NXP Productos

BS108,126

NXP

MOSFET N-CH 200V 300MA SOT54

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 200V
• Current - Continuous Drain (Id) @ 25°C: 300mA (Ta)
• Drive Voltage (Max Rds On, Min Rds On): 2.8V
• Vgs(th) (Max) @ Id: 1.8V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: -
• Input Capacitance (Ciss) (Max) @ Vds: 120pF @ 25V
• Vgs (Max): ±20V
• FET Feature: -
• Power Dissipation (Max): 1W (Ta)
• Rds On (Max) @ Id, Vgs: 5 Ohm @ 100mA, 2.8V
• Operating Temperature: -55°C ~ 150°C (TJ)
• Mounting Type: Through Hole
• Supplier Device Package: TO-92-3
• Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)

Paquete: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)

MRF8S18120HSR3

NXP

FET RF 65V 1.81GHZ NI-780S

• Transistor Type: LDMOS
• Frequency: 1.81GHz
• Gain: 18.2dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 800mA
• Power - Output: 72W
• Voltage - Rated: 65V
• Package / Case: NI-780S
• Supplier Device Package: NI-780S

Paquete: NI-780S

PZM13NB3,115

NXP

DIODE ZENER 13V 300MW SMT3

• Voltage - Zener (Nom) (Vz): 13V
• Tolerance: ±2%
• Power - Max: 300mW
• Impedance (Max) (Zzt): 10 Ohms
• Current - Reverse Leakage @ Vr: 100nA @ 10V
• Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
• Operating Temperature: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: SMT3; MPAK

Paquete: TO-236-3, SC-59, SOT-23-3

BAP63-02,115

NXP

DIODE PIN 50V 100MA SOD-523

• Diode Type: PIN - Single
• Voltage - Peak Reverse (Max): 50V
• Current - Max: 100mA
• Capacitance @ Vr, F: 0.32pF @ 20V, 1MHz
• Resistance @ If, F: 1.5 Ohm @ 100mA, 100MHz
• Power Dissipation (Max): 715mW
• Operating Temperature: -65°C ~ 150°C (TJ)
• Package / Case: SC-79, SOD-523
• Supplier Device Package: SOD-523

Paquete: SC-79, SOD-523

74ABT574AD,112

NXP

IC D-TYPE POS TRG SNGL 20SOIC

• Function: Standard
• Type: D-Type
• Output Type: Tri-State, Non-Inverted
• Number of Elements: 1
• Number of Bits per Element: 8
• Clock Frequency: 400MHz
• Max Propagation Delay @ V, Max CL: 4.7ns @ 5V, 50pF
• Trigger Type: Positive Edge
• Current - Output High, Low: 32mA, 64mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Current - Quiescent (Iq): 250µA
• Input Capacitance: 3pF
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (0.295", 7.50mm Width)

Paquete: 20-SOIC (0.295", 7.50mm Width)

74LVT240PW/AUJ

NXP

IC INVERTER 4-INP DUAL 20TSSOP

• Logic Type: Buffer, Inverting
• Number of Elements: 2
• Number of Bits per Element: 4
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 32mA, 64mA
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-TSSOP

Paquete: 20-TSSOP (0.173", 4.40mm Width)

74ABT620N,602

NXP

IC TRANSCEIVER 3ST 8BIT 20DIP

• Logic Type: Transceiver, Inverting
• Number of Elements: 1
• Number of Bits per Element: 8
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 32mA, 64mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Through Hole
• Package / Case: 20-DIP (0.300", 7.62mm)
• Supplier Device Package: 20-DIP

Paquete: 20-DIP (0.300", 7.62mm)

TDA9885HN/V3,118

NXP

IC IF-PLL I2C-BUS DEMOD 32HVQFN

• Type: Demodulator
• Applications: TV
• Mounting Type: Surface Mount
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-HVQFN (5x5)

Paquete: 32-VFQFN Exposed Pad

P5020NSE1MMB

NXP

IC MPU Q OR IQ 2.0GHZ 1295FCBGA

• Core Processor: PowerPC e5500
• Number of Cores/Bus Width: 2 Core, 64-Bit
• Speed: 2.0GHz
• Co-Processors/DSP: Security; SEC 4.2
• RAM Controllers: DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 1 Gbps (5), 10 Gbps (1)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: -
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection
• Package / Case: 1295-BBGA, FCBGA
• Supplier Device Package: 1295-FCPBGA (37.5x37.5)

Paquete: 1295-BBGA, FCBGA

MC7448VS1420LC

NXP

IC MPU MPC74XX 1.42GHZ 360FCCLGA

• Core Processor: PowerPC G4
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.42GHz
• Co-Processors/DSP: Multimedia; SIMD
• RAM Controllers: -
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 1.5V, 1.8V, 2.5V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 360-CLGA, FCCLGA
• Supplier Device Package: 360-FCCLGA (25x25)

Paquete: 360-CLGA, FCCLGA

P4040NSN7MMC

NXP

IC MPU Q OR IQ 1.5GHZ 1295FCBGA

• Core Processor: PowerPC e500mc
• Number of Cores/Bus Width: 4 Core, 32-Bit
• Speed: 1.5GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR2, DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 1 Gbps (8), 10 Gbps (2)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 1295-BBGA, FCBGA
• Supplier Device Package: 1295-FCPBGA (37.5x37.5)

Paquete: 1295-BBGA, FCBGA

MCIMX283DVM4BR2

NXP

IC MPU I.MX28 454MHZ 289MAPBGA

• Core Processor: ARM926EJ-S
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 454MHz
• Co-Processors/DSP: Data; DCP
• RAM Controllers: LVDDR, LVDDR2, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: Keyboard, LCD, Touchscreen
• Ethernet: 10/100 Mbps (1)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 1.8V, 3.3V
• Operating Temperature: -20°C ~ 70°C (TA)
• Security Features: Boot Security, Cryptography, Hardware ID
• Package / Case: 289-LFBGA
• Supplier Device Package: 289-MAPBGA (14x14)

Paquete: 289-LFBGA

MK10DX256VMB7

NXP

IC MCU 32BIT 256KB FLASH 81BGA

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 72MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, SPI, UART/USART
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 57
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 39x16b, D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 81-LBGA
• Supplier Device Package: 81-MAPBGA (10x10)

Paquete: 81-LBGA

MCF5272VM66R2

NXP

IC MCU 32BIT 16KB ROM 196MAPBGA

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 66MHz
• Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
• Peripherals: DMA, WDT
• Number of I/O: 32
• Program Memory Size: 16KB (4K x 32)
• Program Memory Type: ROM
• EEPROM Size: -
• RAM Size: 1K x 32
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 196-LBGA
• Supplier Device Package: 196-MAPBGA (15x15)

Paquete: 196-LBGA

S912XDP512J1MAL

NXP

IC MCU 16BIT 512KB FLASH 112LQFP

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: CAN, I2C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 91
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 8x10b, 16x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

Paquete: 112-LQFP

MC56F8356MFVE

NXP

IC MCU 16BIT 256KB FLASH 144LQFP

• Core Processor: 56800E
• Core Size: 16-Bit
• Speed: 60MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI
• Peripherals: POR, PWM, Temp Sensor, WDT
• Number of I/O: 62
• Program Memory Size: 256KB (128K x 16)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 10K x 16
• Voltage - Supply (Vcc/Vdd): 2.25 V ~ 3.6 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

Paquete: 144-LQFP

MC56F8357VPYE

NXP

IC MCU 16BIT 256KB FLASH 160LQFP

• Core Processor: 56800E
• Core Size: 16-Bit
• Speed: 60MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI
• Peripherals: POR, PWM, Temp Sensor, WDT
• Number of I/O: 76
• Program Memory Size: 256KB (128K x 16)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 10K x 16
• Voltage - Supply (Vcc/Vdd): 2.25 V ~ 3.6 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 160-LQFP
• Supplier Device Package: 160-LQFP (24x24)

Paquete: 160-LQFP

SA8027DH,518

NXP

IC FREQ SYNTHESIZER 20-TSSOP

• Type: Fractional N Synthesizer
• PLL: Yes
• Input: Clock
• Output: Clock
• Number of Circuits: 1
• Ratio - Input:Output: 2:3
• Differential - Input:Output: Yes/No
• Frequency - Max: 2.5GHz
• Divider/Multiplier: Yes/No
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-TSSOP

Paquete: 20-TSSOP (0.173", 4.40mm Width)

SA615D/01,112

NXP

IC MIXER 500MHZ UP CONVRT 20SO

• RF Type: Cellular, ASK, FSK, UHF, VHF
• Frequency: 500MHz
• Number of Mixers: 3
• Gain: 13dB
• Noise Figure: 5dB
• Secondary Attributes: Up Converter
• Current - Supply: 7.4mA
• Voltage - Supply: 4.5 V ~ 8 V
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SO

Paquete: 20-SOIC (0.295", 7.50mm Width)

PN7120A0EV/C10801Y

NXP

IC NFC CTLR FW/NCI 49VFBGA

• Function: Controller
• Frequency: 13.56MHz
• RF Type: NFC, FeliCa
• Secondary Attributes: -
• Package / Case: 49-VFBGA
• Supplier Device Package: 49-VFBGA (4x4.3)

Paquete: 49-VFBGA

OM7691/BFU730F,598

NXP

EVAL BOARD FOR BFU730F

• Type: Amplifier
• Frequency: 5GHz ~ 6GHz
• For Use With/Related Products: BFU730F
• Supplied Contents: Board

Paquete: -

TJA1028T/3V3/10/2Z

NXP

LIN TRANSCEIVER WITH INTEGRATED

• Type: Transceiver
• Protocol: LINbus
• Number of Drivers/Receivers: 1/1
• Duplex: Half
• Receiver Hysteresis: 200mV
• Data Rate: -
• Voltage - Supply: 3.3V
• Operating Temperature: -40°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

Paquete: 8-SOIC (0.154", 3.90mm Width)

MKM34Z256VLQ7

NXP

KINETIS KM34: 75MHZ CORTEX-M0+ M

• Core Processor: ARM® Cortex®-M0+
• Core Size: 32-Bit
• Speed: 75MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: DMA, LCD, WDT
• Number of I/O: 99
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 16x16b, 4x24b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

Paquete: 144-LQFP

FC32K144HFT0MLFT

NXP

S32K144 32-BIT MCU, ARM CORTEX-M

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

Paquete: -

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PCF8545BTT-AY

NXP

UNIVERSAL LCD DRIVER FOR MULTIPL

• Display Type: LCD
• Configuration: 320 Segment
• Interface: SPI
• Digits or Characters: 20 Characters, 40 Characters, 320 Elements
• Current - Supply: 30 µA
• Voltage - Supply: 1.8V ~ 5.5V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 56-TFSOP (0.240", 6.10mm Width)
• Supplier Device Package: 56-TSSOP

Paquete: -

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MC33FS6515KAER2

NXP

SYSTEM BASIS CHIP, DCDC 1.5A VCO

• Applications: System Basis Chip
• Current - Supply: -
• Voltage - Supply: 1V ~ 5V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-HLQFP (7x7)

Paquete: -

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SAF7750EL-N207ZY

NXP

CAR DSP

• Type: -
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

Paquete: -

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S32G234MSBK1VUCR

NXP

S32G234M ARM CORTEX-M7, HSE W/PR

• Core Processor: ARM® Cortex®-M7
• Number of Cores/Bus Width: 3 Core, 32/64-Bit
• Speed: 400MHz
• Co-Processors/DSP: Multimedia; NEON
• RAM Controllers: -
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 1/2.5Gbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
• Package / Case: 525-FBGA, FCBGA
• Supplier Device Package: 525-FCPBGA (19x19)

Paquete: -

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