Epson Electronics America Inc-Semiconductor Div Productos

S1F77600Y0A000L

Epson Electronics America Inc-Semiconductor Div

IC BATTERY LEAK PREVENTION SOT89

• Function: -
• Battery Chemistry: -
• Number of Cells: -
• Fault Protection: -
• Interface: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: SOT-89-3

Paquete: -

S1D13A03B00B200

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 121PFBGA

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 121-BGA
• Supplier Device Package: -

Paquete: 121-BGA

S1D13748B00B100

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 121BGA

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 121-TFBGA
• Supplier Device Package: 121-PFBGA (10x10)

Paquete: 121-TFBGA

S1D13748F00A100

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 144QFP

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 144-QFP
• Supplier Device Package: 144-QFP20 (20x20)

Paquete: 144-QFP

S1D15712D01B000

Epson Electronics America Inc-Semiconductor Div

IC DRIVER LCD

• Type: Display Driver
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: Die
• Supplier Device Package: Chip

Paquete: Die

S1D13743F00A200

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 144QFP

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 144-LQFP
• Supplier Device Package: 144-QFP (20x20)

Paquete: 144-LQFP

S1D13746F01A600

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 128QFP

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 128-LQFP
• Supplier Device Package: 128-QFP15 (14x14)

Paquete: 128-LQFP

S1D13700F01A100

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 64TQFP

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 64-TQFP
• Supplier Device Package: -

Paquete: 64-TQFP

S1R720G0F00A000

Epson Electronics America Inc-Semiconductor Div

IC CONTROLLER USB 2.0 64-QFP

• Protocol: -
• Function: -
• Interface: -
• Standards: -
• Voltage - Supply: 3.3V
• Current - Supply: -
• Operating Temperature: -
• Package / Case: 64-QFP
• Supplier Device Package: -

Paquete: 64-QFP

S1R72U16F14E200

Epson Electronics America Inc-Semiconductor Div

IC CONTROLLER USB 80QFP

• Protocol: USB
• Function: Host Controller
• Interface: USB
• Standards: USB 2.0
• Voltage - Supply: 1.8V, 3.3V
• Current - Supply: 65mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 80-LQFP
• Supplier Device Package: 80-QFP (12x12)

Paquete: 80-LQFP

S1R72V17F00C200

Epson Electronics America Inc-Semiconductor Div

IC CONTROLLER USB 80QFP

• Protocol: USB
• Function: Host Controller
• Interface: USB
• Standards: USB 2.0
• Voltage - Supply: 1.8V, 3.3V
• Current - Supply: 39.3mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 80-LQFP
• Supplier Device Package: 80-QFP (12x12)

Paquete: 80-LQFP

S1C17704B103100

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 64KB FLASH 144VFBGA

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 8.2MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: LCD, PWM, WDT
• Number of I/O: 28
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 144-VFBGA
• Supplier Device Package: -

Paquete: 144-VFBGA

S1C17F57D402000

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 32KB FLASH DIE

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 4.2MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: PWM, WDT
• Number of I/O: 29
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: Die
• Supplier Device Package: -

Paquete: Die

S1C17W15F003100

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 64KB FLASH 64TQFP

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 4.2MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: LCD, POR, PWM, RFC, SNDA, WDT
• Number of I/O: 27
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 1.2 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-TQFP
• Supplier Device Package: 64-TQFP (10x10)

Paquete: 64-TQFP

S1C17W15D001000

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 64KB FLASH DIE

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 4.2MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: LCD, POR, PWM, RFC, SNDA, WDT
• Number of I/O: 35
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 1.2 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: Die
• Supplier Device Package: Die

Paquete: Die

S1C17M13F101100

Epson Electronics America Inc-Semiconductor Div

16-BIT SNGL CHIP MICROCONTROLLER

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 16.8MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
• Number of I/O: 38
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 8x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 48-TQFP
• Supplier Device Package: 48-TQFP (7x7)

Paquete: 48-TQFP

S1C17M12F101100

Epson Electronics America Inc-Semiconductor Div

16-BIT SNGL CHIP MICROCONTROLLER

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 16.8MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
• Number of I/O: 38
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 48-TQFP
• Supplier Device Package: 48-TQFP (7x7)

Paquete: 48-TQFP

S1C17W34F001100

Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ 128KB FLASH 12

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

Paquete: -

S1C17W16F102100-90

Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ 64KB FLASH 8KB

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

Paquete: -

S1C17W18F102100

Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ 128KB FLASH 8K

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

Paquete: -

S1C17W04F102100-490

Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ32KB FLASH 2KB

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

Paquete: -

S2D13P04B00B100-240

Epson Electronics America Inc-Semiconductor Div

CAMERA INTERFACE CHIP WITH 4 CHA

• Type: Graphic Controller
• Applications: LCD Display
• Mounting Type: Surface Mount
• Package / Case: 121-TFBGA
• Supplier Device Package: 121-PFBGA (10x10)

Paquete: 121-TFBGA

S1C17M20F001100

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 16KB FLASH 24SQFN4

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 21MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, Voltage Detect, WDT
• Number of I/O: -
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
• Data Converters: A/D 12b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 24-VFQFN Exposed Pad
• Supplier Device Package: 24-SQFN4 (4x4)

Paquete: -

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S1C17M24F001100

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 32KB FLASH 32TQFP15

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 21MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, Voltage Detect, WDT
• Number of I/O: 23
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
• Data Converters: A/D 6x12b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 32-TQFP
• Supplier Device Package: 32-TQFP15 (7x7)

Paquete: -

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S1C31D01F101000-119

Epson Electronics America Inc-Semiconductor Div

IC MCU 32BIT 256KB FLSH 80TQFP14

• Core Processor: ARM® Cortex®-M0+
• Core Size: 32-Bit
• Speed: 21MHz
• Connectivity: I2C, IrDA, QSPI, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, Temp Sensor, Voltage Detect, WDT
• Number of I/O: 57
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 96K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
• Data Converters: A/D 8x12b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 80-TQFP
• Supplier Device Package: 80-TQFP14 (12x12)

Paquete: -

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S1C17M20F001100-490

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 16KB FLASH 24SQFN4

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 21MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, Voltage Detect, WDT
• Number of I/O: -
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
• Data Converters: A/D 12b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 24-VFQFN Exposed Pad
• Supplier Device Package: 24-SQFN4 (4x4)

Paquete: -

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S1D13C00F00C100-160

Epson Electronics America Inc-Semiconductor Div

S1D13C00 MEMORY DISPLAY CONTROLL

• Type: Interface
• Applications: Video Display
• Mounting Type: Surface Mount
• Package / Case: 64-TQFP
• Supplier Device Package: 64-TQFP13 (10x10)

Paquete: -

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S1C17M30F001100-250

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 48KB FLASH 48TQFP12

• Core Processor: S1C17
• Core Size: 16-Bit
• Speed: 17.12MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LCD, POR, PWM, Voltage Detect, WDT
• Number of I/O: 37
• Program Memory Size: 48KB (48K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
• Data Converters: A/D 3x12b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 48-TQFP
• Supplier Device Package: 48-TQFP12 (7x7)

Paquete: -

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