Página 564 - NXP Productos | Heisener Electronics
Contáctenos
SalesDept@heisener.com +86-755-83210559 ext. 816
Iniciar sesión/Registrar
Language Translation

* Please refer to the English Version as our Official Version.

BOM
Carro 0

NXP Productos

Registros 26.590
Página  564/950
Imagen
Nº de pieza
Fabricantes
Descripción
Paquete
En existencias
Cantidad
BUK653R2-55C,127
NXP

MOSFET N-CH 55V 120A TO220AB

  • FET Type: N-Channel
  • Technology: MOSFET (Metal Oxide)
  • Drain to Source Voltage (Vdss): 55V
  • Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
  • Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
  • Vgs(th) (Max) @ Id: 2.8V @ 1mA
  • Gate Charge (Qg) (Max) @ Vgs: 258nC @ 10V
  • Input Capacitance (Ciss) (Max) @ Vds: 15300pF @ 25V
  • Vgs (Max): ±16V
  • FET Feature: -
  • Power Dissipation (Max): 306W (Tc)
  • Rds On (Max) @ Id, Vgs: 3.2 mOhm @ 25A, 10V
  • Operating Temperature: -55°C ~ 175°C (TJ)
  • Mounting Type: Through Hole
  • Supplier Device Package: TO-220AB
  • Package / Case: TO-220-3
Paquete: TO-220-3
En existencias4.128
BFS25A,115
NXP

TRANS NPN 5V 6.5MA SOT323

  • Transistor Type: NPN
  • Voltage - Collector Emitter Breakdown (Max): 5V
  • Frequency - Transition: 5GHz
  • Noise Figure (dB Typ @ f): 1.8dB ~ 2dB @ 1GHz
  • Gain: -
  • Power - Max: 32mW
  • DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 500µA, 1V
  • Current - Collector (Ic) (Max): 6.5mA
  • Operating Temperature: 175°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: SC-70, SOT-323
  • Supplier Device Package: SOT-323-3
Paquete: SC-70, SOT-323
En existencias2.352
BZX284-C22,115
NXP

DIODE ZENER 22V 400MW SOD2

  • Voltage - Zener (Nom) (Vz): 22V
  • Tolerance: ±5%
  • Power - Max: 400mW
  • Impedance (Max) (Zzt): 25 Ohms
  • Current - Reverse Leakage @ Vr: 50nA @ 15.4V
  • Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
  • Operating Temperature: -65°C ~ 150°C
  • Mounting Type: Surface Mount
  • Package / Case: SOD-110
  • Supplier Device Package: SOD110
Paquete: SOD-110
En existencias2.880
PCA9624PW,112
NXP

IC LED DRIVER LINEAR DIM 24TSSOP

  • Type: Linear
  • Topology: -
  • Internal Switch(s): Yes
  • Number of Outputs: 8
  • Voltage - Supply (Min): 2.3V
  • Voltage - Supply (Max): 5.5V
  • Voltage - Output: 40V
  • Current - Output / Channel: 100mA
  • Frequency: 100kHz ~ 1MHz
  • Dimming: PWM
  • Applications: Backlight
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 24-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 24-TSSOP
Paquete: 24-TSSOP (0.173", 4.40mm Width)
En existencias7.428
N74F283D,623
NXP

IC BINARY FULL ADDER 4BIT 16SOIC

  • Logic Type: Binary Full Adder with Fast Carry
  • Supply Voltage: 4.5 V ~ 5.5 V
  • Number of Bits: 4
  • Operating Temperature: 0°C ~ 70°C
  • Mounting Type: Surface Mount
  • Package / Case: 16-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 16-SO
Paquete: 16-SOIC (0.154", 3.90mm Width)
En existencias6.480
HEF4014BP,652
NXP

IC STATIC SHIFT REG 8BIT 16DIP

  • Logic Type: Shift Register
  • Output Type: Push-Pull
  • Number of Elements: 1
  • Number of Bits per Element: 8
  • Function: Parallel or Serial to Serial
  • Voltage - Supply: 3 V ~ 15 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Through Hole
  • Package / Case: 16-DIP (0.300", 7.62mm)
  • Supplier Device Package: 16-DIP
Paquete: 16-DIP (0.300", 7.62mm)
En existencias7.456
74LVT16652ADGG,112
NXP

IC 16BIT BUS TXRX/REGIST 56TSSOP

  • Logic Type: Transceiver, Non-Inverting
  • Number of Elements: 2
  • Number of Bits per Element: 8
  • Input Type: -
  • Output Type: Push-Pull
  • Current - Output High, Low: 32mA, 64mA
  • Voltage - Supply: 2.7 V ~ 3.6 V
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 56-TFSOP (0.240", 6.10mm Width)
  • Supplier Device Package: 56-TSSOP
Paquete: 56-TFSOP (0.240", 6.10mm Width)
En existencias2.304
TDA1519CSP/N3,112
NXP

IC AMP AUDIO PWR 22W MONO B 9SIL

  • Type: Class B
  • Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
  • Max Output Power x Channels @ Load: 22W x 1 @ 4 Ohm; 11W x 2 @ 2 Ohm
  • Voltage - Supply: 6 V ~ 17.5 V
  • Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
  • Mounting Type: Surface Mount
  • Operating Temperature: -25°C ~ 150°C (TJ)
  • Supplier Device Package: 9-SMS
  • Package / Case: SOT-354-1
Paquete: SOT-354-1
En existencias2.208
MPC8572ECVTAULD
NXP

IC MPU MPC85XX 1.333GHZ 1023BGA

  • Core Processor: PowerPC e500
  • Number of Cores/Bus Width: 2 Core, 32-Bit
  • Speed: 1.333GHz
  • Co-Processors/DSP: Signal Processing; SPE, Security; SEC
  • RAM Controllers: DDR2, DDR3
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (4)
  • SATA: -
  • USB: -
  • Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: Cryptography, Random Number Generator
  • Package / Case: 1023-BFBGA, FCBGA
  • Supplier Device Package: 1023-FCPBGA (33x33)
Paquete: 1023-BFBGA, FCBGA
En existencias4.496
hot MC7448HX1420LD
NXP

IC MPU MPC74XX 1.42GHZ 360FCCBGA

  • Core Processor: PowerPC G4
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 1.42GHz
  • Co-Processors/DSP: Multimedia; SIMD
  • RAM Controllers: -
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 1.5V, 1.8V, 2.5V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 360-BCBGA, FCCBGA
  • Supplier Device Package: 360-FCCBGA (25x25)
Paquete: 360-BCBGA, FCCBGA
En existencias7.020
KMPC8272VRTIEA
NXP

IC MPU MPC82XX 400MHZ 516BGA

  • Core Processor: PowerPC G2_LE
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 400MHz
  • Co-Processors/DSP: Communications; RISC CPM, Security; SEC
  • RAM Controllers: DRAM, SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100 Mbps (2)
  • SATA: -
  • USB: USB 2.0 (1)
  • Voltage - I/O: 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: Cryptography, Random Number Generator
  • Package / Case: 516-BBGA
  • Supplier Device Package: 516-FPBGA (27x27)
Paquete: 516-BBGA
En existencias5.952
KMPC8247CVRTIEA
NXP

IC MPU MPC82XX 400MHZ 516BGA

  • Core Processor: PowerPC G2_LE
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 400MHz
  • Co-Processors/DSP: Communications; RISC CPM
  • RAM Controllers: DRAM, SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100 Mbps (2)
  • SATA: -
  • USB: USB 2.0 (1)
  • Voltage - I/O: 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 516-BBGA
  • Supplier Device Package: 516-FPBGA (27x27)
Paquete: 516-BBGA
En existencias5.232
hot MC68340CAG16E
NXP

IC MPU M683XX 16MHZ 144LQFP

  • Core Processor: CPU32
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 16MHz
  • Co-Processors/DSP: -
  • RAM Controllers: DRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 5.0V
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Security Features: -
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-LQFP (20x20)
Paquete: 144-LQFP
En existencias3.344
LPC3180FEL320,551
NXP

IC MCU 32BIT ROMLESS 320LFBGA

  • Core Processor: ARM9?
  • Core Size: 16/32-Bit
  • Speed: 208MHz
  • Connectivity: EBI/EMI, I2C, Memory Card, SPI, UART/USART, USB OTG
  • Peripherals: DMA, PWM, WDT
  • Number of I/O: 55
  • Program Memory Size: -
  • Program Memory Type: ROMless
  • EEPROM Size: -
  • RAM Size: 64K x 8
  • Voltage - Supply (Vcc/Vdd): 1.1 V ~ 3.3 V
  • Data Converters: A/D 3x10b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 320-LFBGA
  • Supplier Device Package: 320-LFBGA (13x13)
Paquete: 320-LFBGA
En existencias6.992
MC9S08DV16CLF
NXP

IC MCU 8BIT 16KB FLASH 48LQFP

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 40MHz
  • Connectivity: CAN, I2C, LIN, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 39
  • Program Memory Size: 16KB (16K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 1K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 16x12b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 48-LQFP
  • Supplier Device Package: 48-LQFP (7x7)
Paquete: 48-LQFP
En existencias6.032
MC9S12DT256BMPV
NXP

IC MCU 16BIT 256KB FLASH 112LQFP

  • Core Processor: HCS12
  • Core Size: 16-Bit
  • Speed: 25MHz
  • Connectivity: CAN, I2C, SCI, SPI
  • Peripherals: PWM, WDT
  • Number of I/O: 91
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 8
  • RAM Size: 12K x 8
  • Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
  • Data Converters: A/D 16x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 112-LQFP
  • Supplier Device Package: 112-LQFP (20x20)
Paquete: 112-LQFP
En existencias7.424
MC9S08AC96MFGE
NXP

IC MCU 8BIT 96KB FLASH 44LQFP

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 40MHz
  • Connectivity: I2C, LIN, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 38
  • Program Memory Size: 96KB (96K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 6K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 16x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 44-LQFP
  • Supplier Device Package: 44-LQFP (10x10)
Paquete: 44-LQFP
En existencias5.024
hot S9S08DZ32F2MLH
NXP

IC MCU 8BIT 32KB FLASH 64LQFP

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 40MHz
  • Connectivity: CAN, I2C, LIN, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 53
  • Program Memory Size: 32KB (32K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 1K x 8
  • RAM Size: 2K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 24x12b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 64-LQFP
  • Supplier Device Package: 64-LQFP (10x10)
Paquete: 64-LQFP
En existencias28.800
hot MK70FX512VMJ12
NXP

IC MCU 32BIT 512KB FLASH 256BGA

  • Core Processor: ARM? Cortex?-M4
  • Core Size: 32-Bit
  • Speed: 120MHz
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
  • Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
  • Number of I/O: 128
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 16K x 8
  • RAM Size: 128K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
  • Data Converters: A/D 71x16b. D/A 2x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-MAPPBGA (17x17)
Paquete: 256-LBGA
En existencias8.880
LPC54608J512BD208E
NXP

IC MCU 32BIT 512KB FLASH 208LQFP

  • Core Processor: ARM? Cortex?-M4
  • Core Size: 32-Bit
  • Speed: 180MHz
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
  • Number of I/O: 171
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 200K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
  • Data Converters: A/D 12x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 208-LQFP
  • Supplier Device Package: 208-LQFP (28x28)
Paquete: 208-LQFP
En existencias16.260
MMA6271QT
NXP

ACCELEROMETER 2.5-10G ANAL 16QFN

  • Type: Analog
  • Axis: X, Y
  • Acceleration Range: ±2.5g, 3.3g, 6.7g, 10g
  • Sensitivity (LSB/g): -
  • Sensitivity (mV/g): 480 (±2.5g) ~ 120 (±10g)
  • Bandwidth: 350Hz
  • Output Type: Analog Voltage
  • Voltage - Supply: 2.2 V ~ 3.6 V
  • Features: Selectable Scale
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 16-LQFN Exposed Pad
  • Supplier Device Package: 16-QFN (6x6)
Paquete: 16-LQFN Exposed Pad
En existencias3.816
MC33FS6502CAER2
NXP

SYSTEM BASIS CHIP DCDC 0.8A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: -1.0 V ~ 40 V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP (7x7)
Paquete: 48-LQFP Exposed Pad
En existencias6.928
S912XEQ512BVAAR
NXP

16-BIT MCU S12X CORE 512KB FLA

  • Core Processor: HCS12X
  • Core Size: 16-Bit
  • Speed: 50MHz
  • Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 59
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 8
  • RAM Size: 32K x 8
  • Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
  • Data Converters: A/D 8x12b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 80-QFP
  • Supplier Device Package: 80-QFP (14x14)
Paquete: 80-QFP
En existencias6.640
MC33PF8200D2ES
NXP

IC POWER MANAGEMENT

  • Applications: High Performance i.MX 8, S32x Processor Based
  • Current - Supply: -
  • Voltage - Supply: 2.5V ~ 5.5V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN (8x8)
Paquete: 56-VFQFN Exposed Pad
En existencias6.240
S32K314NHT1VMMST
NXP

S32K314 ARM CORTEX-M7, 160 MHZ,

  • Core Processor: ARM® Cortex®-M7
  • Core Size: 32-Bit
  • Speed: 160MHz
  • Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
  • Peripherals: DMA, I2S, Serial Audio, WDT
  • Number of I/O: 218
  • Program Memory Size: 4MB (4M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
  • Data Converters: A/D 24x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C
  • Mounting Type: Surface Mount
  • Package / Case: 257-LFBGA
  • Supplier Device Package: 257-LFBGA (14x14)
Paquete: -
Request a Quote
FC32K144HRT0MLHT
NXP

S32K144 32-BIT MCU, ARM CORTEX-M

  • Core Processor: -
  • Core Size: -
  • Speed: -
  • Connectivity: -
  • Peripherals: -
  • Number of I/O: -
  • Program Memory Size: -
  • Program Memory Type: -
  • EEPROM Size: -
  • RAM Size: -
  • Voltage - Supply (Vcc/Vdd): -
  • Data Converters: -
  • Oscillator Type: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
Paquete: -
Request a Quote
LPC43S30FET100K
NXP

IC MCU 32BIT ROMLESS 100TFBGA

  • Core Processor: ARM® Cortex®-M4/M0
  • Core Size: 32-Bit Dual-Core
  • Speed: 204MHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
  • Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
  • Number of I/O: 49
  • Program Memory Size: -
  • Program Memory Type: ROMless
  • EEPROM Size: -
  • RAM Size: 264K x 8
  • Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
  • Data Converters: A/D 4x10b SAR; D/A 1x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 100-TFBGA
  • Supplier Device Package: 100-TFBGA (9x9)
Paquete: -
En existencias3.810
LPC5534JHI48-00E
NXP

IC MCU 32BIT 128KB FLASH 48HVQFN

  • Core Processor: ARM® Cortex®-M33
  • Core Size: 32-Bit Single-Core
  • Speed: 150MHz
  • Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
  • Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
  • Number of I/O: 32
  • Program Memory Size: 128KB (128K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 96K x 8
  • Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
  • Data Converters: A/D 10x16b
  • Oscillator Type: External, Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-HVQFN (7x7)
Paquete: -
En existencias1.545