Xilinx Inc. Productos

XC18V04PCG44C

Xilinx Inc.

IC PROM REPROGR 4MB 44-PLCC

• Programmable Type: In System Programmable
• Memory Size: 4Mb
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 44-LCC (J-Lead)
• Supplier Device Package: 44-PLCC (16.59x16.59)

Paquete: 44-LCC (J-Lead)

XCZU17EG-2FFVD1760E

Xilinx Inc.

IC FPGA 308 I/O 1760FCBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.5GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 926K+ Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FCBGA (42.5x42.5)

Paquete: 1760-BBGA, FCBGA

XC7Z035-3FFG900E

Xilinx Inc.

IC SOC CORTEX-A9 KINTEX7 900BGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 800MHz
• Primary Attributes: Kintex?-7 FPGA, 275K Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 900-BBGA, FCBGA
• Supplier Device Package: 900-FCBGA (31x31)

Paquete: 900-BBGA, FCBGA

XC5VLX110-1FFG1760CES

Xilinx Inc.

IC FPGA 800 I/O 1760FBGA

• Number of LABs/CLBs: 8640
• Number of Logic Elements/Cells: 110592
• Total RAM Bits: 4718592
• Number of I/O: 800
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FCBGA (42.5x42.5)

Paquete: 1760-BBGA, FCBGA

XC4028XL-3HQ160C

Xilinx Inc.

IC FPGA 129 I/O 160HQFP

• Number of LABs/CLBs: 1024
• Number of Logic Elements/Cells: 2432
• Total RAM Bits: 32768
• Number of I/O: 129
• Number of Gates: 28000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 160-BQFP Exposed Pad
• Supplier Device Package: 160-PQFP (28x28)

Paquete: 160-BQFP Exposed Pad

XC4013XL-2PQ160C

Xilinx Inc.

IC FPGA 129 I/O 160QFP

• Number of LABs/CLBs: 576
• Number of Logic Elements/Cells: 1368
• Total RAM Bits: 18432
• Number of I/O: 129
• Number of Gates: 13000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 160-BQFP
• Supplier Device Package: 160-PQFP (28x28)

Paquete: 160-BQFP

XC4008E-1PG191C

Xilinx Inc.

IC FPGA 144 I/O 191CPGA

• Number of LABs/CLBs: 324
• Number of Logic Elements/Cells: 770
• Total RAM Bits: 10368
• Number of I/O: 144
• Number of Gates: 8000
• Voltage - Supply: 4.75 V ~ 5.25 V
• Mounting Type: Through Hole
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 191-BCPGA
• Supplier Device Package: 191-CPGA (47.25x47.25)

Paquete: 191-BCPGA

XCVU080-2FFVA2104E

Xilinx Inc.

IC FPGA 832 I/O 2104FCBGA

• Number of LABs/CLBs: 55714
• Number of Logic Elements/Cells: 975000
• Total RAM Bits: 51200000
• Number of I/O: 832
• Number of Gates: -
• Voltage - Supply: 0.922 V ~ 0.979 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 2104-BBGA, FCBGA
• Supplier Device Package: 2104-FCBGA (47.5x47.5)

Paquete: 2104-BBGA, FCBGA

XC2VP100-5FF1704I

Xilinx Inc.

IC FPGA 1040 I/O 1704FCBGA

• Number of LABs/CLBs: 11024
• Number of Logic Elements/Cells: 99216
• Total RAM Bits: 8183808
• Number of I/O: 1040
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1704-BBGA, FCBGA
• Supplier Device Package: 1704-CFCBGA (42.5x42.5)

Paquete: 1704-BBGA, FCBGA

XC5VLX155T-1FFG1136I

Xilinx Inc.

IC FPGA 640 I/O 1136FCBGA

• Number of LABs/CLBs: 12160
• Number of Logic Elements/Cells: 155648
• Total RAM Bits: 7815168
• Number of I/O: 640
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1136-BBGA, FCBGA
• Supplier Device Package: 1136-FCBGA (35x35)

Paquete: 1136-BBGA, FCBGA

XC6VLX240T-2FFG1156C

Xilinx Inc.

IC FPGA 600 I/O 1156FCBGA

• Number of LABs/CLBs: 18840
• Number of Logic Elements/Cells: 241152
• Total RAM Bits: 15335424
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1156-FCBGA (35x35)

Paquete: 1156-BBGA, FCBGA

XC6VLX195T-1FFG1156I

Xilinx Inc.

IC FPGA 600 I/O 1156FCBGA

• Number of LABs/CLBs: 15600
• Number of Logic Elements/Cells: 199680
• Total RAM Bits: 12681216
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1156-FCBGA (35x35)

Paquete: 1156-BBGA, FCBGA

XQL4VLX60-9FF668I4095

Xilinx Inc.

IC FPGA VIRTEX-4LX 200K 1513FBGA

• Number of LABs/CLBs: 6656
• Number of Logic Elements/Cells: 59904
• Total RAM Bits: 2949120
• Number of I/O: 640
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 668-BBGA, FCBGA
• Supplier Device Package: 668-FCBGA (27x27)

Paquete: 668-BBGA, FCBGA

XC5VSX50T-2FF665C

Xilinx Inc.

IC FPGA 360 I/O 665FCBGA

• Number of LABs/CLBs: 4080
• Number of Logic Elements/Cells: 52224
• Total RAM Bits: 4866048
• Number of I/O: 360
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 665-BBGA, FCBGA
• Supplier Device Package: 665-FCBGA (27x27)

Paquete: 665-BBGA, FCBGA

XC2VP30-6FG676I

Xilinx Inc.

IC FPGA 416 I/O 676FBGA

• Number of LABs/CLBs: 3424
• Number of Logic Elements/Cells: 30816
• Total RAM Bits: 2506752
• Number of I/O: 416
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

Paquete: 676-BBGA, FCBGA

XC7A75T-1FGG484I

Xilinx Inc.

IC FPGA 285 I/O 484FCBGA

• Number of LABs/CLBs: 5900
• Number of Logic Elements/Cells: 75520
• Total RAM Bits: 3870720
• Number of I/O: 285
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-BBGA
• Supplier Device Package: 484-FBGA (23x23)

Paquete: 484-BBGA

XC3S1500-4FG456I

Xilinx Inc.

IC FPGA 333 I/O 456FBGA

• Number of LABs/CLBs: 3328
• Number of Logic Elements/Cells: 29952
• Total RAM Bits: 589824
• Number of I/O: 333
• Number of Gates: 1500000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 456-BBGA
• Supplier Device Package: 456-FBGA (23x23)

Paquete: 456-BBGA

XC3S1400AN-4FGG676C

Xilinx Inc.

IC FPGA 502 I/O 676FBGA

• Number of LABs/CLBs: 2816
• Number of Logic Elements/Cells: 25344
• Total RAM Bits: 589824
• Number of I/O: 502
• Number of Gates: 1400000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 676-BGA
• Supplier Device Package: 676-FBGA (27x27)

Paquete: 676-BGA

XC3S400AN-4FG400I

Xilinx Inc.

IC FPGA 311 I/O 400FBGA

• Number of LABs/CLBs: 896
• Number of Logic Elements/Cells: 8064
• Total RAM Bits: 368640
• Number of I/O: 311
• Number of Gates: 400000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 400-BGA
• Supplier Device Package: 400-FBGA (21x21)

Paquete: 400-BGA

XA7A15T-1CPG236I

Xilinx Inc.

IC FPGA 106 I/O 236BGA

• Number of LABs/CLBs: 1300
• Number of Logic Elements/Cells: 16640
• Total RAM Bits: 921600
• Number of I/O: 106
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 238-LFBGA, CSPBGA
• Supplier Device Package: 236-CSBGA (10x10)

Paquete: 238-LFBGA, CSPBGA

XC6SLX100T-3FGG676C

Xilinx Inc.

IC FPGA 376 I/O 676FBGA

• Number of LABs/CLBs: 7911
• Number of Logic Elements/Cells: 101261
• Total RAM Bits: 4939776
• Number of I/O: 376
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 676-BGA
• Supplier Device Package: 676-FBGA (27x27)

Paquete: 676-BGA

XC95288XV-7PQ208C

Xilinx Inc.

IC CPLD 288MC 7.5NS 208QFP

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 7.5ns
• Voltage Supply - Internal: 2.37 V ~ 2.62 V
• Number of Logic Elements/Blocks: 16
• Number of Macrocells: 288
• Number of Gates: 6400
• Number of I/O: 168
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 208-BFQFP
• Supplier Device Package: 208-PQFP (28x28)

Paquete: 208-BFQFP

XC9536-15PC44I

Xilinx Inc.

IC CPLD 36MC 15NS 44PLCC

• Programmable Type: In System Programmable (min 10K program/erase cycles)
• Delay Time tpd(1) Max: 15.0ns
• Voltage Supply - Internal: 4.5 V ~ 5.5 V
• Number of Logic Elements/Blocks: 2
• Number of Macrocells: 36
• Number of Gates: 800
• Number of I/O: 34
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 44-LCC (J-Lead)
• Supplier Device Package: 44-PLCC (16.59x16.59)

Paquete: 44-LCC (J-Lead)

XC2C128-6TQ144C

Xilinx Inc.

IC CPLD 128MC 5.7NS 144QFP

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 5.7ns
• Voltage Supply - Internal: 1.7 V ~ 1.9 V
• Number of Logic Elements/Blocks: 8
• Number of Macrocells: 128
• Number of Gates: 3000
• Number of I/O: 100
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 144-LQFP
• Supplier Device Package: 144-TQFP (20x20)

Paquete: 144-LQFP

XC2C32A-4VQ44C

Xilinx Inc.

IC CPLD 32MC 3.8NS 44VQFP

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 3.8ns
• Voltage Supply - Internal: 1.7 V ~ 1.9 V
• Number of Logic Elements/Blocks: 2
• Number of Macrocells: 32
• Number of Gates: 750
• Number of I/O: 33
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 44-TQFP
• Supplier Device Package: 44-VQFP (10x10)

Paquete: 44-TQFP

XCR3064XL-10VQG100C

Xilinx Inc.

IC CPLD 64MC 9.1NS 100VQFP

• Programmable Type: In System Programmable (min 1K program/erase cycles)
• Delay Time tpd(1) Max: 9.1ns
• Voltage Supply - Internal: 3 V ~ 3.6 V
• Number of Logic Elements/Blocks: 4
• Number of Macrocells: 64
• Number of Gates: 1500
• Number of I/O: 68
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-TQFP
• Supplier Device Package: 100-VQFP (14x14)

Paquete: 100-TQFP

XCVU190-1FLGB2104I

Xilinx Inc.

IC FPGA VIRTEX-U 2104FCBGA

• Number of LABs/CLBs: 134280
• Number of Logic Elements/Cells: 2349900
• Total RAM Bits: 150937600
• Number of I/O: 702
• Number of Gates: -
• Voltage - Supply: 0.922 V ~ 0.979 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 2104-BBGA, FCBGA
• Supplier Device Package: 2104-FCBGA (47.5x47.5)

Paquete: 2104-BBGA, FCBGA

XCVU125-H1FLVB1760E

Xilinx Inc.

IC FPGA VIRTEX-U 1760FCBGA

• Number of LABs/CLBs: 89520
• Number of Logic Elements/Cells: 1566600
• Total RAM Bits: 90726400
• Number of I/O: 702
• Number of Gates: -
• Voltage - Supply: 0.922 V ~ 1.030 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FCBGA (42.5x42.5)

Paquete: 1760-BBGA, FCBGA