Elements/Cells: 3800
• Total RAM Bits: 51200
• Number of I/O: 320
• Number of Gates: 44000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 432-LBGA, Metal
• Supplier Device Package: 432-MBGA (40x40)

Paquete: 432-LBGA, Metal

XC7VH870T-L2FLG1932E

Xilinx Inc.

IC FPGA 300 I/O 1932FCBGA

• Number of LABs/CLBs: 68450
• Number of Logic Elements/Cells: 876160
• Total RAM Bits: 51978240
• Number of I/O: 300
• Number of Gates: -
• Voltage - Supply: 0.97 V ~ 1.03 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: 1932-FCBGA (45x45)

Paquete: -

XQ7VX485T-1RF1930M

Xilinx Inc.

IC FPGA VIRTEX-7 485K 1930BGA

• Number of LABs/CLBs: 37950
• Number of Logic Elements/Cells: 485760
• Total RAM Bits: 37969920
• Number of I/O: 700
• Number of Gates: -
• Voltage - Supply: 0.97 V ~ 1.03 V
• Mounting Type: Surface Mount
• Operating Temperature: -55°C ~ 125°C (TJ)
• Package / Case: 1924-BBGA, FCBGA
• Supplier Device Package: 1930-FCBGA (45x45)

Paquete: 1924-BBGA, FCBGA

XCVU080-3FFVA2104E

Xilinx Inc.

IC FPGA 832 I/O 2104FCBGA

• Number of LABs/CLBs: 55714
• Number of Logic Elements/Cells: 975000
• Total RAM Bits: 51200000
• Number of I/O: 832
• Number of Gates: -
• Voltage - Supply: 0.970 V ~ 1.030 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 2104-BBGA, FCBGA
• Supplier Device Package: 2104-FCBGA (47.5x47.5)

Paquete: 2104-BBGA, FCBGA

XC7VX690T-2FFG1761I

Xilinx Inc.

IC FPGA 850 I/O 1761FCBGA

• Number of LABs/CLBs: 54150
• Number of Logic Elements/Cells: 693120
• Total RAM Bits: 54190080
• Number of I/O: 850
• Number of Gates: -
• Voltage - Supply: 0.97 V ~ 1.03 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1761-FCBGA (42.5x42.5)

Paquete: 1760-BBGA, FCBGA

XC6VLX365T-3FF1759C

Xilinx Inc.

IC FPGA 720 I/O 1759FCBGA

• Number of LABs/CLBs: 28440
• Number of Logic Elements/Cells: 364032
• Total RAM Bits: 15335424
• Number of I/O: 720
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1759-FCBGA (42.5x42.5)

Paquete: 1760-BBGA, FCBGA

XC5VLX155-2FF1153I

Xilinx Inc.

IC FPGA 800 I/O 1153FCBGA

• Number of LABs/CLBs: 12160
• Number of Logic Elements/Cells: 155648
• Total RAM Bits: 7077888
• Number of I/O: 800
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1153-BBGA, FCBGA
• Supplier Device Package: 1153-FCBGA (35x35)

Paquete: 1153-BBGA, FCBGA

XC7K420T-L2FFG901E

Xilinx Inc.

IC FPGA 380 I/O 901FCBGA

• Number of LABs/CLBs: 32575
• Number of Logic Elements/Cells: 416960
• Total RAM Bits: 30781440
• Number of I/O: 380
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 900-BBGA, FCBGA
• Supplier Device Package: 901-FCBGA (31x31)

Paquete: 900-BBGA, FCBGA

XC6VCX240T-1FFG1156I

Xilinx Inc.

IC FPGA 600 I/O 1156FCBGA

• Number of LABs/CLBs: 18840
• Number of Logic Elements/Cells: 241152
• Total RAM Bits: 15335424
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1156-FCBGA (35x35)

Paquete: 1156-BBGA, FCBGA

XCKU040-1FFVA1156C

Xilinx Inc.

IC FPGA 520 I/O 1156FCBGA

• Number of LABs/CLBs: 30300
• Number of Logic Elements/Cells: 530250
• Total RAM Bits: 21606000
• Number of I/O: 520
• Number of Gates: -
• Voltage - Supply: 0.922 V ~ 0.979 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1156-FCBGA (35x35)

Paquete: 1156-BBGA, FCBGA

XC6VLX195T-2FFG784C

Xilinx Inc.

IC FPGA 400 I/O 784FCBGA

• Number of LABs/CLBs: 15600
• Number of Logic Elements/Cells: 199680
• Total RAM Bits: 12681216
• Number of I/O: 400
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 784-BBGA, FCBGA
• Supplier Device Package: 784-FCBGA (29x29)

Paquete: 784-BBGA, FCBGA

XC2VP30-6FGG676I

Xilinx Inc.

IC FPGA 416 I/O 676FBGA

• Number of LABs/CLBs: 3424
• Number of Logic Elements/Cells: 30816
• Total RAM Bits: 2506752
• Number of I/O: 416
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 676-BGA
• Supplier Device Package: 676-FBGA (27x27)

Paquete: 676-BGA

XC2VP30-6FFG1152C

Xilinx Inc.

IC FPGA 644 I/O 1152FCBGA

• Number of LABs/CLBs: 3424
• Number of Logic Elements/Cells: 30816
• Total RAM Bits: 2506752
• Number of I/O: 644
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FCBGA (35x35)

Paquete: 1152-BBGA, FCBGA

XC7K160T-L2FBG676E

Xilinx Inc.

IC FPGA 400 I/O 676FCBGA

• Number of LABs/CLBs: 12675
• Number of Logic Elements/Cells: 162240
• Total RAM Bits: 11980800
• Number of I/O: 400
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

Paquete: 676-BBGA, FCBGA

XC6SLX75T-2FG676I

Xilinx Inc.

IC FPGA 348 I/O 676FCBGA

• Number of LABs/CLBs: 5831
• Number of Logic Elements/Cells: 74637
• Total RAM Bits: 3170304
• Number of I/O: 348
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

Paquete: 676-BBGA, FCBGA

XC2S150-5FGG256C

Xilinx Inc.

IC FPGA 176 I/O 256FBGA

• Number of LABs/CLBs: 864
• Number of Logic Elements/Cells: 3888
• Total RAM Bits: 49152
• Number of I/O: 176
• Number of Gates: 150000
• Voltage - Supply: 2.375 V ~ 2.625 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 256-BGA
• Supplier Device Package: 256-FBGA (17x17)

Paquete: 256-BGA

XA6SLX16-3CSG225I

Xilinx Inc.

IC FPGA 160 I/O 225CSGBGA

• Number of LABs/CLBs: 1139
• Number of Logic Elements/Cells: 14579
• Total RAM Bits: 589824
• Number of I/O: 160
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 225-LFBGA, CSPBGA
• Supplier Device Package: 225-CSPBGA (13x13)

Paquete: 225-LFBGA, CSPBGA

XC6SLX16-N3FT256C

Xilinx Inc.

IC FPGA 186 I/O 256FTBGA

• Number of LABs/CLBs: 1139
• Number of Logic Elements/Cells: 14579
• Total RAM Bits: 589824
• Number of I/O: 186
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 256-LBGA
• Supplier Device Package: 256-FTBGA (17x17)

Paquete: 256-LBGA

XC95216-10BG352C

Xilinx Inc.

IC CPLD 216MC 10NS 352BGA

• Programmable Type: In System Programmable (min 10K program/erase cycles)
• Delay Time tpd(1) Max: 10.0ns
• Voltage Supply - Internal: 4.75 V ~ 5.25 V
• Number of Logic Elements/Blocks: 12
• Number of Macrocells: 216
• Number of Gates: 4800
• Number of I/O: 166
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 352-LBGA, Metal
• Supplier Device Package: 352-MBGA (35x35)

Paquete: 352-LBGA, Metal

XCR3384XL-10TQ144C

Xilinx Inc.

IC CPLD 384MC 9NS 144QFP

• Programmable Type: In System Programmable (min 1K program/erase cycles)
• Delay Time tpd(1) Max: 9.0ns
• Voltage Supply - Internal: 3 V ~ 3.6 V
• Number of Logic Elements/Blocks: 24
• Number of Macrocells: 384
• Number of Gates: 9000
• Number of I/O: 118
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 144-LQFP
• Supplier Device Package: 144-TQFP (20x20)

Paquete: 144-LQFP

XC95288XL-7FG256I

Xilinx Inc.

IC CPLD 288MC 7.5NS 256PFBGA

• Programmable Type: In System Programmable (min 10K program/erase cycles)
• Delay Time tpd(1) Max: 7.5ns
• Voltage Supply - Internal: 3 V ~ 3.6 V
• Number of Logic Elements/Blocks: 16
• Number of Macrocells: 288
• Number of Gates: 6400
• Number of I/O: 192
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 256-BGA
• Supplier Device Package: 256-FBGA (17x17)

Paquete: 256-BGA

XCVU13P-L2FHGC2104E

Xilinx Inc.

IC FPGA VIRTEX-UP 2104FCBGA

• Number of LABs/CLBs: 216000
• Number of Logic Elements/Cells: 3780000
• Total RAM Bits: 514867200
• Number of I/O: 416
• Number of Gates: -
• Voltage - Supply: 0.698 V ~ 0.876 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 110°C (TJ)
• Package / Case: 2104-BBGA, FCBGA
• Supplier Device Package: 2104-FCBGA (52.5x52.5)

Paquete: 2104-BBGA, FCBGA

XCVU160-2FLGC2104E

Xilinx Inc.

IC FPGA VIRTEX-U 2104FCBGA

• Number of LABs/CLBs: 115800
• Number of Logic Elements/Cells: 2026500
• Total RAM Bits: 130969600
• Number of I/O: 416
• Number of Gates: -
• Voltage - Supply: 0.922 V ~ 0.979 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 2104-BBGA, FCBGA
• Supplier Device Package: 2104-FCBGA (47.5x47.5)

Paquete: 2104-BBGA, FCBGA

XCDAISY-FFG668

Xilinx Inc.

FFG668 DAISY SAMPLE

• Number of LABs/CLBs: -
• Number of Logic Elements/Cells: -
• Total RAM Bits: -
• Number of I/O: -
• Number of Gates: -
• Voltage - Supply: -
• Mounting Type: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

Paquete: -