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NXP Productos

Registros 26.590
Página  656/950
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Paquete
En existencias
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hot MRF9135LSR3
NXP

FET RF 65V 880MHZ NI-780S

  • Transistor Type: LDMOS
  • Frequency: 880MHz
  • Gain: 17.8dB
  • Voltage - Test: 26V
  • Current Rating: -
  • Noise Figure: -
  • Current - Test: 1.1A
  • Power - Output: 25W
  • Voltage - Rated: 65V
  • Package / Case: NI-780S
  • Supplier Device Package: NI-780S
Paquete: NI-780S
En existencias44.760
BF908,215
NXP

MOSFET N-CH 12V 40MA SOT143B

  • Transistor Type: N-Channel Dual Gate
  • Frequency: 200MHz
  • Gain: -
  • Voltage - Test: 8V
  • Current Rating: 40mA
  • Noise Figure: 0.6dB
  • Current - Test: 15mA
  • Power - Output: -
  • Voltage - Rated: 12V
  • Package / Case: TO-253-4, TO-253AA
  • Supplier Device Package: SOT-143B
Paquete: TO-253-4, TO-253AA
En existencias5.280
LD6835K/12PX
NXP

IC REG LINEAR 1.2V 300MA 4HXSON

  • Output Configuration: Positive
  • Output Type: Fixed
  • Number of Regulators: 1
  • Voltage - Input (Max): 5.5V
  • Voltage - Output (Min/Fixed): 1.2V
  • Voltage - Output (Max): -
  • Voltage Dropout (Max): 0.24V @ 300mA (Typ)
  • Current - Output: 300mA
  • Current - Quiescent (Iq): -
  • Current - Supply (Max): 75µA
  • PSRR: 75dB (1kHz)
  • Control Features: Enable
  • Protection Features: Over Current, Over Temperature, Soft Start
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 4-XDFN Exposed Pad
  • Supplier Device Package: 4-HXSON (1x1)
Paquete: 4-XDFN Exposed Pad
En existencias6.608
TDA3629/N2,112
NXP

IC LIGHT POSITION CTRLR 8-DIP

  • Applications: Automotive
  • Current - Supply: 6mA
  • Voltage - Supply: 8 V ~ 18 V
  • Operating Temperature: -40°C ~ 105°C
  • Mounting Type: Through Hole
  • Package / Case: 8-DIP (0.300", 7.62mm)
  • Supplier Device Package: 8-DIP
Paquete: 8-DIP (0.300", 7.62mm)
En existencias4.096
HEF4514BP,652
NXP

IC 1-16 DECOD/DEMUX 24-DIP

  • Type: Decoder/Demultiplexer
  • Circuit: 1 x 4:16
  • Independent Circuits: 1
  • Current - Output High, Low: 3mA, 3mA
  • Voltage Supply Source: Dual Supply
  • Voltage - Supply: 4.5 V ~ 15.5 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Through Hole
  • Package / Case: 24-DIP (0.600", 15.24mm)
  • Supplier Device Package: 24-DIP
Paquete: 24-DIP (0.600", 15.24mm)
En existencias5.104
TDA8948J/N1,112
NXP

IC AMP AUDIO PWR 24W QUAD 17SIL

  • Type: Class AB
  • Output Type: 2-Channel (Stereo) or 4-Channel (Quad)
  • Max Output Power x Channels @ Load: 24W x 2 @ 8 Ohm; 12W x 4 @ 4 Ohm
  • Voltage - Supply: 9 V ~ 26 V
  • Features: Mute, Short-Circuit and Thermal Protection, Standby
  • Mounting Type: Through Hole
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Supplier Device Package: DBS17P
  • Package / Case: 17-SIP Formed Leads
Paquete: 17-SIP Formed Leads
En existencias7.936
TDF8546AJS/N1ZS
NXP

IC AMP AUDIO BTL DBSMS27P

  • Type: Class AB
  • Output Type: 4-Channel (Quad)
  • Max Output Power x Channels @ Load: 25W x 4 @ 4 Ohm
  • Voltage - Supply: 6 V ~ 18 V
  • Features: Depop, Short-Circuit and Thermal Protection
  • Mounting Type: Surface Mount
  • Operating Temperature: -
  • Supplier Device Package: 27-DBS
  • Package / Case: 24-SIP, Formed Leads
Paquete: 24-SIP, Formed Leads
En existencias6.272
TDA8024TT/C1/S1J
NXP

IC SMART CARD STD 28TSSOP

  • Applications: -
  • Interface: Analog
  • Voltage - Supply: 2.7 V ~ 6.5 V
  • Package / Case: 28-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 28-TSSOP
  • Mounting Type: Surface Mount
Paquete: 28-TSSOP (0.173", 4.40mm Width)
En existencias5.504
PCA9547D,112
NXP

IC MUX 8CH I2C BUS 24-SOIC

  • Applications: Translating Multiplexer
  • Interface: I2C, SMBus
  • Voltage - Supply: 2.3 V ~ 3.6 V, 4.5 V ~ 5.5 V
  • Package / Case: 24-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 24-SO
  • Mounting Type: Surface Mount
Paquete: 24-SOIC (0.295", 7.50mm Width)
En existencias20.148
UJA1076ATW/5V0WD,1
NXP

IC SBC CAN/LIN 5.0V HS 32HTSSOP

  • Applications: Automotive
  • Interface: SPI Serial
  • Voltage - Supply: 4.5 V ~ 28 V
  • Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
  • Supplier Device Package: 32-HTSSOP
  • Mounting Type: Surface Mount
Paquete: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
En existencias43.758
hot P2040NSE1KLB
NXP

IC MPU Q OR IQ 1.0GHZ 780FCBGA

  • Core Processor: PowerPC e500mc
  • Number of Cores/Bus Width: 4 Core, 32-Bit
  • Speed: 1.0GHz
  • Co-Processors/DSP: Security; SEC 4.2
  • RAM Controllers: DDR3, DDR3L
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (5)
  • SATA: SATA 3Gbps (2)
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
  • Package / Case: -
  • Supplier Device Package: 780-FCPBGA (23x23)
Paquete: -
En existencias7.392
MCIMX6X1AVK08AB
NXP

IC MPU I.MX6SX 800MHZ 400MAPBGA

  • Core Processor: ARM? Cortex?-A9, ARM? Cortex?-M4
  • Number of Cores/Bus Width: 2 Core, 32-Bit
  • Speed: 200MHz, 800MHz
  • Co-Processors/DSP: Multimedia; NEON? MPE
  • RAM Controllers: LPDDR2, LVDDR3, DDR3
  • Graphics Acceleration: No
  • Display & Interface Controllers: Keypad, LCD
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: -
  • USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
  • Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
  • Package / Case: 400-LFBGA
  • Supplier Device Package: 400-MAPBGA (14x14)
Paquete: 400-LFBGA
En existencias6.880
MC9S08DN32MLF
NXP

IC MCU 8BIT 32KB FLASH 48LQFP

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 40MHz
  • Connectivity: I2C, LIN, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 39
  • Program Memory Size: 32KB (32K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 1K x 8
  • RAM Size: 1.5K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 16x12b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 48-LQFP
  • Supplier Device Package: 48-LQFP (7x7)
Paquete: 48-LQFP
En existencias3.568
SPC5534MVM80
NXP

IC MCU 32BIT 1MB FLASH 208MAPBGA

  • Core Processor: e200z6
  • Core Size: 32-Bit
  • Speed: 80MHz
  • Connectivity: CAN, EBI/EMI, Ethernet, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 192
  • Program Memory Size: 1MB (1M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 64K x 8
  • Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V
  • Data Converters: A/D 34x12b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 208-BGA
  • Supplier Device Package: 208-MAPBGA (17x17)
Paquete: 208-BGA
En existencias7.888
hot MC9S12HZ128VAL
NXP

IC MCU 16BIT 128KB FLASH 112LQFP

  • Core Processor: HCS12
  • Core Size: 16-Bit
  • Speed: 25MHz
  • Connectivity: CAN, EBI/EMI, I2C, SCI, SPI
  • Peripherals: LCD, Motor control PWM, POR, PWM, WDT
  • Number of I/O: 85
  • Program Memory Size: 128KB (128K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 2K x 8
  • RAM Size: 6K x 8
  • Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
  • Data Converters: A/D 16x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 112-LQFP
  • Supplier Device Package: 112-LQFP (20x20)
Paquete: 112-LQFP
En existencias57.600
LPC18S30FET100E
NXP

IC MCU 32BIT ROMLESS 100TFBGA

  • Core Processor: ARM? Cortex?-M3
  • Core Size: 32-Bit
  • Speed: 180MHz
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
  • Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
  • Number of I/O: 49
  • Program Memory Size: -
  • Program Memory Type: ROMless
  • EEPROM Size: -
  • RAM Size: 200K x 8
  • Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V
  • Data Converters: A/D 4x10b; D/A 1x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 100-TFBGA
  • Supplier Device Package: 100-TFBGA (9x9)
Paquete: 100-TFBGA
En existencias2.592
MC9S08JE128CLK
NXP

IC MCU 8BIT 128KB FLASH 80LQFP

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 48MHz
  • Connectivity: I2C, SCI, SPI, USB
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 46
  • Program Memory Size: 128KB (128K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 12K x 8
  • Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
  • Data Converters: A/D 8x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 80-LQFP
  • Supplier Device Package: 80-LQFP (12x12)
Paquete: 80-LQFP
En existencias5.424
LPC18S37JET100E
NXP

IC MCU 32BIT 1MB FLASH 100TFBGA

  • Core Processor: ARM? Cortex?-M3
  • Core Size: 32-Bit
  • Speed: 180MHz
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB
  • Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
  • Number of I/O: 49
  • Program Memory Size: 1MB (1M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 136K x 8
  • Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V
  • Data Converters: A/D 4x10b; D/A 1x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 100-TFBGA
  • Supplier Device Package: 100-TFBGA (9x9)
Paquete: 100-TFBGA
En existencias6.024
MK20DN64VLF5
NXP

IC MCU 32BIT 64KB FLASH 48LQFP

  • Core Processor: ARM? Cortex?-M4
  • Core Size: 32-Bit
  • Speed: 50MHz
  • Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
  • Peripherals: DMA, I2S, LVD, POR, PWM, WDT
  • Number of I/O: 29
  • Program Memory Size: 64KB (64K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 16K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
  • Data Converters: A/D 11x16b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 48-LQFP
  • Supplier Device Package: 48-LQFP (7x7)
Paquete: 48-LQFP
En existencias7.044
MPXV12GW7U
NXP

IC PRESSURE SENSOR 8-SOP

  • Pressure Type: Vented Gauge
  • Operating Pressure: 1.45 PSI (10 kPa)
  • Output Type: Wheatstone Bridge
  • Output: 0 mV ~ 55 mV (3V)
  • Accuracy: ±5%
  • Voltage - Supply: 3 V ~ 6 V
  • Port Size: Male - 0.22" (5.59mm) Tube
  • Port Style: Barbless
  • Features: -
  • Termination Style: PCB
  • Maximum Pressure: 10.88 PSI (75 kPa)
  • Operating Temperature: -40°C ~ 125°C
  • Package / Case: 8-DIP Module
  • Supplier Device Package: -
Paquete: 8-DIP Module
En existencias7.776
hot MPX53D
NXP

SENSOR DIFF PRESS 7.25PSI MAX

  • Pressure Type: Differential
  • Operating Pressure: 7.25 PSI (50 kPa)
  • Output Type: Wheatstone Bridge
  • Output: 0 mV ~ 60 mV (3V)
  • Accuracy: -0.6% ~ 0.4%
  • Voltage - Supply: 3 V ~ 6 V
  • Port Size: -
  • Port Style: No Port
  • Features: -
  • Termination Style: PCB
  • Maximum Pressure: 25.38 PSI (175 kPa)
  • Operating Temperature: -40°C ~ 125°C
  • Package / Case: 6-SIP Module
  • Supplier Device Package: -
Paquete: 6-SIP Module
En existencias18.444
JN5142N/J01,515
NXP

IC RF TXRX+MCU 802.15.4 40-VFQFN

  • Type: TxRx + MCU
  • RF Family/Standard: 802.15.4
  • Protocol: Zigbee?
  • Modulation: -
  • Frequency: 2.4GHz
  • Data Rate (Max): -
  • Power - Output: 2.5dBm
  • Sensitivity: -95dBm
  • Memory Size: 128kB ROM, 32kB RAM
  • Serial Interfaces: -
  • GPIO: -
  • Voltage - Supply: 2 V ~ 3.6 V
  • Current - Receiving: 16.5mA
  • Current - Transmitting: 15mA
  • Operating Temperature: -40°C ~ 125°C
  • Package / Case: 40-VFQFN Exposed Pad
Paquete: 40-VFQFN Exposed Pad
En existencias3.418
MPC7410HX450NE
NXP

NT HITCE RV1.4

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: -
Paquete: -
En existencias4.912
SPC5602DF1CLH3R
NXP

NXP 32-BIT MCU POWER ARCH CORE

  • Core Processor: e200z0h
  • Core Size: 32-Bit
  • Speed: 32MHz
  • Connectivity: CANbus, LINbus, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 45
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 16K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 16x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 64-LQFP
  • Supplier Device Package: 64-LQFP (10x10)
Paquete: 64-LQFP
En existencias5.904
MKE15Z64VFP4R
NXP

IC MCU 32BIT 64KB FLASH 40VFQFN

  • Core Processor: ARM® Cortex®-M0+
  • Core Size: 32-Bit Single-Core
  • Speed: 48MHz
  • Connectivity: CANbus, I2C, SPI, UART/USART
  • Peripherals: DMA, LVD, POR, PWM, WDT
  • Number of I/O: 36
  • Program Memory Size: 64KB (64K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 8K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
  • Data Converters: A/D 12x12b SAR; D/A 1x8b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 40-VFQFN Exposed Pad
  • Supplier Device Package: 40-HVQFN (5x5)
Paquete: -
Request a Quote
LPC5516JBD64E
NXP

IC MCU 32BIT 256KB FLASH 64HTQFP

  • Core Processor: ARM® Cortex®-M33
  • Core Size: 32-Bit Single-Core
  • Speed: 150MHz
  • Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
  • Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
  • Number of I/O: 36
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 96K x 8
  • Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
  • Data Converters: A/D 10x16b SAR
  • Oscillator Type: External, Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 64-TQFP Exposed Pad
  • Supplier Device Package: 64-HTQFP (10x10)
Paquete: -
En existencias480
MC32PF8121F1EPR2
NXP

POWER MANAGEMENT IC I.MX8 PRE-PR

  • Applications: Industrial, IoT
  • Current - Supply: -
  • Voltage - Supply: 2.5V ~ 5.5V
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN (8x8)
Paquete: -
Request a Quote
MFS2620AMBA0AD
NXP

AUTO SBC

  • Applications: -
  • Current - Supply: 30µA
  • Voltage - Supply: 3.2V ~ 40V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP-EP (7x7)
Paquete: -
Request a Quote