Xilinx Inc. Productos

XCMECH-FFG676

Xilinx Inc.

FFG676 MECHANICAL SAMPLE

• Type: Mechanical Sample
• Applications: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

Paquete: -

XC18V01VQ44I

Xilinx Inc.

IC PROM SER I-TEMP 3.3V 44-VQFP

• Programmable Type: In System Programmable
• Memory Size: 1Mb
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 44-TQFP
• Supplier Device Package: 44-VQFP (10x10)

Paquete: 44-TQFP

XCZU4EG-1SFVC784I

Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.5GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 192K+ Logic Cells
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 784-BBGA, FCBGA
• Supplier Device Package: 784-FCBGA (23x23)

Paquete: 784-BBGA, FCBGA

XC6SLX45-N3FG484I

Xilinx Inc.

IC FPGA 316 I/O 484FBGA

• Number of LABs/CLBs: 3411
• Number of Logic Elements/Cells: 43661
• Total RAM Bits: 2138112
• Number of I/O: 316
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-BBGA
• Supplier Device Package: 484-FBGA (23x23)

Paquete: 484-BBGA

XC2V500-4FG256I

Xilinx Inc.

IC FPGA 172 I/O 256FBGA

• Number of LABs/CLBs: 768
• Number of Logic Elements/Cells: -
• Total RAM Bits: 589824
• Number of I/O: 172
• Number of Gates: 500000
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 256-BGA
• Supplier Device Package: 256-FBGA (17x17)

Paquete: 256-BGA

XC2V3000-5FG676I

Xilinx Inc.

IC FPGA 484 I/O 676FBGA

• Number of LABs/CLBs: 3584
• Number of Logic Elements/Cells: -
• Total RAM Bits: 1769472
• Number of I/O: 484
• Number of Gates: 3000000
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

Paquete: 676-BBGA, FCBGA

XA2S100E-6TQ144Q

Xilinx Inc.

IC FPGA 102 I/O 144TQFP

• Number of LABs/CLBs: 600
• Number of Logic Elements/Cells: 2700
• Total RAM Bits: 40960
• Number of I/O: 102
• Number of Gates: 100000
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 125°C (TJ)
• Package / Case: 144-LQFP
• Supplier Device Package: 144-TQFP (20x20)

Paquete: 144-LQFP

XC2V1500-5FGG676C

Xilinx Inc.

IC FPGA 392 I/O 676FBGA

• Number of LABs/CLBs: 1920
• Number of Logic Elements/Cells: -
• Total RAM Bits: 884736
• Number of I/O: 392
• Number of Gates: 1500000
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 676-BGA
• Supplier Device Package: 676-FBGA (27x27)

Paquete: 676-BGA

XCV405E-7FG676C

Xilinx Inc.

IC FPGA 404 I/O 676FBGA

• Number of LABs/CLBs: 2400
• Number of Logic Elements/Cells: 10800
• Total RAM Bits: 573440
• Number of I/O: 404
• Number of Gates: 129600
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

Paquete: 676-BBGA, FCBGA

XCV300E-6BG352I

Xilinx Inc.

IC FPGA 260 I/O 352MBGA

• Number of LABs/CLBs: 1536
• Number of Logic Elements/Cells: 6912
• Total RAM Bits: 131072
• Number of I/O: 260
• Number of Gates: 411955
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 352-LBGA, Metal
• Supplier Device Package: 352-MBGA (35x35)

Paquete: 352-LBGA, Metal

XCV200E-7BG352I

Xilinx Inc.

IC FPGA 260 I/O 352MBGA

• Number of LABs/CLBs: 1176
• Number of Logic Elements/Cells: 5292
• Total RAM Bits: 114688
• Number of I/O: 260
• Number of Gates: 306393
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 352-LBGA, Metal
• Supplier Device Package: 352-MBGA (35x35)

Paquete: 352-LBGA, Metal

XC4020XL-2HT144C

Xilinx Inc.

IC FPGA 113 I/O 144HQFP

• Number of LABs/CLBs: 784
• Number of Logic Elements/Cells: 1862
• Total RAM Bits: 25088
• Number of I/O: 113
• Number of Gates: 20000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 144-LQFP Exposed Pad
• Supplier Device Package: 144-TQFP (20x20)

Paquete: 144-LQFP Exposed Pad

XC4010XL-3PQ208I

Xilinx Inc.

IC FPGA 160 I/O 208QFP

• Number of LABs/CLBs: 400
• Number of Logic Elements/Cells: 950
• Total RAM Bits: 12800
• Number of I/O: 160
• Number of Gates: 10000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 208-BFQFP
• Supplier Device Package: 208-PQFP (28x28)

Paquete: 208-BFQFP

XC4005XL-3TQ144I

Xilinx Inc.

IC FPGA 112 I/O 144TQFP

• Number of LABs/CLBs: 196
• Number of Logic Elements/Cells: 466
• Total RAM Bits: 6272
• Number of I/O: 112
• Number of Gates: 5000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 144-LQFP
• Supplier Device Package: 144-TQFP (20x20)

Paquete: 144-LQFP

XCKU115-1FLVB2104I

Xilinx Inc.

IC FPGA 702 I/O 2104FCBGA

• Number of LABs/CLBs: 82920
• Number of Logic Elements/Cells: 1451100
• Total RAM Bits: 77721600
• Number of I/O: 702
• Number of Gates: -
• Voltage - Supply: 0.922 V ~ 0.979 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 2104-BBGA, FCBGA
• Supplier Device Package: 2104-FCBGA (47.5x47.5)

Paquete: 2104-BBGA, FCBGA

XCKU060-2FFVA1156I

Xilinx Inc.

IC FPGA 520 I/O 1156FCBGA

• Number of LABs/CLBs: 41460
• Number of Logic Elements/Cells: 725550
• Total RAM Bits: 38912000
• Number of I/O: 520
• Number of Gates: -
• Voltage - Supply: 0.922 V ~ 0.979 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1156-FCBGA (35x35)

Paquete: 1156-BBGA, FCBGA

XC5VSX50T-3FFG1136C

Xilinx Inc.

IC FPGA 480 I/O 1136FCBGA

• Number of LABs/CLBs: 4080
• Number of Logic Elements/Cells: 52224
• Total RAM Bits: 4866048
• Number of I/O: 480
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1136-BBGA, FCBGA
• Supplier Device Package: 1136-FCBGA (35x35)

Paquete: 1136-BBGA, FCBGA

XC7K325T-1FBG676I

Xilinx Inc.

IC FPGA 400 I/O 676FCBGA

• Number of LABs/CLBs: 25475
• Number of Logic Elements/Cells: 326080
• Total RAM Bits: 16404480
• Number of I/O: 400
• Number of Gates: -
• Voltage - Supply: 0.97 V ~ 1.03 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

Paquete: 676-BBGA, FCBGA

XA3S700A-4FGG484I

Xilinx Inc.

IC FPGA 372 I/O 484FBGA

• Number of LABs/CLBs: 1472
• Number of Logic Elements/Cells: 13248
• Total RAM Bits: 368640
• Number of I/O: 372
• Number of Gates: 700000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-BBGA
• Supplier Device Package: 484-FBGA (23x23)

Paquete: 484-BBGA

XC2S200-5FGG456I

Xilinx Inc.

IC FPGA 284 I/O 456FBGA

• Number of LABs/CLBs: 1176
• Number of Logic Elements/Cells: 5292
• Total RAM Bits: 57344
• Number of I/O: 284
• Number of Gates: 200000
• Voltage - Supply: 2.375 V ~ 2.625 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 456-BBGA
• Supplier Device Package: 456-FBGA (23x23)

Paquete: 456-BBGA

XC6SLX25-N3FG484I

Xilinx Inc.

IC FPGA 266 I/O 484FBGA

• Number of LABs/CLBs: 1879
• Number of Logic Elements/Cells: 24051
• Total RAM Bits: 958464
• Number of I/O: 266
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-BBGA
• Supplier Device Package: 484-FBGA (23x23)

Paquete: 484-BBGA

XC9572-10PC44I

Xilinx Inc.

IC CPLD 72MC 10NS 44PLCC

• Programmable Type: In System Programmable (min 10K program/erase cycles)
• Delay Time tpd(1) Max: 10.0ns
• Voltage Supply - Internal: 4.5 V ~ 5.5 V
• Number of Logic Elements/Blocks: 4
• Number of Macrocells: 72
• Number of Gates: 1600
• Number of I/O: 34
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 44-LCC (J-Lead)
• Supplier Device Package: 44-PLCC (16.59x16.59)

Paquete: 44-LCC (J-Lead)

XCR3384XL-12PQG208I

Xilinx Inc.

IC CPLD 384MC 10.8NS 208QFP

• Programmable Type: In System Programmable (min 1K program/erase cycles)
• Delay Time tpd(1) Max: 10.8ns
• Voltage Supply - Internal: 2.7 V ~ 3.6 V
• Number of Logic Elements/Blocks: 24
• Number of Macrocells: 384
• Number of Gates: 9000
• Number of I/O: 172
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 208-BFQFP
• Supplier Device Package: 208-PQFP (28x28)

Paquete: 208-BFQFP

XC2C256-6FTG256C

Xilinx Inc.

IC CPLD 256MC 5.7NS 256FTBGA

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 5.7ns
• Voltage Supply - Internal: 1.7 V ~ 1.9 V
• Number of Logic Elements/Blocks: 16
• Number of Macrocells: 256
• Number of Gates: 6000
• Number of I/O: 184
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 256-LBGA
• Supplier Device Package: 256-FTBGA (17x17)

Paquete: 256-LBGA

XC2C64A-7VQ44C

Xilinx Inc.

IC CPLD 64MC 6.7NS 44VQFP

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 6.7ns
• Voltage Supply - Internal: 1.7 V ~ 1.9 V
• Number of Logic Elements/Blocks: 4
• Number of Macrocells: 64
• Number of Gates: 1500
• Number of I/O: 33
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 44-TQFP
• Supplier Device Package: 44-VQFP (10x10)

Paquete: 44-TQFP

XC7S15-2CPGA196I

Xilinx Inc.

XC7S15-2CPGA196I

• Number of LABs/CLBs: 1000
• Number of Logic Elements/Cells: 12800
• Total RAM Bits: 368640
• Number of I/O: 100
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 196-TFBGA, CSBGA
• Supplier Device Package: 196-CSPBGA (8x8)

Paquete: 196-TFBGA, CSBGA

XCVU095-H1FFVD1517E

Xilinx Inc.

IC FPGA VIRTEX-U 1517FCBGA

• Number of LABs/CLBs: 67200
• Number of Logic Elements/Cells: 1176000
• Total RAM Bits: 62259200
• Number of I/O: 338
• Number of Gates: -
• Voltage - Supply: 0.922 V ~ 1.030 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FCBGA (40x40)

Paquete: 1517-BBGA, FCBGA

XCKU3P-L2FFVD900E

Xilinx Inc.

XCKU3P-L2FFVD900E

• Number of LABs/CLBs: 20340
• Number of Logic Elements/Cells: 355950
• Total RAM Bits: 31641600
• Number of I/O: 304
• Number of Gates: -
• Voltage - Supply: 0.698 V ~ 0.876 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 900-BBGA, FCBGA
• Supplier Device Package: 900-FCBGA (31x31)

Paquete: 900-BBGA, FCBGA