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Aries Electronics Productos

Registros 5.390
Página  79/193
Imagen
Nº de pieza
Fabricantes
Descripción
Paquete
En existencias
Cantidad
28-516-10
Aries Electronics

CONN IC DIP SOCKET ZIF 28POS TIN

  • Type: DIP, ZIF (ZIP)
  • Number of Positions or Pins (Grid): 28 (2 x 14)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: 10µin (0.25µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 10µin (0.25µm)
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -
Paquete: -
En existencias8.982
32-3575-18
Aries Electronics

CONN IC DIP SOCKET ZIF 32POS

  • Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 32 (2 x 16)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Nickel Boron
  • Contact Finish Thickness - Mating: 50µin (1.27µm)
  • Contact Material - Mating: Beryllium Nickel
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Nickel Boron
  • Contact Finish Thickness - Post: 50µin (1.27µm)
  • Contact Material - Post: Beryllium Nickel
  • Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
  • Operating Temperature: -
Paquete: -
En existencias7.218
36-3575-16
Aries Electronics

CONN IC DIP SOCKET ZIF 36POS TIN

  • Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 36 (2 x 18)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: 200µin (5.08µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
  • Operating Temperature: -
Paquete: -
En existencias5.094
209-PGM17030-11
Aries Electronics

CONN SOCKET PGA GOLD

  • Type: PGA
  • Number of Positions or Pins (Grid): -
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10µin (0.25µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: -
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 10µin (0.25µm)
  • Contact Material - Post: Brass
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
Paquete: -
En existencias8.928
44-6571-11
Aries Electronics

CONN IC DIP SOCKET ZIF 44POS GLD

  • Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 44 (2 x 22)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10µin (0.25µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 10µin (0.25µm)
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
  • Operating Temperature: -
Paquete: -
En existencias2.772
100-PGM13069-11
Aries Electronics

CONN SOCKET PGA GOLD

  • Type: PGA
  • Number of Positions or Pins (Grid): -
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10µin (0.25µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: -
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 10µin (0.25µm)
  • Contact Material - Post: Brass
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
Paquete: -
En existencias5.202
32-9503-31
Aries Electronics

CONN IC DIP SOCKET 32POS GOLD

  • Type: DIP, 0.9" (22.86mm) Row Spacing
  • Number of Positions or Pins (Grid): 32 (2 x 16)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10µin (0.25µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Wire Wrap
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 10µin (0.25µm)
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
Paquete: -
En existencias6.894
48-3571-10
Aries Electronics

CONN IC DIP SOCKET ZIF 48POS TIN

  • Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 48 (2 x 24)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: 200µin (5.08µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
  • Operating Temperature: -
Paquete: -
En existencias6.498
30-6621-30
Aries Electronics

CONN IC DIP SOCKET 30POS TIN

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 30 (2 x 15)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: 200µin (5.08µm)
  • Contact Material - Mating: Phosphor Bronze
  • Mounting Type: Through Hole, Bottom Entry; Through Board
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -55°C ~ 105°C
Paquete: -
En existencias5.490
32-3551-11
Aries Electronics

CONN IC DIP SOCKET ZIF 32POS GLD

  • Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 32 (2 x 16)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
  • Operating Temperature: -
Paquete: -
En existencias3.438
25-0508-21
Aries Electronics

CONN SOCKET SIP 25POS GOLD

  • Type: SIP
  • Number of Positions or Pins (Grid): 25 (1 x 25)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10µin (0.25µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: -
  • Termination: Wire Wrap
  • Pitch - Post: -
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 10µin (0.25µm)
  • Contact Material - Post: Brass
  • Housing Material: Polyamide (PA46), Nylon 4/6
  • Operating Temperature: -55°C ~ 125°C
Paquete: -
En existencias3.798
32-822-90C
Aries Electronics

CONN IC DIP SOCKET 32POS GOLD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 32 (2 x 16)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 30µin (0.76µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole, Right Angle, Horizontal
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Brass
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -55°C ~ 105°C
Paquete: -
En existencias3.906
64-9518-10H
Aries Electronics

CONN IC DIP SOCKET 64POS GOLD

  • Type: DIP, 0.9" (22.86mm) Row Spacing
  • Number of Positions or Pins (Grid): 64 (2 x 32)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10µin (0.25µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Brass
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -
Paquete: -
En existencias3.472
32-6513-11H
Aries Electronics

CONN IC DIP SOCKET 32POS GOLD

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 32 (2 x 16)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10µin (0.25µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 10µin (0.25µm)
  • Contact Material - Post: Brass
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -
Paquete: -
En existencias3.598
13-0501-20
Aries Electronics

CONN SOCKET SIP 13POS TIN

  • Type: SIP
  • Number of Positions or Pins (Grid): 13 (1 x 13)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: 200µin (5.08µm)
  • Contact Material - Mating: Phosphor Bronze
  • Mounting Type: Through Hole
  • Features: -
  • Termination: Wire Wrap
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -55°C ~ 105°C
Paquete: -
En existencias7.722
10-6810-90TWR
Aries Electronics

CONN IC DIP SOCKET 10POS TIN

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 10 (2 x 5)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: 200µin (5.08µm)
  • Contact Material - Mating: Phosphor Bronze
  • Mounting Type: Through Hole, Right Angle, Vertical
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: Polyamide (PA46), Nylon 4/6
  • Operating Temperature: -
Paquete: -
En existencias5.562
20-6503-20
Aries Electronics

CONN IC DIP SOCKET 20POS GOLD

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 20 (2 x 10)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10µin (0.25µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Wire Wrap
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -55°C ~ 105°C
Paquete: -
En existencias2.394
09-0503-21
Aries Electronics

CONN SOCKET SIP 9POS GOLD

  • Type: SIP
  • Number of Positions or Pins (Grid): 9 (1 x 9)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 30µin (0.76µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: -
  • Termination: Wire Wrap
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 10µin (0.25µm)
  • Contact Material - Post: Brass
  • Housing Material: Polyamide (PA), Nylon, Glass Filled
  • Operating Temperature: -
Paquete: -
En existencias4.878
24-3518-111
Aries Electronics

CONN IC DIP SOCKET 24POS GOLD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 24 (2 x 12)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10µin (0.25µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 10µin (0.25µm)
  • Contact Material - Post: Brass
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -
Paquete: -
En existencias7.722
28-1518-10H
Aries Electronics

CONN IC DIP SOCKET 28POS GOLD

  • Type: DIP, 0.2" (5.08mm) Row Spacing
  • Number of Positions or Pins (Grid): 28 (2 x 14)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10µin (0.25µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Brass
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -
Paquete: -
En existencias7.686
03-0508-21
Aries Electronics

CONN SOCKET SIP 3POS GOLD

  • Type: SIP
  • Number of Positions or Pins (Grid): 3 (1 x 3)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10µin (0.25µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: -
  • Termination: Wire Wrap
  • Pitch - Post: -
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 10µin (0.25µm)
  • Contact Material - Post: Brass
  • Housing Material: Polyamide (PA46), Nylon 4/6
  • Operating Temperature: -55°C ~ 125°C
Paquete: -
En existencias4.788
1111841-8
Aries Electronics

SOCKET ADAPTER MSOP TO 8DIP 0.3

  • Convert From (Adapter End): MSOP
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 8
  • Pitch - Mating: 0.020" (0.50mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
Paquete: -
En existencias3.924
22-4625-51
Aries Electronics

625 DIP HDR SCRW MACH CONTACT

  • Connector Type: DIP, DIL - Header
  • Contact Type: Forked
  • Number of Positions: 22
  • Pitch: 0.100" (2.54mm)
  • Number of Rows: 2
  • Row Spacing: 0.400" (10.16mm)
  • Mounting Type: Through Hole
  • Termination: Wire Wrap
  • Features: -
  • Contact Finish: Gold
  • Contact Finish Thickness: 10µin (0.25µm)
  • Color: Black
Paquete: -
En existencias6.894
12-6625-51
Aries Electronics

625 DIP HDR SCRW MACH CONTACT

  • Connector Type: DIP, DIL - Header
  • Contact Type: Forked
  • Number of Positions: 12
  • Pitch: 0.100" (2.54mm)
  • Number of Rows: 2
  • Row Spacing: 0.600" (15.24mm)
  • Mounting Type: Through Hole
  • Termination: Wire Wrap
  • Features: -
  • Contact Finish: Gold
  • Contact Finish Thickness: 10µin (0.25µm)
  • Color: Black
Paquete: -
En existencias6.804
22-3625-71
Aries Electronics

625 DIP HDR SCRW MACH CONTACT

  • Connector Type: DIP, DIL - Header
  • Contact Type: Post
  • Number of Positions: 22
  • Pitch: 0.100" (2.54mm)
  • Number of Rows: 2
  • Row Spacing: 0.300" (7.62mm)
  • Mounting Type: Through Hole
  • Termination: Solder
  • Features: -
  • Contact Finish: Gold
  • Contact Finish Thickness: 10µin (0.25µm)
  • Color: Black
Paquete: -
En existencias6.894
28-3625-10
Aries Electronics

625 DIP HDR SCRW MACH CONTACT

  • Connector Type: DIP, DIL - Header
  • Contact Type: Forked
  • Number of Positions: 28
  • Pitch: 0.100" (2.54mm)
  • Number of Rows: 2
  • Row Spacing: 0.300" (7.62mm)
  • Mounting Type: Through Hole
  • Termination: Solder
  • Features: -
  • Contact Finish: Tin
  • Contact Finish Thickness: 200µin (5.08µm)
  • Color: Black
Paquete: -
En existencias6.210
21-0600-20
Aries Electronics

0600 STRIP-LINE HDR COINED CNTCT

  • Connector Type: DIP, DIL - Header
  • Contact Type: Post
  • Number of Positions: 21
  • Pitch: 0.100" (2.54mm)
  • Number of Rows: 1
  • Row Spacing: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Features: -
  • Contact Finish: Tin
  • Contact Finish Thickness: 200µin (5.08µm)
  • Color: Black
Paquete: -
En existencias8.622
04-3625-21
Aries Electronics

625 DIP HDR SCRW MACH CONTACT

  • Connector Type: DIP, DIL - Header
  • Contact Type: Post
  • Number of Positions: 4
  • Pitch: 0.100" (2.54mm)
  • Number of Rows: 2
  • Row Spacing: 0.300" (7.62mm)
  • Mounting Type: Through Hole
  • Termination: Solder
  • Features: -
  • Contact Finish: Gold
  • Contact Finish Thickness: 10µin (0.25µm)
  • Color: Black
Paquete: -
En existencias2.754