NXP Productos

BUK7C1R8-60EJ

NXP

MOSFET N-CH 60V 200A D2PAK-7

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 60V
• Current - Continuous Drain (Id) @ 25°C: -
• Drive Voltage (Max Rds On, Min Rds On): -
• Vgs(th) (Max) @ Id: -
• Gate Charge (Qg) (Max) @ Vgs: -
• Input Capacitance (Ciss) (Max) @ Vds: -
• Vgs (Max): -
• FET Feature: -
• Power Dissipation (Max): -
• Rds On (Max) @ Id, Vgs: -
• Operating Temperature: -
• Mounting Type: Surface Mount
• Supplier Device Package: D2PAK (7-Lead)
• Package / Case: TO-263-7, D2Pak (6 Leads + Tab), TO-263CB

Paquete: TO-263-7, D2Pak (6 Leads + Tab), TO-263CB

PSMN3R7-25YLC,115

NXP

MOSFET N-CH 25V 97A LFPAK

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 25V
• Current - Continuous Drain (Id) @ 25°C: 97A (Tc)
• Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
• Vgs(th) (Max) @ Id: 1.95V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: 21.6nC @ 10V
• Input Capacitance (Ciss) (Max) @ Vds: 1585pF @ 12V
• Vgs (Max): ±20V
• FET Feature: -
• Power Dissipation (Max): 64W (Tc)
• Rds On (Max) @ Id, Vgs: 3.9 mOhm @ 20A, 10V
• Operating Temperature: -55°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Supplier Device Package: LFPAK56, Power-SO8
• Package / Case: SC-100, SOT-669

Paquete: SC-100, SOT-669

MC44BS373CAEF

NXP

AUDIO VIDEO INTERGRATION MOD

• Type: NTSC/PAL Modulator
• Applications: Audio/Video, VCR's, Set-Top Boxes
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 16-SOIC

Paquete: 16-SOIC (0.154", 3.90mm Width)

NX5P3201CUKZ

NXP

IC USB SWITCH HI SD 3A 30WLCSP

• Switch Type: USB Switch
• Number of Outputs: 2
• Ratio - Input:Output: 1:1
• Output Configuration: High Side
• Output Type: N-Channel
• Interface: Parallel
• Voltage - Load: 2.7 V ~ 5.5 V, 3.4 V ~ 5.5 V
• Voltage - Supply (Vcc/Vdd): Not Required
• Current - Output (Max): 3A, 6A
• Rds On (Typ): 8 mOhm, 32 mOhm
• Input Type: Non-Inverting
• Features: Slew Rate Controlled, Status Flag
• Fault Protection: Over Temperature, Over Voltage, Reverse Current, UVLO
• Operating Temperature: -40°C ~ 85°C (TA)
• Package / Case: 30-UFBGA, WLCSP
• Supplier Device Package: 30-WLCSP (2.26x2.56)

Paquete: 30-UFBGA, WLCSP

MC33931VWR2

NXP

IC MOTOR DRIVER PAR 44HSOP

• Motor Type - Stepper: -
• Motor Type - AC, DC: Brushed DC
• Function: Driver - Fully Integrated, Control and Power Stage
• Output Configuration: Half Bridge (2)
• Interface: Parallel
• Technology: CMOS
• Step Resolution: -
• Applications: Automotive
• Current - Output: 5A
• Voltage - Supply: 5 V ~ 28 V
• Voltage - Load: 5 V ~ 28 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad
• Supplier Device Package: 44-HSOP

Paquete: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad

GTL2008PW,118

NXP

IC TRANSLATOR GTL-LVTTL 28-TSSOP

• Translator Type: Mixed Signal
• Channel Type: Unidirectional
• Number of Circuits: 1
• Channels per Circuit: 12
• Voltage - VCCA: -
• Voltage - VCCB: -
• Input Signal: GTL, LVTTL
• Output Signal: LVTTL, GTL
• Output Type: Open Drain, Tri-State
• Data Rate: -
• Operating Temperature: -40°C ~ 85°C (TA)
• Features: -
• Mounting Type: Surface Mount
• Package / Case: 28-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 28-TSSOP

Paquete: 28-TSSOP (0.173", 4.40mm Width)

74HC7030D,653

NXP

IC FIFO REGISTER 9X64 28SOIC

• Memory Size: 576 (64 x 9)
• Function: Asynchronous, Synchronous
• Data Rate: 33MHz
• Access Time: 36ns
• Voltage - Supply: 2 V ~ 6 V
• Current - Supply (Max): -
• Bus Directional: Uni-Directional
• Expansion Type: Depth, Width
• Programmable Flags Support: No
• Retransmit Capability: No
• FWFT Support: No
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 28-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 28-SO

Paquete: 28-SOIC (0.295", 7.50mm Width)

TDA9881TS/V2,518

NXP

IC IF-PLL DEMOD 24-SSOP

• Type: Demodulator
• Applications: Set-Top Boxes
• Mounting Type: Surface Mount
• Package / Case: 24-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 24-SSOP

Paquete: 24-SSOP (0.209", 5.30mm Width)

PCA9501PW,112

NXP

IC I/O EXPANDER I2C 8B 20TSSOP

• Number of I/O: 8
• Interface: I2C, SMBus
• Interrupt Output: Yes
• Features: EEPROM, POR
• Output Type: Push-Pull
• Current - Output Source/Sink: 100µA, 25mA
• Clock Frequency: 400kHz
• Voltage - Supply: 2.5 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-TSSOP

Paquete: 20-TSSOP (0.173", 4.40mm Width)

PCA9535D,118

NXP

IC I/O EXPANDER I2C 16B 24SOIC

• Number of I/O: 16
• Interface: I2C, SMBus
• Interrupt Output: Yes
• Features: POR
• Output Type: Push-Pull
• Current - Output Source/Sink: 10mA, 25mA
• Clock Frequency: 400kHz
• Voltage - Supply: 2.3 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 24-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 24-SO

Paquete: 24-SOIC (0.295", 7.50mm Width)

TJA1041T/N1,118

NXP

IC TXRX CAN 14BIT 27V 14-SOIC

• Type: Transceiver
• Protocol: CAN
• Number of Drivers/Receivers: 1/1
• Duplex: Half
• Receiver Hysteresis: 70mV
• Data Rate: -
• Voltage - Supply: 4.75 V ~ 5.25 V
• Operating Temperature: -40°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 14-SO

Paquete: 14-SOIC (0.154", 3.90mm Width)

MPC8360ZUADDH

NXP

IC MPU MPC83XX 266MHZ 740TBGA

• Core Processor: PowerPC e300
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 266MHz
• Co-Processors/DSP: Communications; QUICC Engine
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (1)
• SATA: -
• USB: USB 1.x (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 740-LBGA
• Supplier Device Package: 740-TBGA (37.5x37.5)

Paquete: 740-LBGA

MPC8358VVAGDG

NXP

IC MPU MPC83XX 400MHZ 740TBGA

• Core Processor: PowerPC e300
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 400MHz
• Co-Processors/DSP: Communications; QUICC Engine
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (1)
• SATA: -
• USB: USB 1.x (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 740-LBGA
• Supplier Device Package: 740-TBGA (37.5x37.5)

Paquete: 740-LBGA

XPC850CVR50BU

NXP

IC MPU MPC8XX 50MHZ 256BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 50MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (1)
• SATA: -
• USB: USB 1.x (1)
• Voltage - I/O: 3.3V
• Operating Temperature: -40°C ~ 95°C (TA)
• Security Features: -
• Package / Case: 256-BBGA
• Supplier Device Package: 256-PBGA (23x23)

Paquete: 256-BBGA

MC9S08SH4CTGR

NXP

IC MCU 8BIT 4KB FLASH 16TSSOP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 13
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-TSSOP

Paquete: 16-TSSOP (0.173", 4.40mm Width)

MC56F8036VLF

NXP

IC MCU 16BIT 64KB FLASH 48LQFP

• Core Processor: 56800E
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: CAN, I2C, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number of I/O: 39
• Program Memory Size: 64KB (32K x 16)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 16
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 10x12b; D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

Paquete: 48-LQFP

LPC1114FHN33/302:5

NXP

IC MCU 32BIT 32KB FLASH 33HVQFN

• Core Processor: ARM? Cortex?-M0
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number of I/O: 28
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 32-VQFN Exposed Pad
• Supplier Device Package: 32-HVQFN (7x7)

Paquete: 32-VQFN Exposed Pad

MPL115A1T1

NXP

IC BAROMETER SPI DGTL MINI 8-LGA

• Pressure Type: Absolute
• Operating Pressure: 7.25 PSI ~ 16.68 PSI (50 kPa ~ 115 kPa)
• Output Type: SPI
• Output: 10 b
• Accuracy: ±0.145 PSI (±1 kPa)
• Voltage - Supply: 2.375 V ~ 5.5 V
• Port Size: -
• Port Style: No Port
• Features: Shutdown Mode, Standby Mode
• Termination Style: PCB
• Maximum Pressure: 145.04 PSI (1000 kPa)
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 8-TLGA
• Supplier Device Package: 8-LGA

Paquete: 8-TLGA

MMA2612NKWR2

NXP

ACCELEROMETER 125G PCM 16QFN

• Type: Digital
• Axis: X
• Acceleration Range: ±125g
• Sensitivity (LSB/g): 4.096
• Sensitivity (mV/g): -
• Bandwidth: -
• Output Type: PCM
• Voltage - Supply: 6.3 V ~ 30 V
• Features: Selectable Low Pass Filter
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 16-QFN Exposed Pad
• Supplier Device Package: 16-QFN-EP (6x6)

Paquete: 16-QFN Exposed Pad

MMA20312BVT1

NXP

IC AMP HBT INGAP/GAAS 12QFN

• Frequency: 1.8GHz ~ 2.2GHz
• P1dB: 28.2dBm
• Gain: 27.2dB
• Noise Figure: 3.3dB
• RF Type: LTE, PCS, TD-SCDMA, UMTS
• Voltage - Supply: 5V
• Current - Supply: 70mA
• Test Frequency: 2.14GHz
• Package / Case: 12-VFQFN Exposed Pad
• Supplier Device Package: 12-QFN (3x3)

Paquete: 12-VFQFN Exposed Pad

MWCT1013VLH

NXP

32BIT256K FLASHIFR PGM

• Applications: -
• Current - Supply: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

Paquete: -

SAF3560HV/V1101,55

NXP

DIGITAL RADIO PROCESSOR 144HLQFP

• Applications: Automotive
• Interface: I²C, SPI, UART
• Voltage - Supply: 1.2V, 3.3V
• Package / Case: 144-LQFP Exposed Pad
• Supplier Device Package: 144-HLQFP (20x20)
• Mounting Type: Surface Mount

Paquete: 144-LQFP Exposed Pad

SPC5606BK0MLL6

NXP

NXP 32-BIT MCU POWER ARCH CORE

• Core Processor: e200z0h
• Core Size: 32-Bit
• Speed: 64MHz
• Connectivity: CANbus, I²C, LINbus, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 77
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 80K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 7x10b, 5x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

Paquete: 100-LQFP

SPC5643LFK0MLQ1R

NXP

NXP 32-BIT MCU DUAL POWER ARCH

• Core Processor: e200z4
• Core Size: 32-Bit Dual-Core
• Speed: 120MHz
• Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: -
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 32x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

Paquete: 144-LQFP

S912XET256BCALR

NXP

16-BIT MCU S12X CORE 256KB FLA

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 91
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

Paquete: 112-LQFP

S9S08DN48F2MLH

NXP

8-BIT MCU S08 CORE 48KB FLASH

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, LINbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 53
• Program Memory Size: 48KB (48K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 1.5K x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

Paquete: 64-LQFP

MIMX8MM2CVTKZAA

NXP

IC MPU I.MX 8M MINI SOLO BGA

• Core Processor: ARM® Cortex®-A53
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.6GHz
• Co-Processors/DSP: ARM® Cortex®-M4
• RAM Controllers: DDR3L, DDR4, LPDDR4
• Graphics Acceleration: Yes
• Display & Interface Controllers: MIPI-DSI
• Ethernet: GbE
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: -
• Operating Temperature: -40°C ~ 105°C (TJ)
• Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
• Package / Case: 486-LFBGA, FCBGA
• Supplier Device Package: 486-FCBGA (14x14)

Paquete: 486-LFBGA, FCBGA

SAF7770EL-200Z10AY

NXP

SAF7770EL

• Type: -
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: 364-LFBGA
• Supplier Device Package: 364-LFBGA (15x15)

Paquete: -

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