NXP Productos

PHP110NQ06LT,127

NXP

MOSFET N-CH 55V 75A TO220AB

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 55V
• Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
• Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
• Vgs(th) (Max) @ Id: 2V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: 45nC @ 5V
• Input Capacitance (Ciss) (Max) @ Vds: 3960pF @ 25V
• Vgs (Max): ±15V
• FET Feature: -
• Power Dissipation (Max): 200W (Tc)
• Rds On (Max) @ Id, Vgs: 7 mOhm @ 25A, 10V
• Operating Temperature: -55°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Supplier Device Package: TO-220AB
• Package / Case: TO-220-3

Paquete: TO-220-3

MRFG35005NT1

NXP

FET RF 15V 3.55GHZ 1.5PLD

• Transistor Type: pHEMT FET
• Frequency: 3.55GHz
• Gain: 11dB
• Voltage - Test: 12V
• Current Rating: -
• Noise Figure: -
• Current - Test: 80mA
• Power - Output: 4.5W
• Voltage - Rated: 15V
• Package / Case: PLD-1.5
• Supplier Device Package: PLD-1.5

Paquete: PLD-1.5

BF240,112

NXP

TRANS NPN 40V 25MA SOT54

• Transistor Type: NPN
• Voltage - Collector Emitter Breakdown (Max): 40V
• Frequency - Transition: 150MHz
• Noise Figure (dB Typ @ f): -
• Gain: -
• Power - Max: 300mW
• DC Current Gain (hFE) (Min) @ Ic, Vce: 67 @ 1mA, 10V
• Current - Collector (Ic) (Max): 25mA
• Operating Temperature: 150°C (TJ)
• Mounting Type: Through Hole
• Package / Case: TO-226-3, TO-92-3 (TO-226AA)
• Supplier Device Package: TO-92-3

Paquete: TO-226-3, TO-92-3 (TO-226AA)

BZX84-B10/LF1VL

NXP

DIODE ZENER TO-236AB SOT23

• Voltage - Zener (Nom) (Vz): 10V
• Tolerance: ±2%
• Power - Max: 250mW
• Impedance (Max) (Zzt): 20 Ohms
• Current - Reverse Leakage @ Vr: 100nA @ 8V
• Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA
• Operating Temperature: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: TO-236AB (SOT23)

Paquete: TO-236-3, SC-59, SOT-23-3

LD6806F/33H,115

NXP

IC REG LINEAR 3.3V 200MA 6-XSON

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 1
• Voltage - Input (Max): 5.5V
• Voltage - Output (Min/Fixed): 3.3V
• Voltage - Output (Max): -
• Voltage Dropout (Max): 0.13V @ 200mA
• Current - Output: 200mA
• Current - Quiescent (Iq): -
• Current - Supply (Max): 100µA ~ 250µA
• PSRR: 55dB (1kHz)
• Control Features: Enable
• Protection Features: Over Current, Over Temperature
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 6-XFDFN
• Supplier Device Package: 6-XSON, SOT886 (1.45x1)

Paquete: 6-XFDFN

LD6816CX4/29P,315

NXP

IC REG LINEAR 2.9V 150MA 4WLCSP

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 1
• Voltage - Input (Max): 5.5V
• Voltage - Output (Min/Fixed): 2.9V
• Voltage - Output (Max): -
• Voltage Dropout (Max): 0.075V @ 150mA
• Current - Output: 150mA
• Current - Quiescent (Iq): -
• Current - Supply (Max): 100µA ~ 250µA
• PSRR: 55dB (1kHz)
• Control Features: Enable
• Protection Features: Over Current, Over Temperature, Transient Voltage
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 4-XFBGA, WLCSP
• Supplier Device Package: 4-WLCSP (0.76x0.76)

Paquete: 4-XFBGA, WLCSP

MC33886DH

NXP

IC MOTOR DRIVER PAR 20HSOP

• Motor Type - Stepper: -
• Motor Type - AC, DC: Brushed DC
• Function: Driver - Fully Integrated, Control and Power Stage
• Output Configuration: Half Bridge (2)
• Interface: Parallel
• Technology: CMOS
• Step Resolution: -
• Applications: General Purpose
• Current - Output: 5A
• Voltage - Supply: 5 V ~ 40 V
• Voltage - Load: 5 V ~ 40 V
• Operating Temperature: -40°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
• Supplier Device Package: 20-HSOP

Paquete: 20-SOIC (0.433", 11.00mm Width) Exposed Pad

N74F241N,602

NXP

IC BUFFER TRI-ST NON-INV 20DIP

• Logic Type: Buffer, Non-Inverting
• Number of Elements: 2
• Number of Bits per Element: 4
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 15mA, 64mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Through Hole
• Package / Case: 20-DIP (0.300", 7.62mm)
• Supplier Device Package: 20-DIP

Paquete: 20-DIP (0.300", 7.62mm)

TDA9886T/V4,118

NXP

IC IF-PLL I2C-BUS DEMOD 24-SOIC

• Type: Demodulator
• Applications: TV
• Mounting Type: Surface Mount
• Package / Case: 24-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 24-SO

Paquete: 24-SOIC (0.295", 7.50mm Width)

NCX2220GM,125

NXP

IC COMP RAIL-TO-RAIL 8XQFN

• Type: General Purpose
• Number of Elements: 2
• Output Type: Rail-to-Rail
• Voltage - Supply, Single/Dual (±): 1.3 V ~ 5.5 V
• Voltage - Input Offset (Max): 30mV @ 5.5V
• Current - Input Bias (Max): 1pA
• Current - Output (Typ): -
• Current - Quiescent (Max): 5µA
• CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
• Propagation Delay (Max): 0.8µs
• Hysteresis: 20mV
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-XFQFN Exposed Pad
• Mounting Type: Surface Mount
• Supplier Device Package: 8-XQFN (1.6x1.6)

Paquete: 8-XFQFN Exposed Pad

SC16C852IBS,128

NXP

IC UART DUAL W/FIFO 32HVQFN

• Features: -
• Number of Channels: 2, DUART
• FIFO's: 128 Byte
• Protocol: RS485
• Data Rate (Max): 5Mbps
• Voltage - Supply: 2.5 V ~ 3.3 V
• With Auto Flow Control: Yes
• With IrDA Encoder/Decoder: Yes
• With False Start Bit Detection: Yes
• With Modem Control: Yes
• Mounting Type: Surface Mount
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-HVQFN (5x5)

Paquete: 32-VFQFN Exposed Pad

PCF8574P,112

NXP

IC I/O EXPANDER I2C 8B 16DIP

• Number of I/O: 8
• Interface: I2C
• Interrupt Output: Yes
• Features: POR
• Output Type: Push-Pull
• Current - Output Source/Sink: 300µA, 25mA
• Clock Frequency: 100kHz
• Voltage - Supply: 2.5 V ~ 6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Through Hole
• Package / Case: 16-DIP (0.300", 7.62mm)
• Supplier Device Package: 16-DIP

Paquete: 16-DIP (0.300", 7.62mm)

UJA1161T,118

NXP

IC TRANSCEIVER 14SOIC

• Type: Transceiver
• Protocol: CAN
• Number of Drivers/Receivers: 1/1
• Duplex: -
• Receiver Hysteresis: -
• Data Rate: -
• Voltage - Supply: 3.3 V ~ 5 V
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 14-SO

Paquete: 14-SOIC (0.154", 3.90mm Width)

MC33662BJEFR2

NXP

IC TXRX LIN 2.1 10KBPS 8SOIC

• Type: Transceiver
• Protocol: LIN
• Number of Drivers/Receivers: 1/1
• Duplex: -
• Receiver Hysteresis: -
• Data Rate: 10kbps
• Voltage - Supply: 7 V ~ 18 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

Paquete: 8-SOIC (0.154", 3.90mm Width)

NX3L4051HR,115

NXP

IC ANALOG SWITCH 8CH SGL HXQFN16

• Switch Circuit: -
• Multiplexer/Demultiplexer Circuit: 8:1
• Number of Circuits: 1
• On-State Resistance (Max): 750 mOhm
• Channel-to-Channel Matching (ΔRon): 70 mOhm
• Voltage - Supply, Single (V+): 1.4 V ~ 4.3 V
• Voltage - Supply, Dual (V±): -
• Switch Time (Ton, Toff) (Max): 45ns, 25ns
• -3db Bandwidth: 15MHz
• Charge Injection: 15pC
• Channel Capacitance (CS(off), CD(off)): 35pF
• Current - Leakage (IS(off)) (Max): 10nA
• Crosstalk: -90dB @ 100kHz
• Operating Temperature: -40°C ~ 125°C (TA)
• Package / Case: 16-XFQFN Exposed Pad
• Supplier Device Package: 16-HXQFN (3x3)

Paquete: 16-XFQFN Exposed Pad

S711E20E0VFNE2R

NXP

IC MCU 8BIT 20KB OTP 52PLCC

• Core Processor: HC11
• Core Size: 8-Bit
• Speed: 2MHz
• Connectivity: SCI, SPI
• Peripherals: POR, WDT
• Number of I/O: 38
• Program Memory Size: 20KB (20K x 8)
• Program Memory Type: OTP
• EEPROM Size: 512 x 8
• RAM Size: 768 x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 52-LCC (J-Lead)
• Supplier Device Package: 52-PLCC (19.13x19.13)

Paquete: 52-LCC (J-Lead)

MCF5307CAI66B

NXP

IC MCU 32BIT ROMLESS 208FQFP

• Core Processor: Coldfire V3
• Core Size: 32-Bit
• Speed: 66MHz
• Connectivity: EBI/EMI, I2C, UART/USART
• Peripherals: DMA, POR, WDT
• Number of I/O: 16
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 208-BFQFP
• Supplier Device Package: 208-FQFP (28x28)

Paquete: 208-BFQFP

TDA8754HL/14/C1,51

NXP

IC TRPL 8BIT VIDEO ADC 144LQFP

• Type: ADC, Video
• Number of Channels: -
• Resolution (Bits): 8 b
• Sampling Rate (Per Second): 140M
• Data Interface: Serial
• Voltage Supply Source: Analog and Digital
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: -10°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

Paquete: 144-LQFP

PESD5V0L7BS,118

NXP

TVS DIODE 5VWM 17VC 8SOIC

• Type: Zener
• Unidirectional Channels: -
• Bidirectional Channels: 7
• Voltage - Reverse Standoff (Typ): 5V (Max)
• Voltage - Breakdown (Min): 7.2V
• Voltage - Clamping (Max) @ Ipp: 17V
• Current - Peak Pulse (10/1000µs): 2.5A (8/20µs)
• Power - Peak Pulse: 35W
• Power Line Protection: No
• Applications: General Purpose
• Capacitance @ Frequency: 8pF @ 1MHz
• Operating Temperature: -65°C ~ 150°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

Paquete: 8-SOIC (0.154", 3.90mm Width)

MMA7331LCR1

NXP

ACCELEROMETER 4-9G ANALOG 14LGA

• Type: Analog
• Axis: X, Y, Z
• Acceleration Range: ±4g, 9g
• Sensitivity (LSB/g): -
• Sensitivity (mV/g): 308 (±4g) ~ 83.6 (±9g)
• Bandwidth: 400Hz (X,Y), 300Hz (Z)
• Output Type: Analog Voltage
• Voltage - Supply: 2.2 V ~ 3.6 V
• Features: Selectable Scale
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 14-VFLGA
• Supplier Device Package: 14-LGA (3x5)

Paquete: 14-VFLGA

TDA1072AT/V4,112

NXP

IC AM RECEIVER CIRCUIT 16SOIC

• Frequency: AM
• Sensitivity: -
• Data Rate (Max): -
• Modulation or Protocol: AM
• Applications: AM Radio Receiver
• Current - Receiving: 15mA
• Data Interface: PCB, Surface Mount
• Memory Size: -
• Antenna Connector: PCB, Surface Mount
• Features: -
• Voltage - Supply: 7.5 V ~ 10 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 16-SO

Paquete: 16-SOIC (0.154", 3.90mm Width)

MC33FS6502LAER2

NXP

SYSTEM BASIS CHIP DCDC 0.8A VCO

• Applications: System Basis Chip
• Current - Supply: -
• Voltage - Supply: -1.0 V ~ 40 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-LQFP (7x7)

Paquete: 48-LQFP Exposed Pad

FS32K118LAT0MLFT

NXP

MCU S32K118 M0+ 256K 48 LQFP

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

Paquete: -

LS1028AXN7KQA

NXP

IC MPU QORIQ LAYER 1GHZ 448FBGA

• Core Processor: ARM® Cortex®-A72
• Number of Cores/Bus Width: 2 Core, 64-Bit
• Speed: 1GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: 1Gbps (1), 2.5Gbps (5)
• SATA: SATA 6Gbps (1)
• USB: -
• Voltage - I/O: -
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 448-BFBGA
• Supplier Device Package: 448-FBGA (17x17)

Paquete: -

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FS32K142HFT0MLFR

NXP

S32K142, 256K FLASH, 32K RAM

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

Paquete: -

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SAF7754HN-N207WMP

NXP

CAR DISP

• Type: -
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

Paquete: -

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FG32K144HFT0VLLT

NXP

S32K144 32-BIT MCU, ARM CORTEX-M

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

Paquete: -

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LX2120SC72029B

NXP

IC MPU QORLQ LX2 2GHZ 1517FCPBGA

• Core Processor: ARM® Cortex®-A72
• Number of Cores/Bus Width: 12 Core, 64-Bit
• Speed: 2GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR4
• Graphics Acceleration: Yes
• Display & Interface Controllers: -
• Ethernet: 100Gbps (2)
• SATA: SATA 3.0 (4)
• USB: USB 3.0 (2) + PHY (2)
• Voltage - I/O: 1.2V, 1.8V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TJ)
• Security Features: Secure Boot, TrustZone®
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FCPBGA (40x40)

Paquete: -

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