Página 314 - TE Connectivity Passive Product Productos - Resistencia en microprocesador - Montaje de superficie | Heisener Electronics
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TE Connectivity Passive Product Productos - Resistencia en microprocesador - Montaje de superficie

Registros 15.287
Página  314/546
Imagen
Nº de pieza
Fabricantes
Descripción
Paquete
En existencias
Cantidad
Tolerance
Power (Watts)
Composition
Features
Temperature Coefficient
Operating Temperature
Package / Case
Supplier Device Package
Size / Dimension
Height - Seated (Max)
Number of Terminations
Failure Rate
CRGV2010F3M32
TE Connectivity Passive Product

RES SMD 3.32M OHM 1% 1/2W 2010

  • Resistance: 3.32 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
Paquete: 2010 (5025 Metric)
En existencias2.232
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F3M24
TE Connectivity Passive Product

RES SMD 3.24M OHM 1% 1/2W 2010

  • Resistance: 3.24 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
Paquete: 2010 (5025 Metric)
En existencias5.616
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F3M16
TE Connectivity Passive Product

RES SMD 3.16M OHM 1% 1/2W 2010

  • Resistance: 3.16 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
Paquete: 2010 (5025 Metric)
En existencias2.088
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F3M09
TE Connectivity Passive Product

RES SMD 3.09M OHM 1% 1/2W 2010

  • Resistance: 3.09 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
Paquete: 2010 (5025 Metric)
En existencias3.672
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F3M01
TE Connectivity Passive Product

RES SMD 3.01M OHM 1% 1/2W 2010

  • Resistance: 3.01 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
Paquete: 2010 (5025 Metric)
En existencias4.878
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F2M94
TE Connectivity Passive Product

RES SMD 2.94M OHM 1% 1/2W 2010

  • Resistance: 2.94 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
Paquete: 2010 (5025 Metric)
En existencias7.344
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F2M87
TE Connectivity Passive Product

RES SMD 2.87M OHM 1% 1/2W 2010

  • Resistance: 2.87 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
Paquete: 2010 (5025 Metric)
En existencias4.338
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F2M8
TE Connectivity Passive Product

RES SMD 2.8M OHM 1% 1/2W 2010

  • Resistance: 2.8 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
Paquete: 2010 (5025 Metric)
En existencias2.250
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F2M74
TE Connectivity Passive Product

RES SMD 2.74M OHM 1% 1/2W 2010

  • Resistance: 2.74 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
Paquete: 2010 (5025 Metric)
En existencias2.898
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F2M67
TE Connectivity Passive Product

RES SMD 2.67M OHM 1% 1/2W 2010

  • Resistance: 2.67 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
Paquete: 2010 (5025 Metric)
En existencias3.258
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F2M61
TE Connectivity Passive Product

RES SMD 2.61M OHM 1% 1/2W 2010

  • Resistance: 2.61 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
Paquete: 2010 (5025 Metric)
En existencias5.868
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F2M55
TE Connectivity Passive Product

RES SMD 2.55M OHM 1% 1/2W 2010

  • Resistance: 2.55 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
Paquete: 2010 (5025 Metric)
En existencias4.680
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F2M49
TE Connectivity Passive Product

RES SMD 2.49M OHM 1% 1/2W 2010

  • Resistance: 2.49 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
Paquete: 2010 (5025 Metric)
En existencias2.970
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F2M43
TE Connectivity Passive Product

RES SMD 2.43M OHM 1% 1/2W 2010

  • Resistance: 2.43 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
Paquete: 2010 (5025 Metric)
En existencias4.896
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F2M37
TE Connectivity Passive Product

RES SMD 2.37M OHM 1% 1/2W 2010

  • Resistance: 2.37 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
Paquete: 2010 (5025 Metric)
En existencias6.282
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F2M32
TE Connectivity Passive Product

RES SMD 2.32M OHM 1% 1/2W 2010

  • Resistance: 2.32 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
Paquete: 2010 (5025 Metric)
En existencias8.064
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F2M26
TE Connectivity Passive Product

RES SMD 2.26M OHM 1% 1/2W 2010

  • Resistance: 2.26 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
Paquete: 2010 (5025 Metric)
En existencias4.878
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F2M21
TE Connectivity Passive Product

RES SMD 2.21M OHM 1% 1/2W 2010

  • Resistance: 2.21 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
Paquete: 2010 (5025 Metric)
En existencias4.698
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F2M15
TE Connectivity Passive Product

RES SMD 2.15M OHM 1% 1/2W 2010

  • Resistance: 2.15 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
Paquete: 2010 (5025 Metric)
En existencias4.176
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F2M1
TE Connectivity Passive Product

RES SMD 2.1M OHM 1% 1/2W 2010

  • Resistance: 2.1 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
Paquete: 2010 (5025 Metric)
En existencias3.006
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F2M05
TE Connectivity Passive Product

RES SMD 2.05M OHM 1% 1/2W 2010

  • Resistance: 2.05 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
Paquete: 2010 (5025 Metric)
En existencias7.182
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F2M0
TE Connectivity Passive Product

RES SMD 2M OHM 1% 1/2W 2010

  • Resistance: 2 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
Paquete: 2010 (5025 Metric)
En existencias7.326
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F1M96
TE Connectivity Passive Product

RES SMD 1.96M OHM 1% 1/2W 2010

  • Resistance: 1.96 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
Paquete: 2010 (5025 Metric)
En existencias5.886
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F1M91
TE Connectivity Passive Product

RES SMD 1.91M OHM 1% 1/2W 2010

  • Resistance: 1.91 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
Paquete: 2010 (5025 Metric)
En existencias7.848
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F1M87
TE Connectivity Passive Product

RES SMD 1.87M OHM 1% 1/2W 2010

  • Resistance: 1.87 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
Paquete: 2010 (5025 Metric)
En existencias8.226
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F1M82
TE Connectivity Passive Product

RES SMD 1.82M OHM 1% 1/2W 2010

  • Resistance: 1.82 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
Paquete: 2010 (5025 Metric)
En existencias3.472
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F1M78
TE Connectivity Passive Product

RES SMD 1.78M OHM 1% 1/2W 2010

  • Resistance: 1.78 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
Paquete: 2010 (5025 Metric)
En existencias2.448
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F1M74
TE Connectivity Passive Product

RES SMD 1.74M OHM 1% 1/2W 2010

  • Resistance: 1.74 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
Paquete: 2010 (5025 Metric)
En existencias5.904
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-