Xilinx Inc. Productos

XCMECH-FFG1153

Xilinx Inc.

FFG1153 MECHANICAL SAMPLE

• Type: Mechanical Sample
• Applications: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

Paquete: -

XC17V04PC44C

Xilinx Inc.

IC PROM SER 4MBIT 3.3V 44-PLCC

• Programmable Type: OTP
• Memory Size: 4Mb
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 44-LCC (J-Lead)
• Supplier Device Package: 44-PLCC (16.59x16.59)

Paquete: 44-LCC (J-Lead)

XC17256ELPD8C

Xilinx Inc.

IC 3V SER CFG PROM 256K 8-DIP

• Programmable Type: OTP
• Memory Size: 256Kb
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 8-DIP (0.300", 7.62mm)
• Supplier Device Package: 8-PDIP

Paquete: 8-DIP (0.300", 7.62mm)

XCZU11EG-3FFVC1156E

Xilinx Inc.

IC FPGA 360 I/O 1156FCBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.5GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 653K+ Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1156-FCBGA (35x35)

Paquete: 1156-BBGA, FCBGA

XCZU9EG-2FFVC900E

Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.5GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 599K+ Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 900-BBGA, FCBGA
• Supplier Device Package: 900-FCBGA (31x31)

Paquete: 900-BBGA, FCBGA

XCV200E-8CS144C

Xilinx Inc.

IC FPGA 94 I/O 144CSBGA

• Number of LABs/CLBs: 1176
• Number of Logic Elements/Cells: 5292
• Total RAM Bits: 114688
• Number of I/O: 94
• Number of Gates: 306393
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 144-TFBGA, CSPBGA
• Supplier Device Package: 144-LCSBGA (12x12)

Paquete: 144-TFBGA, CSPBGA

XCS30-3PQ240C

Xilinx Inc.

IC FPGA 192 I/O 240QFP

• Number of LABs/CLBs: 576
• Number of Logic Elements/Cells: 1368
• Total RAM Bits: 18432
• Number of I/O: 192
• Number of Gates: 30000
• Voltage - Supply: 4.75 V ~ 5.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 240-BFQFP
• Supplier Device Package: 240-PQFP (32x32)

Paquete: 240-BFQFP

XCVU125-2FLVD1517E

Xilinx Inc.

IC FPGA 338 I/O 1517FCBGA

• Number of LABs/CLBs: 89520
• Number of Logic Elements/Cells: 1566600
• Total RAM Bits: 90726400
• Number of I/O: 338
• Number of Gates: -
• Voltage - Supply: 0.922 V ~ 0.979 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FCBGA (40x40)

Paquete: 1517-BBGA, FCBGA

XC6VLX365T-L1FF1156C

Xilinx Inc.

IC FPGA 600 I/O 1156FCBGA

• Number of LABs/CLBs: 28440
• Number of Logic Elements/Cells: 364032
• Total RAM Bits: 15335424
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1156-FCBGA (35x35)

Paquete: 1156-BBGA, FCBGA

XC6VLX240T-2FF1759I

Xilinx Inc.

IC FPGA 720 I/O 1759FCBGA

• Number of LABs/CLBs: 18840
• Number of Logic Elements/Cells: 241152
• Total RAM Bits: 15335424
• Number of I/O: 720
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1759-FCBGA (42.5x42.5)

Paquete: 1760-BBGA, FCBGA

XC5VLX110-3FF1153C

Xilinx Inc.

IC FPGA 800 I/O 1153FCBGA

• Number of LABs/CLBs: 8640
• Number of Logic Elements/Cells: 110592
• Total RAM Bits: 4718592
• Number of I/O: 800
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1153-BBGA, FCBGA
• Supplier Device Package: 1153-FCBGA (35x35)

Paquete: 1153-BBGA, FCBGA

XC6VLX240T-1FFG1759C

Xilinx Inc.

IC FPGA 720 I/O 1759FCBGA

• Number of LABs/CLBs: 18840
• Number of Logic Elements/Cells: 241152
• Total RAM Bits: 15335424
• Number of I/O: 720
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1759-FCBGA (42.5x42.5)

Paquete: 1760-BBGA, FCBGA

XCKU5P-1SFVB784E

Xilinx Inc.

XCKU5P-1SFVB784E

• Number of LABs/CLBs: 27120
• Number of Logic Elements/Cells: 474600
• Total RAM Bits: 35737600
• Number of I/O: 304
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: -
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

Paquete: -

XC2VP40-6FG676C

Xilinx Inc.

IC FPGA 416 I/O 676FBGA

• Number of LABs/CLBs: 4848
• Number of Logic Elements/Cells: 43632
• Total RAM Bits: 3538944
• Number of I/O: 416
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

Paquete: 676-BBGA, FCBGA

XC5VLX20T-2FF323I

Xilinx Inc.

IC FPGA 172 I/O 323FCBGA

• Number of LABs/CLBs: 1560
• Number of Logic Elements/Cells: 19968
• Total RAM Bits: 958464
• Number of I/O: 172
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 323-BBGA, FCBGA
• Supplier Device Package: 323-FCBGA (19x19)

Paquete: 323-BBGA, FCBGA

XC5VLX20T-1FFG323I

Xilinx Inc.

IC FPGA 172 I/O 323FCBGA

• Number of LABs/CLBs: 1560
• Number of Logic Elements/Cells: 19968
• Total RAM Bits: 958464
• Number of I/O: 172
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 323-BBGA, FCBGA
• Supplier Device Package: 323-FCBGA (19x19)

Paquete: 323-BBGA, FCBGA

XC6SLX150-L1FG900C

Xilinx Inc.

IC FPGA 576 I/O 900FBGA

• Number of LABs/CLBs: 11519
• Number of Logic Elements/Cells: 147443
• Total RAM Bits: 4939776
• Number of I/O: 576
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 900-BBGA
• Supplier Device Package: 900-FBGA (31x31)

Paquete: 900-BBGA

XC6SLX100-2FG676C

Xilinx Inc.

IC FPGA 480 I/O 676FCBGA

• Number of LABs/CLBs: 7911
• Number of Logic Elements/Cells: 101261
• Total RAM Bits: 4939776
• Number of I/O: 480
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

Paquete: 676-BBGA, FCBGA

XA3S700A-4FGG400Q

Xilinx Inc.

IC FPGA 311 I/O 400FBGA

• Number of LABs/CLBs: 1472
• Number of Logic Elements/Cells: 13248
• Total RAM Bits: 368640
• Number of I/O: 311
• Number of Gates: 700000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 125°C (TJ)
• Package / Case: 400-BGA
• Supplier Device Package: 400-FBGA (21x21)

Paquete: 400-BGA

XC3S1200E-4FGG320I

Xilinx Inc.

IC FPGA 250 I/O 320FBGA

• Number of LABs/CLBs: 2168
• Number of Logic Elements/Cells: 19512
• Total RAM Bits: 516096
• Number of I/O: 250
• Number of Gates: 1200000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 320-BGA
• Supplier Device Package: 320-FBGA (19x19)

Paquete: 320-BGA

XC6SLX16-L1CSG324C

Xilinx Inc.

IC FPGA 232 I/O 324CSBGA

• Number of LABs/CLBs: 1139
• Number of Logic Elements/Cells: 14579
• Total RAM Bits: 589824
• Number of I/O: 232
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 324-LFBGA, CSPBGA
• Supplier Device Package: 324-CSPBGA (15x15)

Paquete: 324-LFBGA, CSPBGA

XC95216-15PQ160I

Xilinx Inc.

IC CPLD 216MC 15NS 160QFP

• Programmable Type: In System Programmable (min 10K program/erase cycles)
• Delay Time tpd(1) Max: 15.0ns
• Voltage Supply - Internal: 4.5 V ~ 5.5 V
• Number of Logic Elements/Blocks: 12
• Number of Macrocells: 216
• Number of Gates: 4800
• Number of I/O: 133
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 160-BQFP
• Supplier Device Package: 160-PQFP (28x28)

Paquete: 160-BQFP

XC95144-15PQ100C

Xilinx Inc.

IC CPLD 144MC 15NS 100QFP

• Programmable Type: In System Programmable (min 10K program/erase cycles)
• Delay Time tpd(1) Max: 15.0ns
• Voltage Supply - Internal: 4.75 V ~ 5.25 V
• Number of Logic Elements/Blocks: 8
• Number of Macrocells: 144
• Number of Gates: 3200
• Number of I/O: 81
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-BQFP
• Supplier Device Package: 100-PQFP (14x20)

Paquete: 100-BQFP

XC2C512-7PQ208C

Xilinx Inc.

IC CPLD 512MC 7.1NS 208QFP

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 7.1ns
• Voltage Supply - Internal: 1.7 V ~ 1.9 V
• Number of Logic Elements/Blocks: 32
• Number of Macrocells: 512
• Number of Gates: 12000
• Number of I/O: 173
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 208-BFQFP
• Supplier Device Package: 208-PQFP (28x28)

Paquete: 208-BFQFP

XC2C384-10PQ208C

Xilinx Inc.

IC CPLD 384MC 9.2NS 208QFP

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 9.2ns
• Voltage Supply - Internal: 1.7 V ~ 1.9 V
• Number of Logic Elements/Blocks: 24
• Number of Macrocells: 384
• Number of Gates: 9000
• Number of I/O: 173
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 208-BFQFP
• Supplier Device Package: 208-PQFP (28x28)

Paquete: 208-BFQFP

XC2C512-7FTG256C

Xilinx Inc.

IC CPLD 512MC 7.1NS 256BGA

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 7.1ns
• Voltage Supply - Internal: 1.7 V ~ 1.9 V
• Number of Logic Elements/Blocks: 32
• Number of Macrocells: 512
• Number of Gates: 12000
• Number of I/O: 212
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 256-LBGA
• Supplier Device Package: 256-FTBGA (17x17)

Paquete: 256-LBGA

XC7S75-1FGGA484I

Xilinx Inc.

XC7S75-1FGGA484I

• Number of LABs/CLBs: 6000
• Number of Logic Elements/Cells: 76800
• Total RAM Bits: 4331520
• Number of I/O: 338
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-BBGA, FCBGA
• Supplier Device Package: 484-FCBGA (23x23)

Paquete: 484-BBGA, FCBGA

XC7S25-2CSGA225C

Xilinx Inc.

XC7S25-2CSGA225C

• Number of LABs/CLBs: 1825
• Number of Logic Elements/Cells: 23360
• Total RAM Bits: 1658880
• Number of I/O: 150
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 225-LFBGA, CSPBGA
• Supplier Device Package: 225-CSGA (13x13)

Paquete: 225-LFBGA, CSPBGA