Xilinx Inc. Productos

XC18V256SO20C

Xilinx Inc.

IC PROM SRL CONFIG 256K 20-SOIC

• Programmable Type: In System Programmable
• Memory Size: 256Kb
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SOIC

Paquete: 20-SOIC (0.295", 7.50mm Width)

XC17S200APD8C

Xilinx Inc.

IC PROM SER 200000 C-TEMP 8-DIP

• Programmable Type: OTP
• Memory Size: 2Mb
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 8-DIP (0.300", 7.62mm)
• Supplier Device Package: 8-PDIP

Paquete: 8-DIP (0.300", 7.62mm)

XC17256ELVO8C

Xilinx Inc.

IC 3V SER CFG PROM 256K 8-SOIC

• Programmable Type: OTP
• Memory Size: 256Kb
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-TSOP

Paquete: 8-SOIC (0.154", 3.90mm Width)

XC18V512PCG20C

Xilinx Inc.

IC PROM REPROGR 512KB 20-PLCC

• Programmable Type: In System Programmable
• Memory Size: 512kb
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 20-LCC (J-Lead)
• Supplier Device Package: 20-PLCC (9x9)

Paquete: 20-LCC (J-Lead)

XCZU3EG-1SFVC784E

Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.5GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 154K+ Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 784-BBGA, FCBGA
• Supplier Device Package: 784-FCBGA (23x23)

Paquete: 784-BBGA, FCBGA

XCZU2CG-2SFVC784E

Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 533MHz, 1.3GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 103K+ Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 784-BBGA, FCBGA
• Supplier Device Package: 784-FCBGA (23x23)

Paquete: 784-BBGA, FCBGA

XC7A100T-2FGG676CES9937

Xilinx Inc.

IC FPGA 300 I/O 676FCBGA

• Number of LABs/CLBs: 7925
• Number of Logic Elements/Cells: 101440
• Total RAM Bits: 4976640
• Number of I/O: 300
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 676-BGA
• Supplier Device Package: 676-FBGA (27x27)

Paquete: 676-BGA

XC6SLX75T-4FGG484C

Xilinx Inc.

IC FPGA 268 I/O 484FBGA

• Number of LABs/CLBs: 5831
• Number of Logic Elements/Cells: 74637
• Total RAM Bits: 3170304
• Number of I/O: 268
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 484-BBGA
• Supplier Device Package: 484-FBGA (23x23)

Paquete: 484-BBGA

XC2V80-6CSG144C

Xilinx Inc.

IC FPGA 92 I/O 144CSBGA

• Number of LABs/CLBs: 128
• Number of Logic Elements/Cells: -
• Total RAM Bits: 147456
• Number of I/O: 92
• Number of Gates: 80000
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 144-TFBGA, CSPBGA
• Supplier Device Package: 144-LCSBGA (12x12)

Paquete: 144-TFBGA, CSPBGA

XCV600-4BG432C

Xilinx Inc.

IC FPGA 316 I/O 432MBGA

• Number of LABs/CLBs: 3456
• Number of Logic Elements/Cells: 15552
• Total RAM Bits: 98304
• Number of I/O: 316
• Number of Gates: 661111
• Voltage - Supply: 2.375 V ~ 2.625 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 432-LBGA, Metal
• Supplier Device Package: 432-MBGA (40x40)

Paquete: 432-LBGA, Metal

XCV200E-6FG256I

Xilinx Inc.

IC FPGA 176 I/O 256FBGA

• Number of LABs/CLBs: 1176
• Number of Logic Elements/Cells: 5292
• Total RAM Bits: 114688
• Number of I/O: 176
• Number of Gates: 306393
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 256-BGA
• Supplier Device Package: 256-FBGA (17x17)

Paquete: 256-BGA

XC4062XL-1BG432C

Xilinx Inc.

IC FPGA 352 I/O 432MBGA

• Number of LABs/CLBs: 2304
• Number of Logic Elements/Cells: 5472
• Total RAM Bits: 73728
• Number of I/O: 352
• Number of Gates: 62000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 432-LBGA, Metal
• Supplier Device Package: 432-MBGA (40x40)

Paquete: 432-LBGA, Metal

XC4005XL-3VQ100I

Xilinx Inc.

IC FPGA 77 I/O 100VQFP

• Number of LABs/CLBs: 196
• Number of Logic Elements/Cells: 466
• Total RAM Bits: 6272
• Number of I/O: 77
• Number of Gates: 5000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 100-TQFP
• Supplier Device Package: 100-VQFP (14x14)

Paquete: 100-TQFP

XC4013E-4PQ160C

Xilinx Inc.

IC FPGA 129 I/O 160QFP

• Number of LABs/CLBs: 576
• Number of Logic Elements/Cells: 1368
• Total RAM Bits: 18432
• Number of I/O: 129
• Number of Gates: 13000
• Voltage - Supply: 4.75 V ~ 5.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 160-BQFP
• Supplier Device Package: 160-PQFP (28x28)

Paquete: 160-BQFP

XC5VLX110-3FF676C

Xilinx Inc.

IC FPGA 440 I/O 676FCBGA

• Number of LABs/CLBs: 8640
• Number of Logic Elements/Cells: 110592
• Total RAM Bits: 4718592
• Number of I/O: 440
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

Paquete: 676-BBGA, FCBGA

XC5VFX100T-1FF1738C

Xilinx Inc.

IC FPGA 680 I/O 1738FCBGA

• Number of LABs/CLBs: 8000
• Number of Logic Elements/Cells: 102400
• Total RAM Bits: 8404992
• Number of I/O: 680
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1738-BBGA, FCBGA
• Supplier Device Package: 1738-FCBGA (42.5x42.5)

Paquete: 1738-BBGA, FCBGA

XC5VLX85-1FF676C

Xilinx Inc.

IC FPGA 440 I/O 676FCBGA

• Number of LABs/CLBs: 6480
• Number of Logic Elements/Cells: 82944
• Total RAM Bits: 3538944
• Number of I/O: 440
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

Paquete: 676-BBGA, FCBGA

XC4VLX40-11FFG668I

Xilinx Inc.

IC FPGA 448 I/O 668FCBGA

• Number of LABs/CLBs: 4608
• Number of Logic Elements/Cells: 41472
• Total RAM Bits: 1769472
• Number of I/O: 448
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 668-BBGA, FCBGA
• Supplier Device Package: 668-FCBGA (27x27)

Paquete: 668-BBGA, FCBGA

XC4VLX60-10FF1148C

Xilinx Inc.

IC FPGA 640 I/O 1148FCBGA

• Number of LABs/CLBs: 6656
• Number of Logic Elements/Cells: 59904
• Total RAM Bits: 2949120
• Number of I/O: 640
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1148-BBGA, FCBGA
• Supplier Device Package: 1148-FCPBGA (35x35)

Paquete: 1148-BBGA, FCBGA

XC5VLX50-3FFG324C

Xilinx Inc.

IC FPGA 220 I/O 324FBGA

• Number of LABs/CLBs: 3600
• Number of Logic Elements/Cells: 46080
• Total RAM Bits: 1769472
• Number of I/O: 220
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 324-BBGA, FCBGA
• Supplier Device Package: 324-FCBGA (19x19)

Paquete: 324-BBGA, FCBGA

XC6SLX75-L1FGG484C

Xilinx Inc.

IC FPGA 280 I/O 484FBGA

• Number of LABs/CLBs: 5831
• Number of Logic Elements/Cells: 74637
• Total RAM Bits: 3170304
• Number of I/O: 280
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 484-BBGA
• Supplier Device Package: 484-FBGA (23x23)

Paquete: 484-BBGA

XC9536-10VQG44C

Xilinx Inc.

IC CPLD 36MC 10NS 44VQFP

• Programmable Type: In System Programmable (min 10K program/erase cycles)
• Delay Time tpd(1) Max: 10.0ns
• Voltage Supply - Internal: 4.75 V ~ 5.25 V
• Number of Logic Elements/Blocks: 2
• Number of Macrocells: 36
• Number of Gates: 800
• Number of I/O: 34
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 44-TQFP
• Supplier Device Package: 44-VQFP (10x10)

Paquete: 44-TQFP

XCR3512XL-10FGG324C

Xilinx Inc.

IC CPLD 512MC 9NS 324BGA

• Programmable Type: In System Programmable (min 1K program/erase cycles)
• Delay Time tpd(1) Max: 9.0ns
• Voltage Supply - Internal: 3 V ~ 3.6 V
• Number of Logic Elements/Blocks: 32
• Number of Macrocells: 512
• Number of Gates: 12000
• Number of I/O: 260
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 324-BBGA
• Supplier Device Package: 324-FBGA (23x23)

Paquete: 324-BBGA

XC9536XL-10VQG44C

Xilinx Inc.

IC CPLD 36MC 10NS 44VQFP

• Programmable Type: In System Programmable (min 10K program/erase cycles)
• Delay Time tpd(1) Max: 10.0ns
• Voltage Supply - Internal: 3 V ~ 3.6 V
• Number of Logic Elements/Blocks: 2
• Number of Macrocells: 36
• Number of Gates: 800
• Number of I/O: 34
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 44-TQFP
• Supplier Device Package: 44-VQFP (10x10)

Paquete: 44-TQFP

XC7S50-L1FGGA484I

Xilinx Inc.

XC7S50-L1FGGA484I

• Number of LABs/CLBs: 4075
• Number of Logic Elements/Cells: 52160
• Total RAM Bits: 2764800
• Number of I/O: 250
• Number of Gates: -
• Voltage - Supply: 0.92 V ~ 0.98 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-BGA
• Supplier Device Package: 484-FPBGA (23x23)

Paquete: 484-BGA

XC7S25-1CSGA225Q

Xilinx Inc.

XC7S25-1CSGA225Q

• Number of LABs/CLBs: -
• Number of Logic Elements/Cells: 23360
• Total RAM Bits: 1658880
• Number of I/O: 150
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 125°C (TJ)
• Package / Case: 225-LFBGA, CSPBGA
• Supplier Device Package: 225-CSPBGA (13x13)

Paquete: 225-LFBGA, CSPBGA

XCVU5P-1FLVB2104E

Xilinx Inc.

IC FPGA VIRTEX-UP 2104FCBGA

• Number of LABs/CLBs: 75072
• Number of Logic Elements/Cells: 1313763
• Total RAM Bits: 190976000
• Number of I/O: 702
• Number of Gates: -
• Voltage - Supply: 0.825 V ~ 0.876 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 2104-BBGA, FCBGA
• Supplier Device Package: 2104-FCBGA (47.5x47.5)

Paquete: 2104-BBGA, FCBGA

XCDAISY-FFG1152

Xilinx Inc.

FFG1152 DAISY SAMPLE

• Number of LABs/CLBs: -
• Number of Logic Elements/Cells: -
• Total RAM Bits: -
• Number of I/O: -
• Number of Gates: -
• Voltage - Supply: -
• Mounting Type: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

Paquete: -