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Intel Productos

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10AS048H1F34I1HG
Intel

IC SOC FPGA 492 I/O 1152FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 480K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
Paquete: 1152-BBGA, FCBGA
En existencias7.520
10AS048H4F34E3LG
Intel

1152-PIN FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 480K Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
Paquete: -
En existencias4.944
EP20K100EFI324-3
Intel

IC FPGA

  • Number of LABs/CLBs: 416
  • Number of Logic Elements/Cells: 4160
  • Total RAM Bits: 53248
  • Number of I/O: 246
  • Number of Gates: 263000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 324-BGA
  • Supplier Device Package: 324-FBGA (19x19)
Paquete: 324-BGA
En existencias5.648
EPF81500ARC304-2
Intel

IC FPGA 208 I/O 304RQFP

  • Number of LABs/CLBs: 162
  • Number of Logic Elements/Cells: 1296
  • Total RAM Bits: -
  • Number of I/O: 208
  • Number of Gates: 16000
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Package / Case: 304-BFQFP
  • Supplier Device Package: 304-RQFP (40x40)
Paquete: 304-BFQFP
En existencias4.912
5SGSED8N1F45C2L
Intel

IC FPGA 840 I/O 1932FBGA

  • Number of LABs/CLBs: 262400
  • Number of Logic Elements/Cells: 695000
  • Total RAM Bits: 60968960
  • Number of I/O: 840
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1932-BBGA, FCBGA
  • Supplier Device Package: 1932-FBGA, FC (45x45)
Paquete: 1932-BBGA, FCBGA
En existencias3.904
10AX115S2F45I1SG
Intel

IC FPGA 624 I/O 1932FCBGA

  • Number of LABs/CLBs: 427200
  • Number of Logic Elements/Cells: 1150000
  • Total RAM Bits: 68857856
  • Number of I/O: 624
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.98 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1932-BBGA, FCBGA
  • Supplier Device Package: 1932-FBGA, FC (45x45)
Paquete: 1932-BBGA, FCBGA
En existencias4.576
5SGSMD5K1F40C2L
Intel

IC FPGA 696 I/O 1517FBGA

  • Number of LABs/CLBs: 172600
  • Number of Logic Elements/Cells: 457000
  • Total RAM Bits: 46769152
  • Number of I/O: 696
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
Paquete: 1517-BBGA, FCBGA
En existencias4.128
5SEE9H40I4N
Intel

IC FPGA 696 I/O 1517HBGA

  • Number of LABs/CLBs: 317000
  • Number of Logic Elements/Cells: 840000
  • Total RAM Bits: 64210944
  • Number of I/O: 696
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-HBGA (45x45)
Paquete: 1517-BBGA, FCBGA
En existencias3.952
5SGXMA7N3F40C3N
Intel

IC FPGA 600 I/O 1517FBGA

  • Number of LABs/CLBs: 234720
  • Number of Logic Elements/Cells: 622000
  • Total RAM Bits: 59939840
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
Paquete: 1517-BBGA, FCBGA
En existencias7.040
5SGXEA3K3F35C4N
Intel

IC FPGA 432 I/O 1152FBGA

  • Number of LABs/CLBs: 128300
  • Number of Logic Elements/Cells: 340000
  • Total RAM Bits: 23704576
  • Number of I/O: 432
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
Paquete: 1152-BBGA, FCBGA
En existencias2.640
10AX032E1F29I1HG
Intel

IC FPGA 360 I/O 780FBGA

  • Number of LABs/CLBs: 119900
  • Number of Logic Elements/Cells: 320000
  • Total RAM Bits: 21040128
  • Number of I/O: 360
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.98 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 780-BBGA, FCBGA
  • Supplier Device Package: 780-FBGA (29x29)
Paquete: 780-BBGA, FCBGA
En existencias3.312
EP3SL70F780C4L
Intel

IC FPGA 488 I/O 780FBGA

  • Number of LABs/CLBs: 2700
  • Number of Logic Elements/Cells: 67500
  • Total RAM Bits: 2699264
  • Number of I/O: 488
  • Number of Gates: -
  • Voltage - Supply: 0.86 V ~ 1.15 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 780-BBGA, FCBGA
  • Supplier Device Package: 780-FBGA (29x29)
Paquete: 780-BBGA, FCBGA
En existencias3.264
EP3C10E144A7N
Intel

IC FPGA 94 I/O 144EQFP

  • Number of LABs/CLBs: 645
  • Number of Logic Elements/Cells: 10320
  • Total RAM Bits: 423936
  • Number of I/O: 94
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Package / Case: 144-LQFP Exposed Pad
  • Supplier Device Package: 144-EQFP (20x20)
Paquete: 144-LQFP Exposed Pad
En existencias2.096
hot EPM7128SLI84-10N
Intel

IC CPLD 128MC 10NS 84PLCC

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 10.0ns
  • Voltage Supply - Internal: 4.5 V ~ 5.5 V
  • Number of Logic Elements/Blocks: 8
  • Number of Macrocells: 128
  • Number of Gates: 2500
  • Number of I/O: 68
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 84-LCC (J-Lead)
  • Supplier Device Package: 84-PLCC (29.31x29.31)
Paquete: 84-LCC (J-Lead)
En existencias7.664
hot EPM7032BTI44-5
Intel

IC CPLD 32MC 5NS 44TQFP

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 5.0ns
  • Voltage Supply - Internal: 2.375 V ~ 2.625 V
  • Number of Logic Elements/Blocks: 2
  • Number of Macrocells: 32
  • Number of Gates: 600
  • Number of I/O: 36
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 44-TQFP
  • Supplier Device Package: 44-TQFP (10x10)
Paquete: 44-TQFP
En existencias34.560
hot EPM1270GF256C4
Intel

IC CPLD 980MC 6.2NS 256FBGA

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 6.2ns
  • Voltage Supply - Internal: 1.71 V ~ 1.89 V
  • Number of Logic Elements/Blocks: 1270
  • Number of Macrocells: 980
  • Number of Gates: -
  • Number of I/O: 212
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
Paquete: 256-BGA
En existencias4.560
hot EPM1270F256C5N
Intel

IC CPLD 980MC 6.2NS 256FBGA

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 6.2ns
  • Voltage Supply - Internal: 2.5V, 3.3V
  • Number of Logic Elements/Blocks: 1270
  • Number of Macrocells: 980
  • Number of Gates: -
  • Number of I/O: 212
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
Paquete: 256-BGA
En existencias7.056
EP4SGX530HH35I3G
Intel

IC FPGA 564 I/O 1152HBGA

  • Number of LABs/CLBs: -
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: -
  • Number of I/O: -
  • Number of Gates: -
  • Voltage - Supply: -
  • Mounting Type: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
Paquete: -
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AGFA022R31C2I3V
Intel

IC FPGA AGILEX-F 3184FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.2M Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
Paquete: -
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5SGXMA5N2F45C1WN
Intel

IC FPGA 840 I/O 1932FBGA

  • Number of LABs/CLBs: 185000
  • Number of Logic Elements/Cells: 490000
  • Total RAM Bits: 46080000
  • Number of I/O: 840
  • Number of Gates: -
  • Voltage - Supply: 0.87V ~ 0.93V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1932-BBGA, FCBGA
  • Supplier Device Package: 1932-FBGA, FC (45x45)
Paquete: -
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EP4S40G5H40I2NAB
Intel

IC FPGA 654 I/O 1517HBGA

  • Number of LABs/CLBs: 212480
  • Number of Logic Elements/Cells: 531200
  • Total RAM Bits: 28033024
  • Number of I/O: 654
  • Number of Gates: -
  • Voltage - Supply: 0.92V ~ 0.98V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-HBGA (42.5x42.5)
Paquete: -
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5SGXEA5K2F40I3LG
Intel

IC FPGA 696 I/O 1517FBGA

  • Number of LABs/CLBs: 185000
  • Number of Logic Elements/Cells: 490000
  • Total RAM Bits: 46080000
  • Number of I/O: 696
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
Paquete: -
Request a Quote
AGFB027R31C3E3E
Intel

IC FPGA AGILEX-F 3184FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.7M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
Paquete: -
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AGID023R18A1I2V
Intel

IC FPGA AGILEX-I 1805FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.3M Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1805-BBGA Exposed Pad
  • Supplier Device Package: 1805-BGA (42.5x42.5)
Paquete: -
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JM80547PG0961MM
Intel

IC MPU INTEL PENT 3.4GHZ 775LGA

  • Core Processor: Intel® Pentium® 4 Processor 551 supporting HT Technology
  • Number of Cores/Bus Width: 1 Core, 64-Bit
  • Speed: 3.4GHz
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 1.2V, 1.425V
  • Operating Temperature: 67.7°C (TC)
  • Security Features: -
  • Package / Case: 775-LGA
  • Supplier Device Package: 775-LGA (37.5x37.5)
Paquete: -
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5SGSMD5K3F40C2LG
Intel

IC FPGA 696 I/O 1517FBGA

  • Number of LABs/CLBs: 172600
  • Number of Logic Elements/Cells: 457000
  • Total RAM Bits: 39936000
  • Number of I/O: 696
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
Paquete: -
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AGFD023R24C2E1V
Intel

IC

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.3M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 2340-BFBGA Exposed Pad
  • Supplier Device Package: 2340-BGA (45x42)
Paquete: -
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AGFA019R31C2E3E
Intel

IC FPGA AGILEX-F 3184FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 1.9M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 3184-BFBGA Exposed Pad
  • Supplier Device Package: 3184-BGA (56x45)
Paquete: -
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