Xilinx Inc. Productos

XC17V08VQ44I

Xilinx Inc.

IC PROM SER I-TEMP 3.3V 44-VQFP

• Programmable Type: OTP
• Memory Size: 8Mb
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 44-TQFP
• Supplier Device Package: 44-VQFP (10x10)

Paquete: 44-TQFP

XC17S100APD8C

Xilinx Inc.

IC PROM SER 100000 C-TEMP 8-DIP

• Programmable Type: OTP
• Memory Size: 1Mb
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 8-DIP (0.300", 7.62mm)
• Supplier Device Package: 8-PDIP

Paquete: 8-DIP (0.300", 7.62mm)

XC17128EVO8C

Xilinx Inc.

IC SERIAL CFG PROM 128K 8-SOIC

• Programmable Type: OTP
• Memory Size: 128kb
• Voltage - Supply: 4.75 V ~ 5.25 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-TSOP

Paquete: 8-SOIC (0.154", 3.90mm Width)

XCZU4CG-1FBVB900I

Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 533MHz, 1.3GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 192K+ Logic Cells
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 900-BBGA, FCBGA
• Supplier Device Package: 900-FCBGA (31x31)

Paquete: 900-BBGA, FCBGA

XA2S150E-6FT256I

Xilinx Inc.

IC FPGA 182 I/O 256FTBGA

• Number of LABs/CLBs: 864
• Number of Logic Elements/Cells: 3888
• Total RAM Bits: 49152
• Number of I/O: 182
• Number of Gates: 150000
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 256-LBGA
• Supplier Device Package: 256-FTBGA (17x17)

Paquete: 256-LBGA

XCV400E-8PQ240C

Xilinx Inc.

IC FPGA 158 I/O 240QFP

• Number of LABs/CLBs: 2400
• Number of Logic Elements/Cells: 10800
• Total RAM Bits: 163840
• Number of I/O: 158
• Number of Gates: 569952
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 240-BFQFP
• Supplier Device Package: 240-PQFP (32x32)

Paquete: 240-BFQFP

XCV1000E-6HQ240I

Xilinx Inc.

IC FPGA 158 I/O 240HQFP

• Number of LABs/CLBs: 6144
• Number of Logic Elements/Cells: 27648
• Total RAM Bits: 393216
• Number of I/O: 158
• Number of Gates: 1569178
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 240-BFQFP Exposed Pad
• Supplier Device Package: 240-PQFP (32x32)

Paquete: 240-BFQFP Exposed Pad

XCS30-3PQ208I

Xilinx Inc.

IC FPGA 169 I/O 208QFP

• Number of LABs/CLBs: 576
• Number of Logic Elements/Cells: 1368
• Total RAM Bits: 18432
• Number of I/O: 169
• Number of Gates: 30000
• Voltage - Supply: 4.5 V ~ 5.5 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 208-BFQFP
• Supplier Device Package: 208-PQFP (28x28)

Paquete: 208-BFQFP

XC4036XL-1HQ304I

Xilinx Inc.

IC FPGA 256 I/O 304HQFP

• Number of LABs/CLBs: 1296
• Number of Logic Elements/Cells: 3078
• Total RAM Bits: 41472
• Number of I/O: 256
• Number of Gates: 36000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 304-BFQFP Exposed Pad
• Supplier Device Package: 304-PQFP (40x40)

Paquete: 304-BFQFP Exposed Pad

XC4013XL-3PQ160I

Xilinx Inc.

IC FPGA 129 I/O 160QFP

• Number of LABs/CLBs: 576
• Number of Logic Elements/Cells: 1368
• Total RAM Bits: 18432
• Number of I/O: 129
• Number of Gates: 13000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 160-BQFP
• Supplier Device Package: 160-PQFP (28x28)

Paquete: 160-BQFP

XC4008E-2PC84C

Xilinx Inc.

IC FPGA 61 I/O 84PLCC

• Number of LABs/CLBs: 324
• Number of Logic Elements/Cells: 770
• Total RAM Bits: 10368
• Number of I/O: 61
• Number of Gates: 8000
• Voltage - Supply: 4.75 V ~ 5.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 84-LCC (J-Lead)
• Supplier Device Package: 84-PLCC (29.31x29.31)

Paquete: 84-LCC (J-Lead)

XCVU080-2FFVC1517E

Xilinx Inc.

IC FPGA 520 I/O 1517FCBGA

• Number of LABs/CLBs: 55714
• Number of Logic Elements/Cells: 975000
• Total RAM Bits: 51200000
• Number of I/O: 520
• Number of Gates: -
• Voltage - Supply: 0.922 V ~ 0.979 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FCBGA (40x40)

Paquete: 1517-BBGA, FCBGA

XC6VLX195T-2FF1156I

Xilinx Inc.

IC FPGA 600 I/O 1156FCBGA

• Number of LABs/CLBs: 15600
• Number of Logic Elements/Cells: 199680
• Total RAM Bits: 12681216
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1156-FCBGA (35x35)

Paquete: 1156-BBGA, FCBGA

XC5VLX110-2FFG1153C

Xilinx Inc.

IC FPGA 800 I/O 1153FCBGA

• Number of LABs/CLBs: 8640
• Number of Logic Elements/Cells: 110592
• Total RAM Bits: 4718592
• Number of I/O: 800
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1153-BBGA, FCBGA
• Supplier Device Package: 1153-FCBGA (35x35)

Paquete: 1153-BBGA, FCBGA

XC5VFX70T-1FF665I

Xilinx Inc.

IC FPGA 360 I/O 665FCBGA

• Number of LABs/CLBs: 5600
• Number of Logic Elements/Cells: 71680
• Total RAM Bits: 5455872
• Number of I/O: 360
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 665-BBGA, FCBGA
• Supplier Device Package: 665-FCBGA (27x27)

Paquete: 665-BBGA, FCBGA

XC6VLX130T-1FFG784I

Xilinx Inc.

IC FPGA 400 I/O 784FCBGA

• Number of LABs/CLBs: 10000
• Number of Logic Elements/Cells: 128000
• Total RAM Bits: 9732096
• Number of I/O: 400
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 784-BBGA, FCBGA
• Supplier Device Package: 784-FCBGA (29x29)

Paquete: 784-BBGA, FCBGA

XQ6SLX75T-2FGG676I

Xilinx Inc.

IC FPGA SPARTAN 6 75K 676BGA

• Number of LABs/CLBs: 5831
• Number of Logic Elements/Cells: 74637
• Total RAM Bits: 3170304
• Number of I/O: 348
• Number of Gates: -
• Voltage - Supply: 1.2 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 676-BGA
• Supplier Device Package: 676-FBGA (27x27)

Paquete: 676-BGA

XQ6SLX75T-2FG484I

Xilinx Inc.

IC FPGA SPARTAN 6 75K 484BGA

• Number of LABs/CLBs: 5831
• Number of Logic Elements/Cells: 74637
• Total RAM Bits: 3170304
• Number of I/O: 268
• Number of Gates: -
• Voltage - Supply: 1.2 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-BBGA
• Supplier Device Package: 484-FBGA (23x23)

Paquete: 484-BBGA

XA6SLX45T-2CSG324Q

Xilinx Inc.

IC FPGA 190 I/O 324CSGBGA

• Number of LABs/CLBs: 3411
• Number of Logic Elements/Cells: 43661
• Total RAM Bits: 2138112
• Number of I/O: 190
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 125°C (TJ)
• Package / Case: 324-LFBGA, CSPBGA
• Supplier Device Package: 324-CSPBGA (15x15)

Paquete: 324-LFBGA, CSPBGA

XC3S1000-5FGG320C

Xilinx Inc.

IC FPGA 221 I/O 320 FBGA

• Number of LABs/CLBs: 1920
• Number of Logic Elements/Cells: 17280
• Total RAM Bits: 442368
• Number of I/O: 221
• Number of Gates: 1000000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 320-BGA
• Supplier Device Package: 320-FBGA (19x19)

Paquete: 320-BGA

XC6SLX25-3FTG256I

Xilinx Inc.

IC FPGA 186 I/O 256FTBGA

• Number of LABs/CLBs: 1879
• Number of Logic Elements/Cells: 24051
• Total RAM Bits: 958464
• Number of I/O: 186
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 256-LBGA
• Supplier Device Package: 256-FTBGA (17x17)

Paquete: 256-LBGA

XC3S200-4PQ208C

Xilinx Inc.

IC FPGA 141 I/O 208QFP

• Number of LABs/CLBs: 480
• Number of Logic Elements/Cells: 4320
• Total RAM Bits: 221184
• Number of I/O: 141
• Number of Gates: 200000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 208-BFQFP
• Supplier Device Package: 208-PQFP (28x28)

Paquete: 208-BFQFP

XA3S100E-4VQG100Q

Xilinx Inc.

IC FPGA 66 I/O 100VQFP

• Number of LABs/CLBs: 240
• Number of Logic Elements/Cells: 2160
• Total RAM Bits: 73728
• Number of I/O: 66
• Number of Gates: 100000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 125°C (TJ)
• Package / Case: 100-TQFP
• Supplier Device Package: 100-VQFP (14x14)

Paquete: 100-TQFP

XC7S50-2FGGA484I

Xilinx Inc.

XC7S50-2FGGA484I

• Number of LABs/CLBs: 4075
• Number of Logic Elements/Cells: 52160
• Total RAM Bits: 2764800
• Number of I/O: 250
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-BBGA
• Supplier Device Package: 484-FBGA (23x23)

Paquete: 484-BBGA

XC3S500E-4CPG132C

Xilinx Inc.

IC FPGA 92 I/O 132CSBGA

• Number of LABs/CLBs: 1164
• Number of Logic Elements/Cells: 10476
• Total RAM Bits: 368640
• Number of I/O: 92
• Number of Gates: 500000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 132-TFBGA, CSPBGA
• Supplier Device Package: 132-CSPBGA (8x8)

Paquete: 132-TFBGA, CSPBGA

XC6SLX75-2CSG484C

Xilinx Inc.

IC FPGA 328 I/O 484CSBGA

• Number of LABs/CLBs: 5831
• Number of Logic Elements/Cells: 74637
• Total RAM Bits: 3170304
• Number of I/O: 328
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 484-FBGA, CSPBGA
• Supplier Device Package: 484-CSPBGA (19x19)

Paquete: 484-FBGA, CSPBGA

XAZU2EG-1SFVC784I

Xilinx Inc.

XAZU2EG-1SFVC784I

• Architecture: -
• Core Processor: -
• Flash Size: -
• RAM Size: -
• Peripherals: -
• Connectivity: -
• Speed: -
• Primary Attributes: -
• Operating Temperature: -
• Package / Case: 784-BFBGA, FCBGA
• Supplier Device Package: 784-FCBGA (23x23)

Paquete: 784-BFBGA, FCBGA

XC7A100T-1FG676I

Xilinx Inc.

IC FPGA 300 I/O 676FCBGA

• Number of LABs/CLBs: 7925
• Number of Logic Elements/Cells: 101440
• Total RAM Bits: 4976640
• Number of I/O: 300
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C
• Package / Case: 676-BGA
• Supplier Device Package: 676-FBGA (27x27)

Paquete: 676-BGA