Xilinx Inc. Productos

XCZU19EG-1FFVD1760E

Xilinx Inc.

IC FPGA 308 I/O 1760FCBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.5GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 1143K+ Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FCBGA (42.5x42.5)

Paquete: 1760-BBGA, FCBGA

XCV400E-7BG560I

Xilinx Inc.

IC FPGA 404 I/O 560MBGA

• Number of LABs/CLBs: 2400
• Number of Logic Elements/Cells: 10800
• Total RAM Bits: 163840
• Number of I/O: 404
• Number of Gates: 569952
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 560-LBGA, Metal
• Supplier Device Package: 560-MBGA (42.5x42.5)

Paquete: 560-LBGA, Metal

XCV100-5CS144I

Xilinx Inc.

IC FPGA 94 I/O 144CSBGA

• Number of LABs/CLBs: 600
• Number of Logic Elements/Cells: 2700
• Total RAM Bits: 40960
• Number of I/O: 94
• Number of Gates: 108904
• Voltage - Supply: 2.375 V ~ 2.625 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 144-TFBGA, CSPBGA
• Supplier Device Package: 144-LCSBGA (12x12)

Paquete: 144-TFBGA, CSPBGA

XC4085XL-1BG560I

Xilinx Inc.

IC FPGA 448 I/O 560MBGA

• Number of LABs/CLBs: 3136
• Number of Logic Elements/Cells: 7448
• Total RAM Bits: 100352
• Number of I/O: 448
• Number of Gates: 85000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 560-LBGA, Metal
• Supplier Device Package: 560-MBGA (42.5x42.5)

Paquete: 560-LBGA, Metal

XC4028XL-1HQ240I

Xilinx Inc.

IC FPGA 193 I/O 240HQFP

• Number of LABs/CLBs: 1024
• Number of Logic Elements/Cells: 2432
• Total RAM Bits: 32768
• Number of I/O: 193
• Number of Gates: 28000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 240-BFQFP Exposed Pad
• Supplier Device Package: 240-PQFP (32x32)

Paquete: 240-BFQFP Exposed Pad

XC4010XL-3PC84C

Xilinx Inc.

IC FPGA 61 I/O 84PLCC

• Number of LABs/CLBs: 400
• Number of Logic Elements/Cells: 950
• Total RAM Bits: 12800
• Number of I/O: 61
• Number of Gates: 10000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 84-LCC (J-Lead)
• Supplier Device Package: 84-PLCC (29.31x29.31)

Paquete: 84-LCC (J-Lead)

XC4010E-4PQ208I

Xilinx Inc.

IC FPGA 160 I/O 208QFP

• Number of LABs/CLBs: 400
• Number of Logic Elements/Cells: 950
• Total RAM Bits: 12800
• Number of I/O: 160
• Number of Gates: 10000
• Voltage - Supply: 4.5 V ~ 5.5 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 208-BFQFP
• Supplier Device Package: 208-PQFP (28x28)

Paquete: 208-BFQFP

XCVU7P-1FLVC2104I

Xilinx Inc.

XCVU7P-1FLVC2104I

• Number of LABs/CLBs: 98520
• Number of Logic Elements/Cells: 1724100
• Total RAM Bits: 236134400
• Number of I/O: 416
• Number of Gates: -
• Voltage - Supply: 0.825 V ~ 0.876 V
• Mounting Type: -
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

Paquete: -

XC7VX485T-3FFG1927E

Xilinx Inc.

IC FPGA 600 I/O 1927FCBGA

• Number of LABs/CLBs: 37950
• Number of Logic Elements/Cells: 485760
• Total RAM Bits: 37969920
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.97 V ~ 1.03 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1924-BBGA, FCBGA
• Supplier Device Package: 1927-FCBGA (45x45)

Paquete: 1924-BBGA, FCBGA

XC2VP70-7FF1704C

Xilinx Inc.

IC FPGA 996 I/O 1704FCBGA

• Number of LABs/CLBs: 8272
• Number of Logic Elements/Cells: 74448
• Total RAM Bits: 6045696
• Number of I/O: 996
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1704-BBGA, FCBGA
• Supplier Device Package: 1704-CFCBGA (42.5x42.5)

Paquete: 1704-BBGA, FCBGA

XC6VSX315T-3FFG1156C

Xilinx Inc.

IC FPGA 600 I/O 1156FCBGA

• Number of LABs/CLBs: 24600
• Number of Logic Elements/Cells: 314880
• Total RAM Bits: 25952256
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1156-FCBGA (35x35)

Paquete: 1156-BBGA, FCBGA

XC5VLX85-2FF1153I

Xilinx Inc.

IC FPGA 560 I/O 1153FCBGA

• Number of LABs/CLBs: 6480
• Number of Logic Elements/Cells: 82944
• Total RAM Bits: 3538944
• Number of I/O: 560
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1153-BBGA, FCBGA
• Supplier Device Package: 1153-FCBGA (35x35)

Paquete: 1153-BBGA, FCBGA

XC4VLX80-10FF1148C

Xilinx Inc.

IC FPGA 768 I/O 1148FCBGA

• Number of LABs/CLBs: 8960
• Number of Logic Elements/Cells: 80640
• Total RAM Bits: 3686400
• Number of I/O: 768
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1148-BBGA, FCBGA
• Supplier Device Package: 1148-FCPBGA (35x35)

Paquete: 1148-BBGA, FCBGA

XC2VP40-6FGG676C

Xilinx Inc.

IC FPGA 416 I/O 676FBGA

• Number of LABs/CLBs: 4848
• Number of Logic Elements/Cells: 43632
• Total RAM Bits: 3538944
• Number of I/O: 416
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 676-BGA
• Supplier Device Package: 676-FBGA (27x27)

Paquete: 676-BGA

XC5VLX50T-2FFG1136C

Xilinx Inc.

IC FPGA 480 I/O 1136FCBGA

• Number of LABs/CLBs: 3600
• Number of Logic Elements/Cells: 46080
• Total RAM Bits: 2211840
• Number of I/O: 480
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1136-BBGA, FCBGA
• Supplier Device Package: 1136-FCBGA (35x35)

Paquete: 1136-BBGA, FCBGA

XC6VCX130T-1FFG1156C

Xilinx Inc.

IC FPGA 600 I/O 1156FCBGA

• Number of LABs/CLBs: 10000
• Number of Logic Elements/Cells: 128000
• Total RAM Bits: 9732096
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1156-FCBGA (35x35)

Paquete: 1156-BBGA, FCBGA

XC4VLX40-10FFG1148C

Xilinx Inc.

IC FPGA 640 I/O 1148FCBGA

• Number of LABs/CLBs: 4608
• Number of Logic Elements/Cells: 41472
• Total RAM Bits: 1769472
• Number of I/O: 640
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1148-BBGA, FCBGA
• Supplier Device Package: 1148-FCPBGA (35x35)

Paquete: 1148-BBGA, FCBGA

XC5VLX20T-1FF323I

Xilinx Inc.

IC FPGA 172 I/O 323FCBGA

• Number of LABs/CLBs: 1560
• Number of Logic Elements/Cells: 19968
• Total RAM Bits: 958464
• Number of I/O: 172
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 323-BBGA, FCBGA
• Supplier Device Package: 323-FCBGA (19x19)

Paquete: 323-BBGA, FCBGA

XC5VLX30-1FFG676C

Xilinx Inc.

IC FPGA 400 I/O 676FCBGA

• Number of LABs/CLBs: 2400
• Number of Logic Elements/Cells: 30720
• Total RAM Bits: 1179648
• Number of I/O: 400
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

Paquete: 676-BBGA, FCBGA

XC6SLX150-2FG484C

Xilinx Inc.

IC FPGA 338 I/O 484FBGA

• Number of LABs/CLBs: 11519
• Number of Logic Elements/Cells: 147443
• Total RAM Bits: 4939776
• Number of I/O: 338
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 484-BBGA
• Supplier Device Package: 484-FBGA (23x23)

Paquete: 484-BBGA

XC6SLX100T-N3FGG484C

Xilinx Inc.

IC FPGA 296 I/O 484FBGA

• Number of LABs/CLBs: 7911
• Number of Logic Elements/Cells: 101261
• Total RAM Bits: 4939776
• Number of I/O: 296
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 484-BBGA
• Supplier Device Package: 484-FBGA (23x23)

Paquete: 484-BBGA

XC7A75T-L2CSG324E

Xilinx Inc.

IC FPGA ARTIX7 210 I/O 324CSBGA

• Number of LABs/CLBs: 5900
• Number of Logic Elements/Cells: 75520
• Total RAM Bits: 3870720
• Number of I/O: 210
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 324-LFBGA, CSPBGA
• Supplier Device Package: 324-CSPBGA (15x15)

Paquete: 324-LFBGA, CSPBGA

XC4005L-5PC84C

Xilinx Inc.

IC FPGA 61 I/O 84PLCC

• Number of LABs/CLBs: 196
• Number of Logic Elements/Cells: 466
• Total RAM Bits: 6272
• Number of I/O: 61
• Number of Gates: 5000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 84-LCC (J-Lead)
• Supplier Device Package: 84-PLCC (29.31x29.31)

Paquete: 84-LCC (J-Lead)

XC6SLX16-3FTG256I

Xilinx Inc.

IC FPGA 186 I/O 256FTBGA

• Number of LABs/CLBs: 1139
• Number of Logic Elements/Cells: 14579
• Total RAM Bits: 589824
• Number of I/O: 186
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 256-LBGA
• Supplier Device Package: 256-FTBGA (17x17)

Paquete: 256-LBGA

XC95108-7TQG100C

Xilinx Inc.

IC CPLD 108MC 7.5NS 100TQFP

• Programmable Type: In System Programmable (min 10K program/erase cycles)
• Delay Time tpd(1) Max: 7.5ns
• Voltage Supply - Internal: 4.75 V ~ 5.25 V
• Number of Logic Elements/Blocks: 6
• Number of Macrocells: 108
• Number of Gates: 2400
• Number of I/O: 81
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-LQFP
• Supplier Device Package: 100-TQFP (14x14)

Paquete: 100-LQFP

XCR3512XL-7PQ208C

Xilinx Inc.

IC CPLD 512MC 7NSNS 208QFP

• Programmable Type: In System Programmable (min 1K program/erase cycles)
• Delay Time tpd(1) Max: 7.0ns
• Voltage Supply - Internal: 3 V ~ 3.6 V
• Number of Logic Elements/Blocks: 32
• Number of Macrocells: 512
• Number of Gates: 12000
• Number of I/O: 180
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 208-BFQFP
• Supplier Device Package: 208-PQFP (28x28)

Paquete: 208-BFQFP

XCR3384XL-7FTG256C

Xilinx Inc.

IC CPLD 384MC 7NS 256BGA

• Programmable Type: In System Programmable (min 1K program/erase cycles)
• Delay Time tpd(1) Max: 7.0ns
• Voltage Supply - Internal: 3 V ~ 3.6 V
• Number of Logic Elements/Blocks: 24
• Number of Macrocells: 384
• Number of Gates: 9000
• Number of I/O: 212
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 256-LBGA
• Supplier Device Package: 256-FTBGA (17x17)

Paquete: 256-LBGA

XC95144XL-10TQG100C

Xilinx Inc.

IC CPLD 144MC 10NS 100TQFP

• Programmable Type: In System Programmable (min 10K program/erase cycles)
• Delay Time tpd(1) Max: 10.0ns
• Voltage Supply - Internal: 3 V ~ 3.6 V
• Number of Logic Elements/Blocks: 8
• Number of Macrocells: 144
• Number of Gates: 3200
• Number of I/O: 81
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-LQFP
• Supplier Device Package: 100-TQFP (14x14)

Paquete: 100-LQFP