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NXP |
MOSFET N-CH 30V 75A DPAK
- FET Type: N-Channel
- Technology: MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss): 30V
- Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
- Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
- Vgs(th) (Max) @ Id: 2.5V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs: 16.7nC @ 5V
- Input Capacitance (Ciss) (Max) @ Vds: 1620pF @ 25V
- Vgs (Max): ±20V
- FET Feature: -
- Power Dissipation (Max): 136W (Tc)
- Rds On (Max) @ Id, Vgs: 8 mOhm @ 25A, 10V
- Operating Temperature: -55°C ~ 175°C (TJ)
- Mounting Type: Surface Mount
- Supplier Device Package: DPAK
- Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
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Paquete: TO-252-3, DPak (2 Leads + Tab), SC-63 |
En existencias5.600 |
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NXP |
TRANS NPN 12V 35MA 5GHZ SOT323
- Transistor Type: NPN
- Voltage - Collector Emitter Breakdown (Max): 12V
- Frequency - Transition: 5GHz
- Noise Figure (dB Typ @ f): 1.5dB ~ 2.1dB @ 1GHz ~ 2GHz
- Gain: -
- Power - Max: 300mW
- DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 30mA, 5V
- Current - Collector (Ic) (Max): 35mA
- Operating Temperature: 150°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: SC-70, SOT-323
- Supplier Device Package: SOT-323-3
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Paquete: SC-70, SOT-323 |
En existencias7.856 |
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NXP |
IC TEMP SENSOR DIMM 3.3V 8-HWSON
- Function: Temp Monitoring System (Sensor), DIMM DDR Memory
- Sensor Type: Internal
- Sensing Temperature: -40°C ~ 125°C
- Accuracy: ±3°C
- Topology: ADC (Sigma Delta), Comparator, Register Bank
- Output Type: 2-Wire Serial, I2C/SMBUS
- Output Alarm: Yes
- Output Fan: Yes
- Voltage - Supply: 3 V ~ 3.6 V
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Surface Mount
- Package / Case: 8-WFDFN Exposed Pad
- Supplier Device Package: 8-HWSON (2x3)
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Paquete: 8-WFDFN Exposed Pad |
En existencias7.824 |
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NXP |
IC MOTOR DRIVER SPI 24SOIC
- Motor Type - Stepper: Bipolar
- Motor Type - AC, DC: -
- Function: Driver - Fully Integrated, Control and Power Stage
- Output Configuration: Half Bridge (8)
- Interface: SPI
- Technology: -
- Step Resolution: -
- Applications: Automotive
- Current - Output: 40mA
- Voltage - Supply: 4.5 V ~ 5.5 V
- Voltage - Load: 6.5 V ~ 26 V
- Operating Temperature: -40°C ~ 150°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: 24-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 24-SOIC
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Paquete: 24-SOIC (0.295", 7.50mm Width) |
En existencias3.360 |
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NXP |
IC LED DRIVER RGLTR 1.5A 7SOIC
- Type: DC DC Regulator
- Topology: Flyback, SEPIC, Step-Down (Buck), Step-Up (Boost)
- Internal Switch(s): Yes
- Number of Outputs: 1
- Voltage - Supply (Min): -
- Voltage - Supply (Max): 35V
- Voltage - Output: -
- Current - Output / Channel: 1.5A (Switch)
- Frequency: 50.5kHz
- Dimming: -
- Applications: -
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 8-SOIC (0.154", 3.90mm Width) 7 leads
- Supplier Device Package: 7-SOIC
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Paquete: 8-SOIC (0.154", 3.90mm Width) 7 leads |
En existencias7.648 |
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NXP |
IC LED DRVR PS DIM 25MA 16TSSOP
- Type: Power Switch
- Topology: -
- Internal Switch(s): Yes
- Number of Outputs: 8
- Voltage - Supply (Min): 2.3V
- Voltage - Supply (Max): 5.5V
- Voltage - Output: -
- Current - Output / Channel: 25mA
- Frequency: 400kHz
- Dimming: PWM
- Applications: -
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 16-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 16-TSSOP
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Paquete: 16-TSSOP (0.173", 4.40mm Width) |
En existencias5.616 |
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NXP |
IC CTRL SMPS 8SO
- Output Isolation: Isolated
- Internal Switch(s): No
- Voltage - Breakdown: -
- Topology: Flyback
- Voltage - Start Up: 20.6V
- Voltage - Supply (Vcc/Vdd): 12 V ~ 30 V
- Duty Cycle: 72%
- Frequency - Switching: 123kHz
- Power (Watts): 75W
- Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
- Control Features: -
- Operating Temperature: -40°C ~ 150°C (TJ)
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 8-SO
- Mounting Type: Surface Mount
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Paquete: 8-SOIC (0.154", 3.90mm Width) |
En existencias7.968 |
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NXP |
IC GATE NAND 3CH 3-INP 14-DIP
- Logic Type: NAND Gate
- Number of Circuits: 3
- Number of Inputs: 3
- Features: -
- Voltage - Supply: 4.5 V ~ 5.5 V
- Current - Quiescent (Max): 2µA
- Current - Output High, Low: 4mA, 4mA
- Logic Level - Low: 0.8V
- Logic Level - High: 2V
- Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Through Hole
- Supplier Device Package: 14-DIP
- Package / Case: 14-DIP (0.300", 7.62mm)
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Paquete: 14-DIP (0.300", 7.62mm) |
En existencias2.256 |
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NXP |
IC TV SILICON TUNER 32-HVQFN
- Type: Tuner
- Applications: Mobile Phones, Cellular, Video Displays
- Mounting Type: Surface Mount
- Package / Case: 32-VFQFN Exposed Pad
- Supplier Device Package: 32-HVQFN (5x5)
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Paquete: 32-VFQFN Exposed Pad |
En existencias5.456 |
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NXP |
IC MPU M683XX 16MHZ 100LQFP
- Core Processor: M68000
- Number of Cores/Bus Width: 1 Core, 8/16-Bit
- Speed: 16MHz
- Co-Processors/DSP: Communications; RISC CPM
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: 5.0V
- Operating Temperature: -40°C ~ 85°C (TA)
- Security Features: -
- Package / Case: 100-LQFP
- Supplier Device Package: 100-LQFP (14x14)
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Paquete: 100-LQFP |
En existencias5.088 |
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NXP |
IC MCU 32BIT 512KB FLASH 100BGA
- Core Processor: ARM? Cortex?-M3
- Core Size: 32-Bit
- Speed: 100MHz
- Connectivity: CAN, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
- Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
- Number of I/O: 70
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 64K x 8
- Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
- Data Converters: A/D 8x12b, D/A 1x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 100-TFBGA
- Supplier Device Package: 100-TFBGA (9x9)
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Paquete: 100-TFBGA |
En existencias3.088 |
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NXP |
IC MCU 8BIT 2KB FLASH 20DIP
- Core Processor: 8051
- Core Size: 8-Bit
- Speed: 18MHz
- Connectivity: I2C, UART/USART
- Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
- Number of I/O: 18
- Program Memory Size: 2KB (2K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 256 x 8
- Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
- Data Converters: -
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 20-DIP (0.300", 7.62mm)
- Supplier Device Package: 20-DIP
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Paquete: 20-DIP (0.300", 7.62mm) |
En existencias2.080 |
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NXP |
IC MCU 8BIT 16KB FLASH 48LQFP
- Core Processor: HC08
- Core Size: 8-Bit
- Speed: 8MHz
- Connectivity: LIN, SCI, SPI
- Peripherals: LVD, POR, PWM
- Number of I/O: 37
- Program Memory Size: 16KB (16K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 1K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 8x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 48-LQFP
- Supplier Device Package: 48-LQFP (7x7)
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Paquete: 48-LQFP |
En existencias5.744 |
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NXP |
IC MCU 8BIT 4KB FLASH 16SOIC
- Core Processor: HC08
- Core Size: 8-Bit
- Speed: 8MHz
- Connectivity: LIN
- Peripherals: LVD, POR, PWM
- Number of I/O: 13
- Program Memory Size: 4KB (4K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 128 x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 6x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 16-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 16-SOIC
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Paquete: 16-SOIC (0.295", 7.50mm Width) |
En existencias3.712 |
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NXP |
IC MCU 32BIT ROMLESS 364MAPBGA
- Core Processor: ARM? Cortex?-A5 + Cortex?-M4
- Core Size: 32-Bit Dual-Core
- Speed: 500MHz
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG
- Peripherals: DMA, LVD, WDT
- Number of I/O: -
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: -
- RAM Size: 1.5MB
- Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
- Data Converters: A/D Dual x 12b, D/A Dual x 12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Paquete: - |
En existencias6.832 |
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NXP |
IC MCU 32BIT 6MB FLASH 256MAPBGA
- Core Processor: e200z2, e200z4, e200z4
- Core Size: 32-Bit Tri-Core
- Speed: 80MHz/160MHz
- Connectivity: CAN, Ethernet, I2C, LIN, SAI, SPI, USB, USB OTG
- Peripherals: DMA, LVD, POR, WDT
- Number of I/O: 178
- Program Memory Size: 6MB (6M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 768K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 80x10b, 64x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 256-LBGA
- Supplier Device Package: 256-MAPPBGA (17x17)
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Paquete: 256-LBGA |
En existencias9.480 |
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NXP |
IC MCU 32BIT 128KB FLASH 144LQFP
- Core Processor: ARM? Cortex?-M4
- Core Size: 32-Bit
- Speed: 100MHz
- Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
- Peripherals: DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O: 100
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 42x16b, D/A 2x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 144-LQFP
- Supplier Device Package: 144-LQFP (20x20)
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Paquete: 144-LQFP |
En existencias9.012 |
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NXP |
IC MCU 32BIT 128KB FLASH 144BGA
- Core Processor: ARM? Cortex?-M4
- Core Size: 32-Bit
- Speed: 100MHz
- Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
- Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
- Number of I/O: 98
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 42x16b, D/A 2x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 144-LBGA
- Supplier Device Package: 144-MAPBGA (13x13)
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Paquete: 144-LBGA |
En existencias5.952 |
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NXP |
IC MCU 16BIT 128KB FLASH 80QFP
- Core Processor: HCS12
- Core Size: 16-Bit
- Speed: 25MHz
- Connectivity: EBI/EMI, I2C, SCI, SPI
- Peripherals: POR, PWM, WDT
- Number of I/O: 60
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 8K x 8
- Voltage - Supply (Vcc/Vdd): 2.35 V ~ 2.75 V
- Data Converters: A/D 16x10b; D/A 2x8b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 80-QFP
- Supplier Device Package: 80-QFP (14x14)
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Paquete: 80-QFP |
En existencias594.108 |
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NXP |
IC DRIVER CLK PLL 160MHZ 28-PLCC
- Type: Clock Driver, Fanout Distribution, Multiplexer
- PLL: Yes
- Input: TTL
- Output: CMOS, TTL
- Number of Circuits: 1
- Ratio - Input:Output: 3:8
- Differential - Input:Output: No/No
- Frequency - Max: 160MHz
- Divider/Multiplier: Yes/Yes
- Voltage - Supply: 4.75 V ~ 5.25 V
- Operating Temperature: 0°C ~ 70°C
- Mounting Type: Surface Mount
- Package / Case: 28-LCC (J-Lead)
- Supplier Device Package: 28-PLCC (12.45x12.45)
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Paquete: 28-LCC (J-Lead) |
En existencias5.808 |
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NXP |
IC BAROMETER I2C DGTL MINI 8-LGA
- Pressure Type: Absolute
- Operating Pressure: 7.25 PSI ~ 16.68 PSI (50 kPa ~ 115 kPa)
- Output Type: I2C
- Output: 10 b
- Accuracy: ±0.145 PSI (±1 kPa)
- Voltage - Supply: 2.375 V ~ 5.5 V
- Port Size: -
- Port Style: No Port
- Features: Shutdown Mode
- Termination Style: PCB
- Maximum Pressure: 145.04 PSI (1000 kPa)
- Operating Temperature: -40°C ~ 105°C
- Package / Case: 8-TLGA
- Supplier Device Package: 8-LGA
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Paquete: 8-TLGA |
En existencias3.600 |
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NXP |
IC RF PWR AMP 26V 900MW 1.5-PLD
- Frequency: 800MHz ~ 2.1GHz
- P1dB: 29.3dBm (850mW)
- Gain: 13dB
- Noise Figure: -
- RF Type: Cellular, CDMA, EDGE, GSM, TDMA, W-CDMA
- Voltage - Supply: 26V
- Current - Supply: 12mA
- Test Frequency: 2.17GHz
- Package / Case: PLD-1.5
- Supplier Device Package: PLD-1.5
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Paquete: PLD-1.5 |
En existencias3.024 |
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NXP |
NXP 32-BIT MCU DUAL POWER ARCH
- Core Processor: e200z7d
- Core Size: 32-Bit Dual-Core
- Speed: 180MHz
- Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: -
- Program Memory Size: 2MB (2M x 8)
- Program Memory Type: FLASH
- EEPROM Size: 64K x 8
- RAM Size: 512K x 8
- Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.5 V
- Data Converters: A/D 22x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 257-LFBGA
- Supplier Device Package: 257-MAPBGA (14x14)
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Paquete: 257-LFBGA |
En existencias9.828 |
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NXP |
DUAL CORE 4M FLASH 512K RAM F
- Core Processor: e200z2, e200z4
- Core Size: 32-Bit Dual-Core
- Speed: 80MHz/160MHz
- Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
- Peripherals: DMA, LVD, POR, WDT
- Number of I/O: 178
- Program Memory Size: 4MB (4M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 512K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 80x10b, 64x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 256-LBGA
- Supplier Device Package: 256-MAPPBGA (17x17)
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Paquete: 256-LBGA |
En existencias3.968 |
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NXP |
I.MX8QXP WITH DDR3L
- Applications: High Performance i.MX 8, S32x Processor Based
- Current - Supply: -
- Voltage - Supply: 2.5V ~ 5.5V
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount, Wettable Flank
- Package / Case: 56-VFQFN Exposed Pad
- Supplier Device Package: 56-HVQFN (8x8)
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Paquete: 56-VFQFN Exposed Pad |
En existencias3.456 |
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NXP |
S32G254A ARM CORTEX-M7 AND -A53,
- Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
- Number of Cores/Bus Width: 3 Core, 64-Bit/2 Core, 32-Bit
- Speed: 400MHz, 1GHz
- Co-Processors/DSP: Multimedia; NEON
- RAM Controllers: DDR3L, LPDDR4
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 1/2.5Gbps (4)
- SATA: -
- USB: USB 2.0 OTG (1)
- Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
- Package / Case: 525-FBGA, FCBGA
- Supplier Device Package: 525-FCPBGA (19x19)
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Paquete: - |
Request a Quote |
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NXP |
IC MCU 32BIT ROMLESS 256LBGA
- Core Processor: ARM® Cortex®-M3
- Core Size: 32-Bit
- Speed: 180MHz
- Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
- Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
- Number of I/O: 164
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: -
- RAM Size: 200K x 8
- Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
- Data Converters: A/D 8x10bSAR; D/A 1x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 256-LBGA
- Supplier Device Package: 256-LBGA (17x17)
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Paquete: - |
Request a Quote |
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NXP |
PIN DIODE, 50V V(BR), SILICON
- Diode Type: PIN - 1 Pair Series Connection
- Voltage - Peak Reverse (Max): 50V
- Current - Max: 50 mA
- Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
- Resistance @ If, F: 2.5Ohm @ 10mA, 100MHz
- Power Dissipation (Max): 240 mW
- Operating Temperature: -65°C ~ 150°C (TJ)
- Package / Case: SC-70, SOT-323
- Supplier Device Package: SC-70
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Paquete: - |
Request a Quote |
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